Search Results (45)

High-power laser diodes (HPLDs) are increasingly used in space applications, yet solder layer (SL) reliability critically limits their performance and lifespan. This study employs finite element analysis to evaluate SL failure mechanisms in microchannel-cooled HPLDs with two packaging configurations under thermal cycling and vibration. Based on the Anand constitutive model, contour plot analysis revealed that the critical stress–strain regions in both SLs were located at their edges. The stress–strain values along the X-axis of the SLs exceeded those in other axial directions, and SL failure would preferentially initiate from the edges along the cavity length direction. During random vibration analysis with excitation applied along the Z-axis, the equivalent stresses in both SLs exceeded X-/Y-axis levels. However, these values remained far below their yield strengths, indicating that only elastic strain and high-cycle fatigue occurred in the SLs. The calculated thermal fatigue lives of the two SLs were 2851 cycles and 5730 cycles, respectively. Their random vibration fatigue lives were determined as 5.75 × 10⁷ h and 8.31 × 10⁷ h. Using damage superposition under combined thermal-vibration loading, the total fatigue lives were predicted as 14,821 h and 29,786 h, respectively, with thermal cycling-induced damage dominating the failure mechanism. Full article

This study presents the optimization of a laser ablation process designed to achieve the precise removal of polyamide coatings from ultra-thin platinum wires. Removing polymer coatings is a critical challenge in high-reliability manufacturing processes such as aerospace thermocouple fabrication. The ablation process must not only ensure the complete removal of the polyamide insulation but also maintain the tensile strength of the wire to withstand mechanical handling in subsequent manufacturing stages. Additionally, the exposed platinum surface must exhibit low surface roughness to enable effective soldering and be free of thermal damage or residual debris to pass strict visual inspections. The wires have a total diameter of 65 µm, consisting of a 50 µm platinum core encased in a 15 µm polyamide coating. By utilizing a UV laser with a wavelength of 355 nm, average power of 3 W, a repetition rate range of 20 to 200 kHz, and a high-speed marking system, the process parameters were systematically refined. Initial attempts to perform the ablation in an air medium were unsuccessful due to inadequate thermal control and incomplete removal of the polyamide coating. Hence, a water-assisted ablation technique was explored to address these limitations. Experimental results demonstrated that a scanning speed of 1200 mm/s, coupled with a line spacing of 1 µm and a single ablation pass, resulted in complete coating removal while ensuring the integrity of the platinum substrate. The incorporation of a water layer above the ablation region was considered crucial for effective heat dissipation, preventing substrate overheating and ensuring uniform ablation. The laser’s spot diameter of 20 µm in air and a focal length of 130 mm introduced challenges related to overlap control between successive passes, requiring precise calibration to maintain consistency in coating removal. This research demonstrates the feasibility and reliability of water-assisted laser ablation as a method for a high-precision, non-contact coating material. Full article

In this study, an interconnection was formed between a Cu/SnAg pillar bump and an Ni-less surface-treated Cu pad through laser-assisted bonding (LAB), and its bonding characteristics were evaluated. The LAB process influences the bond quality and mechanical strength based on the laser irradiation time and laser power density. The growth of the intermetallic compound (IMC) in the joint cross-section was observed via FE-SEM analysis. Under optimized LAB conditions, minimal IMC growth and high bonding strength were achieved compared to conventional thermo-compression bonding (TCB) and mass reflow (MR) processes. As the laser irradiation time and laser power density increased, solder splashing was observed at bump temperatures above 300 °C. This is hypothesized to be due to the rapid temperature rise causing the flux to vaporize explosively, resulting in simultaneous solder splashing. With increasing laser power density, the failure mode transitioned from the solder to the IMC. Full article

