Special Issue "Modeling, Testing and Reliability Issues in MEMS Engineering 2011"
A special issue of Micromachines (ISSN 2072-666X).
Deadline for manuscript submissions: closed (15 December 2011)
Dr. Stefano Mariani
Dipartimento di Ingegneria Civile e Ambientale, Politecnico di Milano, Piazza L. da Vinci 32, 20133 Milano, Italy
Phone: +39 02 2399 4279
Fax: +39 02 2399 4300
Interests: MEMS; structural sensors; kalman filtering
Micro-electro-mechanical-systems (MEMS) are devices on a millimeter scale, with micro-resolution. Each MEMS is given by the integration of mechanical elements, sensors, actuators and electronics on a common silicon substrate, obtained through micro-fabrication technology.
MEMS are often designed to work in mobile devices, and are therefore subject during their life to accidental mechanical loadings. Because of the MEMS size, multi-scale analyses are sometimes required in reliability analysis. Furthermore, also thermal, electrical, magnetic and environmental actions should be accounted for in a fully coupled multi-physics modelling of the devices.
As for packaging, some technical problems caused to the devices are not yet thoroughly understood and solved. Since standards do not necessarily apply to packaged MEMS, new knowledge-based testing methodologies need to be proposed.
Related Special Issues in other Journals
- multi-scale and multi-physics modeling
- failure analysis
- reliability analysis
- package engineering
Micromachines 2011, 2(4), 385-393; doi:10.3390/mi2040385
Received: 13 September 2011; in revised form: 15 October 2011 / Accepted: 15 October 2011 / Published: 21 October 2011| Download PDF Full-text (681 KB) | Download XML Full-text
Last update: 27 February 2014