Topic Editors

Dr. Chao Cai
College of Life Science and Technology, Huazhong University of Science and Technology, Wuhan, China
Dr. Zhe Chen
School of Computer Science, Fudan University, Shanghai, China

Intelligent Sensing Materials and Devices

Abstract submission deadline
29 February 2028
Manuscript submission deadline
30 April 2028
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72

Topic Information

Dear Colleagues,

Recent breakthroughs in sensing‑related materials, device architectures, embedded electronics, and artificial intelligence have given rise to modern intelligent sensing systems that can perceive, process, and understand complex physical, chemical, and biological phenomena. These developments are driving transformative applications in healthcare, environmental monitoring, industrial inspection, smart manufacturing, human–machine interaction, robotics, and the Internet of Things.

This Topic aims to provide a platform for researchers working on innovative sensing materials, sensor devices, sensing systems, signal processing methods, and intelligent sensing algorithms. We welcome submissions stemming from both fundamental investigations and practical application‑driven studies. Topics of interest include, but are not limited to, newly developed sensing materials, flexible and wearable sensors, MEMS and microelectronic devices, optical and ultrasonic sensing, wireless sensing solutions, multimodal sensing systems, edge intelligence, machine learning for sensing, sensor fusion, low-power sensing hardware, and advanced signal processing techniques.

By connecting researchers from materials science, electronic engineering, computer science, biomedical engineering, and other cross‑cutting fields, this Topic hopes to promote interdisciplinary collaborative innovation and accelerate the development of next-generation intelligent sensing technologies.

Dr. Chao Cai
Dr. Zhe Chen
Topic Editors

Keywords

  • intelligent sensing
  • sensor devices
  • sensing materials
  • flexible electronics
  • wireless sensing
  • acoustic sensing
  • ultrasonic sensing
  • edge intelligence
  • machine learning for sensing
  • sensor fusion

Participating Journals

Journal Name Impact Factor CiteScore Launched Year First Decision (median) APC
Biosensors
biosensors
6.2 12.1 2011 17.3 Days CHF 2200 Submit
Electronics
electronics
2.9 7.0 2012 14.8 Days CHF 2400 Submit
Journal of Low Power Electronics and Applications
jlpea
1.7 4.6 2011 21.8 Days CHF 1800 Submit
Materials
materials
3.7 7.0 2008 14.4 Days CHF 2600 Submit
Nanomaterials
nanomaterials
4.8 10.3 2010 12.5 Days CHF 2400 Submit
Sensors
sensors
4.0 9.4 2001 17.8 Days CHF 2600 Submit

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Published Papers

This Topic is now open for submission.
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