Special Issue "Modeling, Testing and Reliability Issues in MEMS Engineering 2013"

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A special issue of Sensors (ISSN 1424-8220).

Deadline for manuscript submissions: closed (31 December 2013)

Special Issue Editor

Guest Editor
Dr. Stefano Mariani
Dipartimento di Ingegneria Civile e Ambientale, Politecnico di Milano, Piazza L. da Vinci 32, 20133 Milano, Italy
Website: http://www.dica.polimi.it/en/
E-Mail: stefano.mariani@polimi.it
Phone: +39 02 2399 4279
Fax: +39 02 2399 4300
Interests: MEMS; structural sensors; kalman filtering

Special Issue Information

Dear Colleagues,

Micro-electro-mechanical-systems (MEMS) are devices on a millimeter scale, with micro-resolution. Each MEMS is given by the integration of mechanical elements, sensors, actuators and electronics on a common silicon substrate, obtained through micro-fabrication technology.

MEMS are often designed to work in mobile devices, and are therefore subject during their life to accidental mechanical loadings. Because of the MEMS size, multi-scale analyses are sometimes required in reliability analysis. Furthermore, also thermal, electrical, magnetic and environmental actions should be accounted for in a fully coupled multi-physics modelling of the devices.

As for packaging, some technical problems caused to the devices are not yet thoroughly understood and solved. Since standards do not necessarily apply to packaged MEMS, new knowledge-based testing methodologies need to be proposed.

The aim of this special issue is to collect high quality research results on all these aspects of MEMS engineering.

Dr. Stefano Mariani
Guest Editor

Submission

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. Papers will be published continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are refereed through a peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed Open Access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs).


Keywords

  • micro-electro-mechanical-systems
  • multi-scale and multi-physics modeling
  • micro-fluidics
  • failure analysis
  • reliability analysis
  • package engineering

Related Special Issue

Published Papers (29 papers)

