E-Mail Alert

Add your e-mail address to receive forthcoming issues of this journal:

Journal Browser

Journal Browser

Special Issue "Modeling, Testing and Reliability Issues in MEMS Engineering 2011"

Quicklinks

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: closed (15 December 2011)

Special Issue Editor

Guest Editor
Dr. Stefano Mariani

Department of Civil and Environmental Engineering, Politecnico di Milano, Piazza L. da Vinci 32, 20133 Milano, Italy
Website | E-Mail
Phone: +39-0223994279
Fax: +39-0223994300
Interests: MEMS; structural sensors; Kalman filtering

Special Issue Information

Dear Colleagues,

Micro-electro-mechanical-systems (MEMS) are devices on a millimeter scale, with micro-resolution. Each MEMS is given by the integration of mechanical elements, sensors, actuators and electronics on a common silicon substrate, obtained through micro-fabrication technology.

MEMS are often designed to work in mobile devices, and are therefore subject during their life to accidental mechanical loadings. Because of the MEMS size, multi-scale analyses are sometimes required in reliability analysis. Furthermore, also thermal, electrical, magnetic and environmental actions should be accounted for in a fully coupled multi-physics modelling of the devices.

As for packaging, some technical problems caused to the devices are not yet thoroughly understood and solved. Since standards do not necessarily apply to packaged MEMS, new knowledge-based testing methodologies need to be proposed.

Dr. Stefano Mariani
Guest Editor

Keywords

  • micro-electro-mechanical-systems
  • multi-scale and multi-physics modeling
  • micro-fluidics
  • failure analysis
  • reliability analysis
  • package engineering

Related Special Issue

Published Papers (1 paper)

View options order results:
result details:
Displaying articles 1-1
Export citation of selected articles as:

Research

Open AccessArticle Modeling of the Response Time of Thermal Flow Sensors
Micromachines 2011, 2(4), 385-393; doi:10.3390/mi2040385
Received: 13 September 2011 / Revised: 15 October 2011 / Accepted: 15 October 2011 / Published: 21 October 2011
Cited by 6 | PDF Full-text (681 KB) | HTML Full-text | XML Full-text
Abstract
This paper introduces a simple theoretical model for the response time of thermal flow sensors. Response time is defined here as the time needed by the sensor output signal to reach 63.2% of amplitude due to a change of fluid flow. This model
[...] Read more.
This paper introduces a simple theoretical model for the response time of thermal flow sensors. Response time is defined here as the time needed by the sensor output signal to reach 63.2% of amplitude due to a change of fluid flow. This model uses the finite-difference method to solve the heat transfer equations, taking into consideration the transient conduction and convection between the sensor membrane and the surrounding fluid. Program results agree with experimental measurements and explain the response time dependence on the velocity and the sensor geometry. Values of the response time vary from about 5 ms in the case of stagnant flow to 1.5 ms for a flow velocity of 44 m/s. Full article
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2011)

Journal Contact

MDPI AG
Micromachines Editorial Office
St. Alban-Anlage 66, 4052 Basel, Switzerland
micromachines@mdpi.com
Tel. +41 61 683 77 34
Fax: +41 61 302 89 18
Editorial Board
Contact Details Submit to Micromachines
Back to Top