Search Results (134)

The operational ability of a unit or mechanism depends mainly on the quality of the mechanically produced working surfaces. Many materials can be assigned to a group of hard-to-cut materials that includes titanium- and aluminum-based alloys, a new class of heat-resistant alloys, SiCp/Al composites, hard alloys, and other alloys. The difficulties in their machining are related not only to the high temperatures achieved on the contact pads under mechanical load and the extreme cutting conditions but also to the properties of those materials, which affect the adhesion of the chip to the tool faces, hindering chip flow. One of the possible solutions to reduce those effects and improve the operational life of the tool, and as a consequence, the final quality of the working surface of the unit, is texturing the rake face of the tool with microgrooves or nanogrooves, microholes or nanoholes (pits, dimples), micronodes, cross-chevron textures, and other microtextures, the depth of which is in the range of 3.0–200.0 µm. This review is addressed at systematizing the data obtained on micro- and nanotexturing of PCD tools for cutting hard-to-cut materials by different techniques (fiber laser graving, femto- and nanosecond laser, electrical discharge machining, fused ion beam), additionally subjected to fluorination and dip- and drop-based coatings, and the effect created by the use of the textured PCD tool on the machined surface. Full article

This study provides a comparative and material-specific assessment of how laser cutting parameters affect the surface integrity of three commonly used engineering alloys, thereby extending the current knowledge beyond single-material analyses. The main objective was to quantify and relate changes in surface roughness, microhardness, and microstructure to variations in laser cutting conditions for S355J2 steel, AISI 304 steel, and AlMg₃ aluminum alloy. Variable cutting parameters were applied, including cutting speed, assist gas type and pressure, as well as laser beam power, and their combined effect on the thickness of the remelted and heat-affected zones was evaluated. The results show clear material-dependent trends: S355J2 steel exhibited the lowest surface roughness but the most pronounced surface hardening, with maximum microhardness values reaching approximately 700 HV 0.1 in a relatively narrow heat-affected zone, whereas AISI 304 showed a distinct edge-hardening effect with more moderate roughness. In contrast, the AlMg₃ alloy developed a clearly visible remelted layer and a refined, fine-grained microstructure, accompanied by much lower hardness levels but a more diffuse heat-affected zone. These findings provide original, comparative guidelines for selecting laser cutting parameters tailored to specific materials, enabling the optimization of edge quality and surface properties in industrial applications. Full article

Solar sailing has proven to be an effective solution for cost-effective and long-term space missions due to its fuel-free propulsion. While multiple large-scale solar sails based on kilogram-class satellites have been developed and tested in space, solar sails created for lightweight chip-scale satellites are much less. To enable the gram-class satellite of solar sailing for active attitude adjustment and orbital maneuvers, a novel solar sail driven by two-way shape memory effect (TWSME) was proposed in this work. The solar sail base was made of rectangular Al-Kapton thin films, while a U-shaped NiTi beam was developed by 50 μm thin Ni_50.6Ti_49.4 foils. Both of the U-shaped NiTi beam and rectangular Al-Kapton thin films were manufactured by the ultra-fast femtosecond laser cutting machine. Finite element modeling of single U-shaped NiTi beam and assembled solar sail were built to validate that an 80 mm-long TWSME NiTi beam with a curvature of 37.31 m⁻¹ were sufficient to drive the solar sail for solar radiation pressure modulation. A solar sail prototype was developed, and an in situ experiment test of the prototype was conducted with infrared imaging, showing efficient bending behaviors by application of a 0.5 A direct current across the U-shape NiTi beam. These findings reveal that U-shaped TWSME NiTi foils provide an effective driving strategy for lightweight chip-scale satellites, and thus dramatically broaden the space application of the gram-scale satellite. Full article