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p. 17089-17111
by , ,  and
Sensors 2014, 14(9), 17089-17111; doi:10.3390/s140917089
Received: 1 April 2014; in revised form: 5 September 2014 / Accepted: 9 September 2014 / Published: 15 September 2014
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 12149-12173
by  and
Sensors 2014, 14(7), 12149-12173; doi:10.3390/s140712149
Received: 9 January 2014; in revised form: 28 May 2014 / Accepted: 4 June 2014 / Published: 8 July 2014
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 11855-11877
by  and
Sensors 2014, 14(7), 11855-11877; doi:10.3390/s140711855
Received: 2 March 2014; in revised form: 21 April 2014 / Accepted: 30 April 2014 / Published: 4 July 2014
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 4755-4790
by , , , , ,  and
Sensors 2014, 14(3), 4755-4790; doi:10.3390/s140304755
Received: 1 November 2013; in revised form: 18 February 2014 / Accepted: 24 February 2014 / Published: 10 March 2014
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
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p. 4177-4188
by ,  and
Sensors 2014, 14(3), 4177-4188; doi:10.3390/s140304177
Received: 28 December 2013; in revised form: 13 February 2014 / Accepted: 26 February 2014 / Published: 3 March 2014
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 3172-3187
by , ,  and
Sensors 2014, 14(2), 3172-3187; doi:10.3390/s140203172
Received: 25 December 2013; in revised form: 17 January 2014 / Accepted: 8 February 2014 / Published: 18 February 2014
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 1680-1690
by  and
Sensors 2014, 14(1), 1680-1690; doi:10.3390/s140101680
Received: 30 October 2013; in revised form: 27 December 2013 / Accepted: 8 January 2014 / Published: 17 January 2014
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 834-847
by , , , , ,  and
Sensors 2014, 14(1), 834-847; doi:10.3390/s140100834
Received: 29 September 2013; in revised form: 16 December 2013 / Accepted: 25 December 2013 / Published: 6 January 2014
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 16360-16371
by ,  and
Sensors 2013, 13(12), 16360-16371; doi:10.3390/s131216360
Received: 30 September 2013; in revised form: 21 November 2013 / Accepted: 22 November 2013 / Published: 28 November 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 16281-16291
by , , ,  and
Sensors 2013, 13(12), 16281-16291; doi:10.3390/s131216281
Received: 30 August 2013; in revised form: 4 November 2013 / Accepted: 20 November 2013 / Published: 27 November 2013
Show/Hide Abstract | Cited by 1 | PDF Full-text (958 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
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p. 16090-16104
by , ,  and
Sensors 2013, 13(12), 16090-16104; doi:10.3390/s131216090
Received: 30 September 2013; in revised form: 12 November 2013 / Accepted: 18 November 2013 / Published: 26 November 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 15880-15897
by ,  and
Sensors 2013, 13(12), 15880-15897; doi:10.3390/s131215880
Received: 9 September 2013; in revised form: 4 November 2013 / Accepted: 8 November 2013 / Published: 25 November 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 15785-15804
by , , ,  and
Sensors 2013, 13(11), 15785-15804; doi:10.3390/s131115785
Received: 26 August 2013; in revised form: 4 November 2013 / Accepted: 7 November 2013 / Published: 19 November 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 15138-15158
by , , ,  and
Sensors 2013, 13(11), 15138-15158; doi:10.3390/s131115138
Received: 7 September 2013; in revised form: 22 October 2013 / Accepted: 22 October 2013 / Published: 6 November 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 14728-14739
by ,  and
Sensors 2013, 13(11), 14728-14739; doi:10.3390/s131114728
Received: 13 September 2013; in revised form: 24 October 2013 / Accepted: 28 October 2013 / Published: 29 October 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 13978-13997
by  and
Sensors 2013, 13(10), 13978-13997; doi:10.3390/s131013978
Received: 23 July 2013; in revised form: 2 October 2013 / Accepted: 8 October 2013 / Published: 16 October 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 13521-13542
by  and
Sensors 2013, 13(10), 13521-13542; doi:10.3390/s131013521
Received: 16 August 2013; in revised form: 24 September 2013 / Accepted: 25 September 2013 / Published: 9 October 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
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p. 13543-13559
by  and
Sensors 2013, 13(10), 13543-13559; doi:10.3390/s131013543
Received: 6 August 2013; in revised form: 16 September 2013 / Accepted: 8 October 2013 / Published: 9 October 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 13178-13191
by , , , ,  and
Sensors 2013, 13(10), 13178-13191; doi:10.3390/s131013178
Received: 2 August 2013; in revised form: 5 September 2013 / Accepted: 11 September 2013 / Published: 30 September 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 12482-12496
by , , , ,  and
Sensors 2013, 13(9), 12482-12496; doi:10.3390/s130912482
Received: 4 July 2013; in revised form: 19 August 2013 / Accepted: 11 September 2013 / Published: 17 September 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 12192-12217
by , , ,  and
Sensors 2013, 13(9), 12192-12217; doi:10.3390/s130912192
Received: 28 June 2013; in revised form: 11 August 2013 / Accepted: 5 September 2013 / Published: 12 September 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
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p. 11280-11288
by , ,  and
Sensors 2013, 13(9), 11280-11288; doi:10.3390/s130911280
Received: 20 June 2013; in revised form: 19 August 2013 / Accepted: 22 August 2013 / Published: 23 August 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 11184-11195
by ,  and
Sensors 2013, 13(9), 11184-11195; doi:10.3390/s130911184
Received: 19 July 2013; in revised form: 12 August 2013 / Accepted: 16 August 2013 / Published: 22 August 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 11229-11242
by , , ,  and
Sensors 2013, 13(9), 11229-11242; doi:10.3390/s130911229
Received: 14 June 2013; in revised form: 13 August 2013 / Accepted: 15 August 2013 / Published: 22 August 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 11051-11068
by ,  and
Sensors 2013, 13(8), 11051-11068; doi:10.3390/s130811051
Received: 27 June 2013; in revised form: 15 July 2013 / Accepted: 3 August 2013 / Published: 21 August 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 10550-10560
by , ,  and
Sensors 2013, 13(8), 10550-10560; doi:10.3390/s130810550
Received: 22 June 2013; in revised form: 3 August 2013 / Accepted: 9 August 2013 / Published: 14 August 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
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p. 9549-9588
by , , ,  and
Sensors 2013, 13(8), 9549-9588; doi:10.3390/s130809549
Received: 22 May 2013; in revised form: 17 July 2013 / Accepted: 20 July 2013 / Published: 24 July 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 8977-8996
by , , , ,  and
Sensors 2013, 13(7), 8977-8996; doi:10.3390/s130708977
Received: 21 May 2013; in revised form: 2 July 2013 / Accepted: 8 July 2013 / Published: 12 July 2013
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)
p. 2359-2367
by , ,  and
Sensors 2013, 13(2), 2359-2367; doi:10.3390/s130202359
Received: 31 December 2012; in revised form: 6 February 2013 / Accepted: 7 February 2013 / Published: 8 February 2013
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Last update: 4 November 2013

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