The Printed Circuit Board (PCB) manufacturing industry is a rapidly expanding sector, fueled by advanced technologies and precision-oriented production processes. The placement of Surface-Mount Device (SMD) components in PCB assembly is efficiently automated using robots and design software-generated coordinate files; however, the PCB repair process remains significantly more complex and challenging. Repairing faulty PCBs, particularly replacing defective SMD components, requires high precision and significant manual expertise, making automated solutions both rare and difficult to implement. This study introduces a novel real-time machine vision-based coordinate estimation system designed for estimating the coordinates of SMD components during soldering or desoldering tasks. The system was specifically designed for Selective Compliance Articulated Robot Arm (SCARA) robots to overcome the challenges of repairing miniature PCB components. The proposed system integrates Image-Based Visual Servoing (IBVS) for precise X and Y coordinate estimation and a simplified laser triangulation method for Z-axis depth estimation. The system demonstrated accuracy rates of 98% for X and Y axes and 99% for the Z axis, coupled with high operational speed. The developed solution highlights the potential for automating PCB repair processes by enabling SCARA robots to execute precise picking and placement tasks. When equipped with a hot-air gun as the end-effector, the system could enable automated soldering and desoldering, effectively replacing faulty SMD components without human intervention. This advancement has the potential to bridge a critical gap in the PCB repair industry, improving efficiency and reducing dependence on manual expertise. Full article

Effective thermal management is a critical challenge in achieving high-power output for semiconductor laser devices. A key factor in laser device packaging is the bonding between the laser device on a GaAs substrate and a heat spreader, typically composed of high thermal conductivity materials such as SiC. Conventional soldering methods introduce thick bonding layers with relatively low thermal conductivity, resulting in high thermal resistance at the interface. In this study, we demonstrate the room temperature bonding of GaAs and SiC via a 30 nm thick Au layer, eliminating the need for a thermal reaction bonding layer or vacuum process. Using surface-activated bonding (SAB), GaAs and SiC were successfully bonded, with a strength comparable to bulk fracture. A uniform and ultrathin Au bonding interface significantly reduces thermal resistance compared to conventional soldering methods. These results highlight the potential of SAB with thin Au films as a promising approach for improving thermal management in high-power semiconductor laser devices. Full article

With the rapid growth of data center demand driven by AI, high-speed optical modules (such as 800G and 1.6T) have become critical components. Traditional 800G modules face issues such as complex processes and large sizes due to the separate packaging of EML chips, AlN substrates, and capacitors. This study proposes a high-speed EML module based on silicon integration, where resistors, capacitors, and AuSn soldering areas are integrated onto the silicon substrate, enabling the bonding of the EML chip, reducing packaging costs, and enhancing scalability. Key achievements include: the development of a 100G EML chip; the fabrication of a high-speed silicon integrated carrier; successful Chip-on-Carrier (COC) packaging and testing, with a laser output power of 10 mW, extinction ratio of 10 dB, and bandwidth greater than 40 GHz; and reliability verified through 500 h of aging tests. This study provides an expandable solution for next-generation high-speed optical interconnects. Full article

Three-dimensional Mechatronic Integrated Devices (3D-MIDs) combine mechanical and electrical functions, enabling significant component miniaturization and enhanced functionality. However, their application in high-temperature environments remains limited due to material challenges. Existing research highlights the thermal stability of ceramic substrates; yet, their reliability under high-stress and complex mechanical loading conditions remains a challenge. In this study, 3D-MID components were fabricated using stereolithography (SLA) 3D-printing technology, and the feasibility of circuit miniaturization on high-temperature-resistant resin substrates was explored. Additionally, the influence of laser parameters on resistance values was analyzed using the Response Surface Methodology (RSM). The results demonstrate that SLA 3D-printing achieves substrates with low surface roughness, enabling the precise formation of fine features. Electric circuits are successfully formed on substrates printed with resin mixed with Laser Direct Structuring (LDS) additives, following laser structuring and metallization processes, with a minimum conductor spacing of 150 µm. Furthermore, through the integration of through-holes (vias) and the use of smaller package chips, such as Ball Grid Array (BGA) and Quad Flat No-lead (QFN), the circuits achieve further miniaturization and establish reliable electrical connections via soldering. Taken together, our results demonstrate that thermoset plastics serve as substrates for 3D-MID components, broadening the application scope of 3D-MID technology and providing a framework for circuit miniaturization on SLA-printed substrates. Full article

