Search Results (85)

Millisecond lasers, with their high processing efficiency and large power, are widely used in manufacturing fields such as aerospace. This study aims to investigate the effects of different processing parameters on the micro-hole processing of 316 heat-resistant steel using millisecond lasers. Through the control variable method, the study examines the impact of pulse energy, pulse count, and pulse width on the quality of micro-holes, including the entrance diameter, exit diameter, and taper. Furthermore, combined with orthogonal experiments and COMSOL Multiphysics 6.2 simulations, the study explores the influence of pulse width on the formation of blind holes. The experimental results show that when the pulse energy is 2.2 J, the taper is minimal (2.2°), while the taper reaches its peak (2.4°) at 2.4 J pulse energy. As the pulse count increases to 55–60 pulses, the exit diameter stabilizes, and the taper decreases to 1.8°. Blind holes begin to form when the pulse width exceeds 1.2 ms. When the pulse width is 1.2 ms, pulse energy is 2.4 J, and pulse count is 50, the entrance diameter of the blind hole reaches its maximum, indicating that longer pulse widths result in more significant energy reflection and thermal accumulation effects. COMSOL simulations reveal that high-energy pulses cause intense melt ejection, while longer pulse widths exacerbate thermal accumulation at the micro-hole entrance, leading to blind hole formation. This study provides important process references for laser processing of through-holes and blind holes in heat-resistant steel. Full article

Fly-ash-based bubble lightweight soil is widely used due to its environmental friendliness, load reduction, ease of construction, and low costs. In this study, 41 sets of 28 d compressive strength data on lightweight soils with different water–cement ratios, blowing agent dosages, and fly ash dosages were collected through a literature search and indoor tests. Using the compressive strength index and SEM tests, the correlation between the mix ratio design and the microscopic particle components was investigated. The findings were as follows: carbonation reactions occurred in lightweight soil during the maintenance process, and the particles were spherical; increasing the dosage of blowing agent increased the soil’s porosity and pore diameter, leading to the formation of through-holes and reducing the compressive strength and mobility; increasing the fly ash dosage and water–cement ratio increased the soil’s mobility but reduced its compressive strength; and the strength decreased significantly when the fly ash dosage was more than 16% (e.g., the strength at a 20% dosage was 17.8% lower than that at a 15% dosage). Feature importance analysis showed that the water–cement ratio (57.7%), fly ash dosage (30.9%), and blowing agent dosage (11.1%) had a significant effect on strength. ExtraTrees, LightGBM, and Bayesian-optimized Random Forest models were used for 28d strength prediction with coefficients of determination (R²) of 0.695, 0.731, and 0.794, respectively. The Bayesian-optimized Random Forest model performed optimally in terms of the mean square error (MSE), root mean square error (RMSE), and mean absolute error (MAE), and the prediction performance was best. The accuracy of the model is expected to be further improved with expansions in the database. A 28 d compressive strength prediction platform for fly-ash-based bubble lightweight soil was ultimately developed, providing a convenient tool for researchers and engineers to predict material properties and mix ratios. Full article

Porous ceramics have been widely used in various fields. In this paper, porous ceramics with through-hole structures were prepared using a novel and eco-friendly gel casting method with carrageenan as the gelling agent. Especially, the idea of large size particle stacking is introduced into the gel casting process. By introducing large size alumina aggregates as raw materials, and small size micropowders as filling materials, micropores were directly formed after the green body was sintered. To tune the pore size, pore structure, gas permeability, the strength of the final porous ceramics, the components of the raw materials including the alumina aggregates, the filling materials, and sintering additives in the slurry were precisely designed. Porous Al₂O₃-based ceramics with high gas permeability, high flexural strength, and moderate porosity were finally obtained. Full article

In this paper, a novel through-silicon via (TSV) fabrication strategy based on through-hole structures is proposed for low-cost and low-complexity manufacturing. Compared to conventional TSV fabrication processes, this method significantly simplifies the process flow by employing double-sided liner deposition, double-sided barrier layer/seed layer formation, and double-sided Cu electroplating. This method enhances the TSV stability by eliminating Cu contamination issues during chemical–mechanical polishing (CMP), which are a common challenge in traditional blind via fabrication processes. Additionally, the liner and barrier layer/seed layer achieve a high step coverage exceeding 80%, ensuring excellent conformality and structural integrity. For electroplating, a multi-stage bi-directional electroplating technique is introduced to enable void-free Cu filling in TSVs. The fabricated TSVs exhibit an ultra-low leakage current of 135 fA at 20 V, demonstrating their potential for advancing 3D integration technologies in heterogeneous integration. Full article