The efficiencies of additive manufacturing (AM) over conventional processes have enabled the rapid production of aluminum (Al) alloys with AM. Because laser beam powder bed fusion (LB-PBF) parts do not offer the surface quality and geometrical accuracy for direct use, the functional surfaces of LB-PBF parts are usually machined by subtractive machining. The machinability of LB-PBF AlSi10Mg was studied in dry, MQL (used corn oil), and cryo-LN₂ cutting environments across distinct speed–feed combinations using CVD-AlTiN-coated carbide inserts, and surface integrity and tool life were quantified in terms of surface roughness (Ra) and flank wear (Vb), respectively. The lowest Ra (0.98–1.107 μm) was obtained with cryo-LN₂, followed by MQL and dry cutting environments, because the trends observed were consistent with the surface mechanisms observed in 3D topography and bearing curves. Similarly, the tool wear results mirrored the Ra results, lowest with LN₂ (0.087–0.110 mm), due to improved thermal management, reduced adhesion and abrasion, and shorter contact length. Cryo-LN₂ provided the best surface finish and tool life among all tested environments. To enable data-driven prediction, the limited dataset was augmented using SMOTE, and machine learning (ML) models were trained to predict Ra and Vb. CatBoost was found to yield the best Ra predictions (R² = 0.9090), while Random Forest and XGBoost yielded the best Vb predictions (R² ≈ 0.878). Full article

The rapid advancement of high-performance electronics has intensified the demand for wide-bandgap semiconductor materials capable of operating under high-power and high-temperature conditions. Among these, silicon carbide (SiC) has emerged as a leading candidate due to its superior thermal conductivity, chemical stability, and mechanical strength. However, the high cost and complexity of SiC wafer fabrication, particularly in slicing and exfoliation, remain significant barriers to its widespread adoption. Conventional methods such as wire sawing suffer from considerable kerf loss, surface damage, and residual stress, reducing material yield and compromising wafer quality. Additionally, techniques like smart-cut ion implantation, though capable of enabling thin-layer transfer, are limited by long thermal annealing durations and implantation-induced defects. To overcome these limitations, ultrafast laser-based processing methods, including laser slicing and stealth dicing (SD), have gained prominence as non-contact, high-precision alternatives for SiC wafer exfoliation. This review presents the current state of the art and recent advances in laser-based precision SiC wafer exfoliation processes. Laser slicing involves focusing femtosecond or picosecond pulses at a controlled depth parallel to the beam path, creating internal damage layers that facilitate kerf-free wafer separation. In contrast, stealth dicing employs laser-induced damage tracks perpendicular to the laser propagation direction for chip separation. These techniques significantly reduce material waste and enable precise control over wafer thickness. The review also reports that recent studies have further elucidated the mechanisms of laser–SiC interaction, revealing that femtosecond pulses offer high machining accuracy due to localized energy deposition, while picosecond lasers provide greater processing efficiency through multipoint refocusing but at the cost of increased amorphous defect formation. The review identifies multiphoton ionization, internal phase explosion, and thermal diffusion key phenomena that play critical roles in microcrack formation and structural modification during precision SiC wafer laser processing. Typical ultrafast-laser operating ranges include pulse durations from 120–450 fs (and up to 10 ps), pulse energies spanning 5–50 µJ, focal depths of 100–350 µm below the surface, scan speeds ranging from 0.05–10 mm/s, and track pitches commonly between 5–20 µm. In addition, the review provides quantitative anchors including representative wafer thicknesses (250–350 µm), typical laser-induced crack or modified-layer depths (10–40 µm and extending up to 400–488 µm for deep subsurface focusing), and slicing efficiencies derived from multi-layer scanning. The review concludes that these advancements, combined with ongoing progress in ultrafast laser technology, represent research opportunities and challenges in transformative shifts in SiC wafer fabrication, offering pathways to high-throughput, low-damage, and cost-effective production. This review highlights the comparative advantages of laser-based methods, identifies the research gaps, and outlines the challenges and opportunities for future research in laser processing for semiconductor applications. Full article