In order to improve the stability of semiconductor laser fiber coupling efficiency, based on the coupling principle, the optimal parameters for semiconductor laser fiber coupling were simulated to be θ = 45°, r = 3.25 μm, and z = 5.65 μm. By optimizing the structure and position of the lens fiber, it has been experimentally proven that the maximum fiber coupling efficiency of the 980 nm semiconductor laser can reach 87.1%, and the average coupling efficiency can also reach 84%. After temperature cycling and aging experiments, the average coupling efficiency of the device was 81.7%, indicating a decrease in coupling efficiency. At the same time, the effect of fiber stress on the reliability of coupling efficiency was analyzed, and the stability and consistency of the device before and after temperature cycling were explored. In future work, it will be necessary to further optimize the thermal stress caused by UV glue curing and tail pipe soldering, find suitable process parameters, and obtain stable and reliable coupling modules. Full article

In this study, we investigated the brittle fracture behavior of Sn-3.0Ag-0.5Cu (SAC305) solder joints with a Direct Electroless Gold (DEG) surface finish, formed using laser-assisted bonding (LAB) and mass reflow (MR) techniques. Commercial SAC305 solder balls were used to ensure consistency. LAB increases void fractions and coarsens the primary β-Sn phase with higher laser power, resulting in a larger eutectic network area fraction. In contrast, MR produces solder joints with minimal voids and a thicker intermetallic compound (IMC) layer. LAB-formed joints exhibit higher high-speed shear strength and lower brittle fracture rates compared to MR. The key factor in the reduced brittle fracture in LAB joints is the thinner IMC layer at the joint interface. This study highlights the potential of LAB in enhancing the mechanical reliability of solder joints in advanced electronic packaging applications. Full article

The electric vehicle (EV) industry challenges battery joining technologies by requiring higher energy density both by mass and volume. Improving the energy density via new battery chemistry would be the holy grail but is seriously hindered and progresses slowly. In the meantime, alternative ways, such as implementing more efficient cell packaging by minimising the electrical resistance of joints, are of primary focus. In this paper, we discuss the challenges associated with the electrical characterisation of laser-soldered joints in general, and the minimisation of their resistive losses, in particular. In order to assess the impact of joint resistance on the overall resistance of the sample, the alteration in resistance was monitored as a function of voltage probe distance and modelled by finite element simulation. The experimental measurements showed two different regimes: one far from the joint area and another in its vicinity and within the joint cross-section. The presented results confirm the importance of the thickness of the filler material, the effective and total soldered area, and the area and position of the voids within the total soldered area in determining the electrical resistance of joints. Full article

In this paper, we proposed a miniature quadrupedal piezoelectric robot with a mass of 1.8 g and a body length of 4.6 cm. The robot adopts a novel spatial parallel mechanism as its transmission. Each leg of the robot has two degrees of freedom (DOFs): swing and lift. The trajectory necessary for walking is achieved by the appropriate phasing of these two DOFs. A new manufacturing method for piezoelectric actuators was developed. During the stacking process, discrete patterned PZT pieces are used to avoid dielectric failure caused by laser cutting. Copper-clad FR-4 is used as the solder pad instead of copper foil, making the connection between the pad and the actuator more reliable. The lift powertrain of the robot was modeled and the link length of the powertrain was optimized based on the model. The maximum output force of each leg can reach 26 mN under optimized design parameters, which is 1.38 times the required force for successful walking. The frequency response of the powertrain was measured and fitted to the second-order system, which enabled increased leg amplitudes near the powertrain resonance of approximately 70 Hz with adjusted drive signals. The maximum speed of the robot without load reached 48.66 cm/s (10.58 body lengths per second) and the payload capacity can reach 5.5 g (3.05 times its mass) near the powertrain resonance. Full article

