Special Issue "Modeling, Testing and Reliability Issues in MEMS Engineering 2011"

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A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: closed (15 December 2011)

Special Issue Editor

Guest Editor
Dr. Stefano Mariani
Dipartimento di Ingegneria Civile e Ambientale, Politecnico di Milano, Piazza L. da Vinci 32, 20133 Milano, Italy
Website: http://www.dica.polimi.it/en/
E-Mail: stefano.mariani@polimi.it
Phone: +39 02 2399 4279
Fax: +39 02 2399 4300
Interests: MEMS; structural sensors; kalman filtering

Special Issue Information

Dear Colleagues,

Micro-electro-mechanical-systems (MEMS) are devices on a millimeter scale, with micro-resolution. Each MEMS is given by the integration of mechanical elements, sensors, actuators and electronics on a common silicon substrate, obtained through micro-fabrication technology.

MEMS are often designed to work in mobile devices, and are therefore subject during their life to accidental mechanical loadings. Because of the MEMS size, multi-scale analyses are sometimes required in reliability analysis. Furthermore, also thermal, electrical, magnetic and environmental actions should be accounted for in a fully coupled multi-physics modelling of the devices.

As for packaging, some technical problems caused to the devices are not yet thoroughly understood and solved. Since standards do not necessarily apply to packaged MEMS, new knowledge-based testing methodologies need to be proposed.

Dr. Stefano Mariani
Guest Editor

Keywords

  • micro-electro-mechanical-systems
  • multi-scale and multi-physics modeling
  • micro-fluidics
  • failure analysis
  • reliability analysis
  • package engineering

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Published Papers (1 paper)

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p. 385-393
by ,  and
Micromachines 2011, 2(4), 385-393; doi:10.3390/mi2040385
Received: 13 September 2011; in revised form: 15 October 2011 / Accepted: 15 October 2011 / Published: 21 October 2011
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Last update: 7 August 2014

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