Optical interferometry provides high-precision displacement and angle measurement solutions for a wide range of cutting-edge industrial applications. One of the key factors to achieve such precision lies in highly accurate optical encoder signal processing, as well as the calibration and compensation techniques customized for specific measurement principles. Optical interferometric techniques, including laser interferometry and grating interferometry, are usually classified into homodyne and heterodyne systems according to their working principles. In homodyne interferometry, the displacement is determined by analyzing the phase variation of amplitude-modulated signals, and common demodulation methods include error calibration methods and ellipse parameter estimation methods. Heterodyne interferometry obtains displacement information through the phase variation of beat-frequency signals generated by the interference of two light beams with shifted frequencies, and its demodulation techniques include pulse-counting methods, quadrature phase-locked methods, and Kalman filtering. This paper comprehensively reviews the widely used signal processing techniques in optical interferometric measurements over the past two decades and conducts a comparative analysis based on the characteristics of different methods to highlight their respective advantages and limitations. Finally, the hardware platforms commonly used for optical interference signal processing are introduced. Full article

In this study, a novel direct laser beam turning (DLBT) approach is proposed for the precision machining of AISI 308L austenitic stainless steel, which eliminates the need for cutting tools and thereby eradicates tool wear and vibration-induced surface irregularities. A nanosecond-pulsed Nd:YAG fiber laser (λ = 1064 nm, spot size = 0.05 mm) was used, and Ø1.6 mm × 20 mm cylindrical rods were processed under ambient conditions without auxiliary cooling. The experimental framework systematically evaluated the influence of scanning speed, pulse frequency, and the number of laser passes on dimensional accuracy and material removal efficiency. The results indicate that a maximum diameter reduction of 0.271 mm was achieved at a scanning speed of 3200 mm/s and 50 kHz, whereas 0.195 mm was attained at 6400 mm/s and 200 kHz. A robust second-order polynomial correlation (R² = 0.99) was established between diameter reduction and the number of passes, revealing the high predictability of the process. Crucially, when the scanning speed was doubled, the effective fluence was halved, considerably influencing the ablation characteristics. Despite the low fluence, evidence of material evaporation at elevated frequencies due to the incubation effect underscores the complex photothermal dynamics governing the process. This work constitutes the first comprehensive quantification of pass-dependent diameter modulation in DLBT and introduces a transformative, noncontact micromachining strategy for hard-to-machine alloys. The demonstrated precision, repeatability, and thermal control position DLBT as a promising candidate for next-generation manufacturing of high-performance miniaturized components. Full article

The output energy of Laser Active Optical Systems (LAOSs), in which image brightness is amplified within the laser-active medium, is always higher than the input energy. This contrasts with conventional optical systems (OSs). As a result, a LAOS enables the creation of laser beams with tailored energy distribution across the aperture, making them ideal for material processing applications. This concept was first successfully implemented using metal vapor lasers as the gain medium. In these systems, material processing was achieved by using a laser beam that either carried the required energy profile or the image of the object itself. Later, other laser media were utilized for LAOSs, including barium vapor, strontium vapor, excimer XeCl lasers, and solid-state media. Additionally, during the development of these systems, several modifications were introduced. For example, Space-Time Light Modulators (STLMs) and CCD cameras were incorporated, along with the use of multipass amplifiers, disk-shaped or thin-disk (TD) solid-state laser amplifiers, and other advancements. These techniques have significantly expanded the range of power, energy, pulse durations, and operating wavelengths. Currently, TD laser amplifiers and STLMs based on Digital Light Processor (DLP) technology or Digital Micromirror Devices (DMDs) enhance the potential to develop LAOS devices for Subtractive and Additive Technologies (ST, AT), applicable in both macromachining (cutting, welding, drilling) and micro-nano processing. This review presents comparable characteristics and requirements for these various LAOS applications. Full article