Introduction: The need to permanently join two or more pieces of metal using heat is a frequent condition in various fields of medicine such as dentistry. Welding, brazing and soldering are permanent joining techniques between different metals that require in-depth background knowledge in order to obtain predictable results. Aim: This review examines the different methods of joining metals using heat and their fields of application. Discussion: It is possible to create permanent metal joints in various phases of the creation of final products that will be used on the patient. In several cases, welds are also made directly by the manufacturer during industrial processing. In dentistry, dental laboratories perform complex welds mainly on dental prostheses and orthodontic appliances during the production process. It is also possible to obtain intraoral welding carried out by the clinician inside the patient’s oral cavity. Welding can be carried out using combustible gases, electric current, infrared light and laser light through different technical procedures which must be chosen according to the specific needs and the metals to be joined. Conclusions: It is useful for the dentist and dental technician to know the different welding methods, including those carried out in the factory by the manufacturer, to better understand the physical properties and mechanical resistance of the components marketed for the construction of prostheses and orthodontic appliances. The enormous variety of conditions in which those who practice welding can find themselves therefore presupposes in-depth knowledge in this field in order to apply the most suitable technique. Full article

This paper describes a fast and flexible microfabrication method for thermal conductivity gas sensors useful in high-temperature applications. The key parts of the sensor, the microheater and the package, were fabricated from glass-coated platinum wire and the combination of laser micromilling (ablation) of already-sintered monolithic ceramic materials and thick-film screen-printing technologies. The final thermal conductivity gas sensor was fabricated in the form of a complete MEMS device in a metal ceramic package, which could be used as a compact miniaturized surface-mounted device for soldering to standard PCB. Functional test results of the manufactured sensor are presented, demonstrating their full suitability for gas sensing applications and indicating that the obtained parameters are at a level comparable to those of standard industrially produced sensors. The results of the design and optimization principles of applied methods are discussed with regard to possible wider applications in thermal gas sensor prototyping in the future. The advantage of the developed sensors is their ability to operate in air environments under high temperatures of 900 °C and above. The sensor element material and package metallization were insensitive to oxidation compared with classical sensor-solution-based metal–glass packages and silicone MEMS membranes, which exhibit mechanical stress at temperatures above 700 °C. Full article

The reliability of packaged laser diodes is heavily dependent on the quality of the die attach. Even a small void or delamination may result in a sudden increase in junction temperature, eventually leading to failure of the operation. The contact thermal resistance at the interface between the die attach and the heat sink plays a critical role in thermal management of high-power laser diode packages. This paper focuses on the investigation of interface contact thermal resistance of the die attach using thermal transient analysis. The structure function of the heat flow path in the T3ster thermal resistance testing experiment is utilized. By analyzing the structure function of the transient thermal characteristics, it was determined that interface thermal resistance between the chip and solder was 0.38 K/W, while the resistance between solder and heat sink was 0.36 K/W. The simulation and measurement results showed excellent agreement, indicating that it is possible to accurately predict the interface contact area of the die attach in the F-mount packaged single emitter laser diode. Additionally, the proportion of interface contact thermal resistance in the total package thermal resistance can be used to evaluate the quality of the die attach. Full article

This study presents a method to analyze the electrical resistance of planar contacts. The method can determine whether the contact resistance of the joint exhibits linear or non-linear behavior. By analyzing the current distribution over a planar contact, it can be determined whether an area-based contact resistance is justified or if other parameters define the contact resistance. Additionally, a quantitative evaluation of the factors that affect the measurement accuracy, including the positioning, the measurement equipment used, and the influence of the current injection on the sense pin was conducted. Based on these findings, the electrical contact resistance and the mechanical ultimate tensile force of a silver-filled epoxy-based adhesive are analyzed and discussed. The layer thickness and the lap joint length were varied. Overall, the investigated adhesive shows a low contact resistance and high mechanical strength of the same magnitude as that of well-established joining techniques, such as welding, press connections, and soldering. In addition to evaluating the mechanical and electrical properties, the electric conductive adhesive underwent an economic assessment. This analysis revealed that the material costs of the adhesive significantly contribute to the overall connection costs. Consequently, the effective costs in mass production are higher than those associated with laser beam welding. Full article