The increasing demand for emerging applications like IoT or drones has boosted the interest of industry and academia in DC-DC converters. Due to their high performance, non-isolated buck DC-DC converters have become one of the most common configurations for covering the power demand of portable devices. The current trend focuses on manufacturing these integrated circuits (IC) using surface-mount technology packaging. However, this technology presents disadvantages compared to through-hole devices in pursuing a quick functional circuit. This work aims to guide designers in choosing the most suitable integrated THT buck converter to develop a fast prototype. A comparative market analysis was conducted considering five integrated chip manufacturers to identify the most adequate ICs for this purpose. Then, a comparative experimental study focused on the buck converter LM2576-ADJ by Texas Instruments was carried out. The analysis aims to determine the performance of this IC mounted in a breadboard and stripboard compared to a demonstration board based on SMT technology provided by the manufacturer. Despite their shortcomings, these quick implementations performed remarkably well regarding, among others, line regulation and load regulation (0.37% and –0.33%, respectively), as well as efficiency (up to 79.9%), which indicates that their electrical response was not compromised. Full article

Three-dimensional Mechatronic Integrated Devices (3D-MIDs) combine mechanical and electrical functions, enabling significant component miniaturization and enhanced functionality. However, their application in high-temperature environments remains limited due to material challenges. Existing research highlights the thermal stability of ceramic substrates; yet, their reliability under high-stress and complex mechanical loading conditions remains a challenge. In this study, 3D-MID components were fabricated using stereolithography (SLA) 3D-printing technology, and the feasibility of circuit miniaturization on high-temperature-resistant resin substrates was explored. Additionally, the influence of laser parameters on resistance values was analyzed using the Response Surface Methodology (RSM). The results demonstrate that SLA 3D-printing achieves substrates with low surface roughness, enabling the precise formation of fine features. Electric circuits are successfully formed on substrates printed with resin mixed with Laser Direct Structuring (LDS) additives, following laser structuring and metallization processes, with a minimum conductor spacing of 150 µm. Furthermore, through the integration of through-holes (vias) and the use of smaller package chips, such as Ball Grid Array (BGA) and Quad Flat No-lead (QFN), the circuits achieve further miniaturization and establish reliable electrical connections via soldering. Taken together, our results demonstrate that thermoset plastics serve as substrates for 3D-MID components, broadening the application scope of 3D-MID technology and providing a framework for circuit miniaturization on SLA-printed substrates. Full article

Despite major advances in the field of actuator technology for microsystems, miniaturized microfluidic actuation systems for mobile devices are still not common in the market. We present a micropump concept and an associated mass flow sensor design, which, in combination, have the potential to form the basis for an integrated microfluidic development platform for microfluidic systems in general and microdosing systems in particular. The micropump combines the use of active valves with an electrostatic drive principle for the pump membrane and the valves, respectively. With a size of only 1.86 mm × 1.86 mm × 0.3 mm, the first prototypes are capable of pumping gaseous media at flow rates of up to 110 μL/min. A specific feature of the presented micropump is that the pumping direction is perpendicular to the chip surface. The corresponding flow sensor combines the principle of hot-wire anemometry with a very small footprint of only 1.4 mm × 1.4 mm × 0.4 mm. The main innovation is that the hot wires are fixed inside a through-hole in the substrate of the microchip, so that the flow direction of the fluid to be measured is perpendicular to the chip surface, which enables direct integration with the presented micropump. Detection thresholds of around 10 μL/min and measuring ranges of up to 20 mL/min can be achieved with the first prototypes, without dedicated evaluation electronics. Full article

Small-hole components of Inconel 718 are widely used in aerospace engineering, medical devices, and other fields. Limited by material properties, its machining efficiency seriously restricts its wide application. The objective of this study is to investigate a novel machining technique for Inconel 718 that integrates ultrasonic machining (UM) and hydrogen embrittlement (HE) treatment. Accordingly, the technique is designated as hydrogen embrittlement-enhanced ultrasonic machining (HEUM). Prior to machining, a stress layer is formed on the surface of the workpiece. To ascertain the fundamental characteristics of Inconel 718, the influences of ultrasonic amplitude, HE time, and HE voltage on the specific material removal rate and surface roughness in the presence of HE were empirically examined. To investigate the material removal process for HEUM, the nanoscratch test and nanoindenter were also conducted with HE samples. Further, the subsurface for HEUAG samples were obtained with SEM. The specific material removal rate under experimental conditions of 10 min and 5 V HE increased by 27.4%. Finally, HEUM is proposed to be used for a 1 mm through-hole with Ra 0.318 μm. A precision hole with a diameter as small as 0.5 mm has been manufactured. Full article