A continuous-wave (CW) orthogonally polarized single-wavelength red laser (OPSRL) at 698 nm with a tunable power ratio within a wide range between the two polarized components was demonstrated using two Pr³⁺:LiLuF₄ (Pr:LLF) crystals for the first time. Through control of the waist location of the pump beam in the active media, the output power ratio of the two polarized components of the OPSRL could be adjusted. Under pumping by a 20 W, 444 nm InGaN laser diode (LD), a maximum total output power of 4.12 W was achieved with equal powers for both polarized components, corresponding to an optical conversion efficiency of 23.8% relative to the absorbed pump power. Moreover, by a type-II critical phase-matched (CPM) BBO crystal, a CW ultraviolet (UV) second-harmonic generation (SHG) at 349 nm was also obtained with a maximum output power of 723 mW. OPSRLs can penetrate deep tissues and demonstrate polarization-controlled interactions, and are used in bio-sensing and industrial cutting with minimal thermal distortion, etc. The dual-polarized capability of OPSRLs also supports multi-channel imaging and high-speed interferometry. Full article

LiNbO₃ plays a significant role in modern integrated photonics because of its unique properties. One of the challenges in modern integrated photonics is reducing chip production cost. Today, the most widespread yet expensive method to fabricate thin films of LiNbO₃ is the smart cut method. The high production cost of smart-cut chips is caused by the use of expensive equipment for helium implantation. A prospective method to reduce the cost of photonic integrated circuits is to use sputtered thin films of lithium niobite, since sputtering technology does not require helium implantation equipment. The purpose of this review is to assess the feasibility of applying sputtered LiNbO₃ thin films in integrated photonics. This work compares sputtered LiNbO₃ thin films and those fabricated by widespread methods, including the smart cut method, liquid-phase epitaxy, chemical vapor deposition, pulsed laser deposition, and molecular-beam epitaxy. Full article

The acoustic emissions of ventilation systems and their subcomponents contribute to the perceived overall comfort in indoor environments and are, therefore, the subject of research. In contrast to fans, there is little research on the aeroacoustic properties of air diffusers (often referred to as outlets). This study investigates a commercially available ceiling swirl diffuser. Using a hybrid approach, a detailed three-dimensional large-eddy simulation is coupled with a perturbed wave equation to capture the aeroacoustic processes within the diffuser. The flow model is validated for the investigated operating point of 470 m³/h using laser-optical and acoustic measurements. To identify the noise sources, the acoustic pressure is sampled with various receivers and on cut sections to evaluate the cross-power spectral density, and the sound-pressure level distribution on cut sections is evaluated. It is found that the plenum attenuates the noise near its acoustic eigenmodes and thus dominates other noise sources by several orders of magnitude. By implementing the plenum walls as sound-absorbing, the overall sound-pressure level is predicted to decrease by nearly 10 dB/Hz. Other relevant geometric features are the mounting beam and the guide elements, which are responsible for flow-borne noise emissions near 698 Hz and 2699 Hz, respectively. Full article

Herein we present a roadmap for tailoring the crystal growth conditions, near-infrared (NIR) laser emission, and self-frequency doubling (SFD) performances of newly developed Nd-doped La_xGd_ySc_4−x−y(BO₃)₄ (Nd:LGSB) crystals. Three different Nd³⁺ doping concentrations of 2.3 at.%, 3.5 at.%, and 4.6 at.% were investigated. Considering their incongruent melting, special conditions were employed for the growth using the Czochralski technique. Laser emission performances at 1062 nm in the CW regime were evaluated for uncoated crystal samples with different orientations (a-cut, c-cut, and SFD-cut). The highest slope efficiency η_sa = 0.68 was obtained for the 4.6 at.% c-cut Nd:LGSB crystal, with a randomly polarized emission. The a-cut 4.6 at.% Nd:LGSB crystal delivered a linearly polarized beam with a slope efficiency η_sa = 0.63. The SFD-cut 2.3 at.% and 3.5 at.% Nd:LGSB crystals achieved slightly lower efficiencies of ~ 0.56. The SFD capabilities of 2.3 at.% and 3.5 at.% Nd:LGSB crystals were also explored. Green laser emission at ~531 nm was achieved with a diode-to-green conversion efficiency increasing significantly from 0.17% to 1.44%, respectively. These results demonstrate that the Nd-doping concentration, crystal orientation, and sample length of Nd:LGSB crystals, must be carefully selected depending on the specific requirements of the intended application. Full article

The conventional method of cutting quartz glass with a knife often leads to undesirable effects, such as chipping, debris generation, and an inconsistent cut quality. Additionally, implementing the current methods of laser ablation cutting and crack control cutting presents challenges in ensuring both the quality of the cut and the efficiency of the process. Previous reports have documented a single direct cut of thin quartz glass, albeit at a thickness of only 200 μm. In this study, we utilized a pulse-width-tunable Gaussian beam, in combination with an axicon and a beam-reducing mirror, to generate a high-quality Bessel beam. This process endows the quartz glass with a nano-porous structure with a thickness of 1 mm, enabling high-quality cutting in a single pass. The effects of laser-cutting speed and pulse width on the cutting cross-section and cut surface were investigated. The results of the experiments show that using the optimal cutting speed and pulse width significantly improved cutting quality, reduced surface damage and sputtering, enabled the penetration of the modified cutting cross-section throughout the material, and decreased cutting cross-section roughness to 607 nm Ra. This technique holds promise for the laser-processing industry, enhancing both the quality and efficiency of cutting 1 mm thick quartz glass. Full article

Cemented carbides, renowned for their exceptional strength, hardness, elastic modulus, wear resistance, corrosion resistance, low coefficient of thermal expansion, and chemical stability, have long been indispensable tooling materials in metal cutting, oil drilling, and engineering excavation. The advent of additive manufacturing (AM), commonly known as “3D printing”, has sparked considerable interest in the processing of cemented carbides. Among the various AM techniques, Selective Laser Melting (SLM), Selective Laser Sintering (SLS), Selective Electron Beam Melting (SEBM), and Binder Jetting Additive Manufacturing (BJAM) have garnered frequent attention. Despite the great application potential of AM, no single AM technique has been universally adopted for the large-scale production of cemented carbides yet. The SLM and SEBM processes confront substantial challenges, such as a non-uniform sintering temperature field, which often result in uneven sintering and frequent post-solidification cracking. SLS notably struggles with achieving a high relative density of carbides. While BJAM yields WC-Co samples with a lower incidence of cracking, it is not without flaws, including abnormal WC grain growth, coarse WC clustering, Co-rich pool formation, and porosity. Three-dimensional gel-printing, though possessing certain advantages from its sintering performance, falls short in dimensional and geometric precision control, as well as fabrication efficiency. Cemented carbides produced via AM processes have yet to match the quality of their traditionally prepared counterparts. To date, the specific densification and microstructure evolution mechanisms during the AM process, and their interrelationship with the feedstock carbide material design, printing/sintering process, and resulting mechanical behavior, have not been thoroughly investigated. This gap in our knowledge impedes the rapid advancement of AM for carbide processing. This article offers a succinct overview of additive manufacturing of cemented carbides, complemented by an analysis of the current research landscape. It highlights the benefits and inherent challenges of these techniques, aiming to provide clarity on the present state of the AM processing of cemented carbides and to offer insights into potential future research directions and technological advancements. Full article

This work studied the pre-plasma that builds up in interactions of focused high-power PW-class lasers with solid targets at the target surface facing the laser beam, and its impact on the global laser absorption efficiency as well as on the spectral cut-off energy of laser-generated proton beams. Our practical heuristic estimates were derived from the example of the VEGA-3 laser at CLPU. Our modeling results for the pre-plasma expansion due to the laser pedestal of VEGA-3 were benchmarked by hydrodynamic simulations, revealing good agreement for the evolution before the arrival of the main Gaussian laser intensity peak. Our detailed numerical two-dimensional Particle-in-Cell simulations showed the impact of different pre-plasma scale lengths on the absorption efficiency of laser energy into electrons, relevant for the seeding of other types of radiation. It was shown that the absorption can increase manyfold when increasing the pre-plasma scale length. This effect can be beneficial for the spectral cut-off energy of accelerated protons, where a trade-off between absorption and electron dynamics yields an optimum pre-plasma scale length. The findings can be applied to other PW-class laser facilities. Full article