The purpose of the presented research was to determine the suitability of using ultrasonic testing (UT) to inspect heterogeneous, from a material point of view, welded joints on the example of the joints of a ferritic steel element with elements made of an austenitic steel. The echo technique with transverse (SEK) and longitudinal wave heads (SEL) addressed this issue. Due to the widespread use of 13CrMo4-5 and X2CrNiMo17-12-2 steel grades in the energy industry, they were selected as the test materials for the study. The objects of the presented research were welded joint specimens with thicknesses of 8, 12, and 16 mm and dimensions of 300 × 300 mm, made using the 135 metal active gas (MAG) process with the use of the Lincoln 309LSi wire—a ferritic–austenitic filler material. The stages of the research task were (1) making distance–amplitude curve (DAC) patterns from the test materials; (2) preparation of specimens of welded joints with artificial discontinuities in the form of through-holes; (3) performing UT tests on welded joints with artificial discontinuities using heads with 60° and 70° angles for the transverse wave and angle heads for longitudinal waves with similar beam insertion angles; (4) selection, by radiographic testing (RT), of welded joint specimens with natural discontinuities in the form of a lack of sidewall fusion; (5) performing UT tests on welded joints with natural discontinuities, using heads as welded joints with artificial discontinuities. It was found that (1) the highest sensitivity of discontinuity detection was obtained by performing tests on the ferritic steel side, which is due to the lower attenuation of the ultrasonic wave propagating in ferritic steel compared to austenitic steel; (2) the best detection of discontinuities could be obtained using a longitudinal ultrasonic wave; (3) there is a relationship between the thickness of the welded elements, the angle of the ultrasonic beam introduction, and the effectiveness of discontinuity detection. Full article

For commercial processes, through-hole AAO membranes are fabricated from high-purity aluminum by chemical etching. However, this method has the disadvantages of using heavy-metal solutions, creating large amounts of material waste, and leading to an irregular pore structure. Through-hole porous alumina membrane fabrication has been widely investigated due to applications in filters, nanomaterial synthesis, and surface-enhanced Raman scattering. There are several means to obtain freestanding through-hole AAO membranes, but a fast, low-cost, and repetitive process to create complete, high-quality membranes has not yet been established. Here, we propose a rapid and efficient method for the multi-detachment of an AAO membrane at room temperature by integrating the one-time potentiostatic (OTP) method and two-step electrochemical polishing. Economical commercial AA1050 was used instead of traditional high-cost high-purity aluminum for AAO membrane fabrication at 25 °C. The OTP method, which is a single-step process, was applied to achieve a high-quality membrane with unimodal pore distribution and diameters between 35 and 40 nm, maintaining a high consistency over five repetitions. To repeatedly detach the AAO membrane, two-step electrochemical polishing was developed to minimize damage on the AA1050 substrate caused by membrane separation. The mechanism for creating AAO membranes using the OTP method can be divided into three major components, including the Joule heating effect, the dissolution of the barrier layer, and stress effects. The stress is attributed to two factors: bubble formation and the difference in the coefficient of thermal expansion between the AAO membrane and the Al substrate. This highly efficient AAO membrane detachment method will facilitate the rapid production and applications of AAO films. Full article

Rock bolting is a commonly used method for stabilizing the surrounding rock in coal-mine roadways. It involves installing rock bolts after drilling, which penetrate unstable rock layers, binding loose rocks together, enhancing the stability of the surrounding rock, and controlling its deformation. Although recent progress in drilling and anchoring equipment has significantly enhanced the efficiency of roof support in coal mines and improved safety measures, how to deal with drilling rigs’ misalignment with the through-hole center remains a big issue, which may potentially compromise the quality of drilling and consequently affect the effectiveness of bolt support or even result in failure. To address this challenge, this article presents a robotic teleoperation system alongside a hybrid visual servo control strategy. Addressing the demand for high precision and efficiency in aligning the drilling rigs with the center of the drilling hole, a hybrid control strategy is introduced combining position-based and image-based visual servo control. The former facilitates an effective approach to the target area, while the latter ensures high-precision alignment with the center of the drilling hole. The robot teleoperation system employs the binocular vision measurement system to accurately determine the position and orientation of the drilling-hole center, which serves as the designated target position for the drilling rig. Leveraging the displacement and angle sensor information installed on each joint of the manipulator, the system utilizes the kinematic model of the manipulator to compute the spatial position of the end-effector. It dynamically adjusts the spatial pose of the end-effector in real time, aligning it with the target position relative to its current location. Additionally, it utilizes monocular vision information to fine-tune the movement speed and direction of the end-effector, ensuring rapid and precise alignment with the target drilling-hole center. Experimental results demonstrate that this method can control the maximum alignment error within 7 mm, significantly enhancing the alignment accuracy compared to manual control. Compared with the manual control method, the average error of this method is reduced by 41.2%, and the average duration is reduced by 4.3 s. This study paves a new path for high-precision drilling and anchoring of tunnel roofs, thereby improving the quality and efficiency of roof support while mitigating the challenges associated with significant errors and compromised safety during manual control processes. Full article

Neurodegenerative disorders cause most physical and mental disabilities, and therefore require effective treatment. The blood–brain barrier (BBB) prevents drug molecules from crossing from the blood to the brain, making brain drug delivery difficult. Implantable devices could provide sustained and regulated medication to solve this problem. Two electrolytes (0.3 M oxalic acid and 0.3 M sulphuric acid) were used to anodise Al₂O₃ nanoporous membranes, followed by a third anodisation in concentrated H₂SO₄ to separate the through-hole membranes from the aluminium substrate. FTIR, AFM, and SEM/EDX were used to characterise the membranes’ structure and morphology. The effects of the anodisation time and electrolyte type on the AAO layer pore density, diameter, interpore distance, and thickness were examined. As a model drug for neurodegenerative disorders, donepezil hydrochloride (DHC) was loaded onto thin alumina nanoporous membranes. The DHC release profiles were characterised at two concentrations using a UV–Vis spectrophotometer. Oxalic acid membranes demonstrated an average pore diameter of 39.6–32.5 nm, which was two times larger than sulphuric acid membranes (22.6–19.7 nm). After increasing the anodisation time from 3 to 5 h, all of the membranes showed a reduction in pore diameter that was stable regardless of the electrolyte type or period. Drug release from oxalic acid-fabricated membranes was controlled and sustained for over 2 weeks. Thus, nanoporous membranes as implantable drug delivery systems could improve neurodegenerative disease treatment. Full article

High-density polyethylene (HDPE) pipes are widely used for urban natural gas transportation. Pipes are usually welded using the technique of thermal butt fusion, which is prone to manufacturing defects that are detrimental to safe operation. This paper proposes a spatiotemporal singular value decomposition preprocessing improved total focusing method (STSVD-ITFM) imaging algorithm combined with ultrasonic phased array technology for non-destructive testing. That is, the ultrasonic real-value signal data are first processed using STSVD filtering, enhancing the spatiotemporal singular values corresponding to the defective signal components. The TFM algorithm is then improved by establishing a composite modification factor based on the directivity function and the corrected energy attenuation factor by adding angle variable. Finally, the filtered signal data are utilized for imaging. Experiments are conducted by examining specimen blocks of HDPE materials with through-hole defects. The results show the following: the STSVD-ITFM algorithm proposed in this paper can better suppress static clutter in the near-field region, and the average signal-to-noise ratios are all higher than the TFM algorithm. Moreover, the STSVD-ITFM algorithm has the smallest average error among all defect depth quantification results. Full article

A wide-angle scanning phased array with dual circular polarization in the Ka-band is presented in this paper. To improve the scanning capability of the phased array, the microstrip element is modified by loading many metal posts at its center and periphery. In addition, a stripline coupler is designed to achieve dual circularly polarized (CP) radiation, and the inner conductor of the subminiature micro-push-on (SSMP) connectors for feeding the coupler is extended to the top layer of the multilayer element by introducing an open stub, which simplifies the assembly process between the SSMP connector and multilayer printed circuit board (PCB) due to through-hole soldering instead of blind-hole soldering. The proposed element can cover a frequency range from 28 GHz to 30.5 GHz with a relative bandwidth of 8.5% in the Ka-band. An 8 × 8 phased array is constructed based on this proposed element, and a wide-angle scanning range from −65° to +65° is obtained for the dual circular polarization. The proposed array has a gain fluctuation of 5.1 dB and an axial ratio (AR) of less than 3.3 dB during beam-steering. The prototype is fabricated and measured, with a good agreement between the measured and simulated results. The proposed phased array can be applied in a Ka-band millimeter-wave (MMW) communication system. Full article

To meet the demand for higher performance and wearability, integrated circuits are developing towards having multilayered structures and greater flexibility. However, traditional circuit fabrication methods using etching and lamination processes are not compatible with flexible substrates. As a non-contact printing method in additive manufacturing, electrohydrodynamic printing possesses advantages such as environmental friendliness, sub-micron manufacturing, and the capability for flexible substrates. However, the interconnection and insulation of different conductive layers become significant challenges. This study took composite silver ink as a conductive material to fabricate a circuit via electrohydrodynamic printing, applied polyimide spraying to achieve interlayer insulation, and drilled micro through-holes to achieve interlayer interconnection. A 200 × 200 mm² ten-layer flexible circuit was thus prepared. Furthermore, we combined a finite element simulation with reliability experiments, and the prepared ten-layer circuit was found to have excellent bending resistance and thermal cycling stability. This study provides a new method for the manufacturing of low-cost, large-sized, multilayer flexible circuits, which can improve circuit performance and boost the development of printed electronics. Full article