Search Results (40)

As semiconductor devices demand higher input–output density and faster signal transmission, fan-out panel-level packaging has emerged as a promising solution for next-generation electronic systems. However, the hygroscopic nature of epoxy molding compounds raises critical reliability concerns under high-temperature and high-humidity conditions. This study investigates the hygrothermal stress of a single fan-out panel-level package unit through experimental characterization and numerical simulation. Thermal–mechanical analysis was conducted at 100 °C and 260 °C to evaluate the strain behavior of two commercial epoxy molding compounds in granule form after moisture saturation. The coefficient of moisture expansion was calculated by correlating strain variation with moisture uptake obtained under 85 °C and 85% relative humidity, corresponding to moisture sensitivity level 1 conditions. These values were directly considered into a moisture -thermal coupled finite element analysis. The simulation results under reflow conditions demonstrate accurate principal stress and failure location predictions, with stress concentrations primarily observed at the die corners. The results confirm that thermal effects influence stress development more than moisture effects. Finally, a structural sensitivity analysis of the single-package configuration showed that optimizing the thickness of the dies and epoxy molding compound can reduce maximum principal stress by up to 12.4%, providing design insights for improving package-level reliability. Full article

Micro gas turbines serve small-scale generation where swift response and low emissions are highly valued, and they are commonly fuelled by natural gas. True to their ‘micro’ designation, their size is indeed compact; however, a noteworthy portion of the enclosure is devoted to power electronics components. This article considers whether these components can be made even smaller by substituting their conventional silicon switches with switches fashioned from silicon carbide. The wider bandgap of silicon carbide permits stronger electric fields and reliable operation at higher temperatures, which together promise lower switching losses, less heat, and simpler cooling arrangements. This study rests on a simple volumetric model. Two data sets feed the model. First come the manufacturer specifications for a pair of converter modules (one silicon, the other silicon carbide) with identical operation ratings. Second are the operating data and dimensions of a commercial 100 kW micro gas turbine. The model splits the converter into two parts: the semiconductor package and its cooling hardware. It then applies scaling factors that capture the higher density of silicon carbide and its lower switching losses. Lower switching losses reduce generated heat, so heatsinks, fans, or coolant channels can be slimmer. Together these effects shrink the cooling section and, therefore, the entire converter. The findings show that a micro gas turbine inverter built with silicon carbide occupies about one fifth less space and delivers more than a quarter higher power density than its silicon counterpart. Full article

In this paper, the fabrication and testing of an integrated passive device (IPD) structure for X-band FMCW radar based on the fan-out wafer-level packaging (FOWLP) process are discussed. First, a transition line structure is added to the IPD structure to increase the upper impedance limit of the substrate, so as to reduce the process implementation difficulty and development cost. Second, the vertical soldered SubMiniature Push-On Micro (SMPM) interfaces testing method is proposed, reducing the testing difficulty of the dual-port structure with the antenna. Finally, the process fabrication as well as testing of the IPD structure are completed. The dimensions of the fabricated structure are 16.983 × 24.099 × 0.56 ${\mathrm{mm}}^3$. Test results show that, with a center frequency of 8.5 GHz, the actual operational bandwidth of the structure reaches 7.66% (8.095–8.74 GHz), with a maximum isolation of 33.9 dB. The bandwidth with isolation greater than 20 dB is 1.76% (8.455–8.605 GHz). The maximum gain at the center frequency is 2.02 dBi. Additionally, experimental uncertainty analysis is performed on different IPD structures, and the measurement results are basically consistent. These results validate the feasibility of the FOWLP process in the miniaturization of X-band FMCW radar antenna and other passive devices. Full article

Direct-writing submicron copper circuits on glass with laser precision—without lithography, vacuum deposition, or etching—represents a transformative step in next-generation microfabrication. We present a high-resolution, maskless method for metallizing glass using ultrashort pulse Bessel beam laser processing, followed by silver ion activation and electroless copper plating. The laser-modified glass surface hosts nanoscale chemical defects that promote the in situ reduction of Ag⁺ to metallic Ag⁰ upon exposure to AgNO₃ solution. These silver seeds act as robust catalytic and adhesion sites for subsequent copper growth. Using this approach, we demonstrate circuit traces as narrow as 0.7 µm, featuring excellent uniformity and adhesion. Compared to conventional redistribution-layer (RDL) and under-bump-metallization (UBM) techniques, this process eliminates multiple lithographic and vacuum-based steps, significantly reducing process complexity and production time. The method is scalable and adaptable for applications in transparent electronics, fan-out packaging, and high-density interconnects. Full article

With the growing demand for high-performance computing (HPC), artificial intelligence (AI), and data communication and storage, new chip technologies have emerged, following Moore’s Law, over the past few decades. As we enter the post-Moore era, transistor dimensions are approaching their physical limits. Advanced packaging technologies, such as 3D chiplets hetero-integration and co-packaged optics (CPO), have become crucial for further improving system performance. Currently, most solutions rely on silicon-based technologies, which alleviate some challenges but still face issues such as warpage, bumps’ reliability, through-silicon vias’ (TSVs) and redistribution layers’ (RDLs) reliability, and thermal dissipation, etc. Glass, with its superior mechanical, thermal, electrical, and optical properties, is emerging as a promising material to address these challenges, particularly with the development of femtosecond laser technology. This paper discusses the evolution of both conventional and advanced packaging technologies and outlines future directions for design, fabrication, and packaging using glass substrates and femtosecond laser processing. Full article

This study presents an artificial intelligence (AI) prediction platform driven by deep learning technologies, designed specifically to address the challenges associated with predicting warpage behavior in fan-out wafer-level packaging (FOWLP). Traditional electronic engineers often face difficulties in implementing AI-driven models due to the specialized programming and algorithmic expertise required. To overcome this, the platform incorporates a graphical user interface (GUI) that simplifies the design, training, and operation of deep learning models. It enables users to configure and run AI predictions without needing extensive coding knowledge, thereby enhancing accessibility for non-expert users. The platform efficiently processes large datasets, automating feature extraction, data cleansing, and model training, ensuring accurate and reliable predictions. The effectiveness of the AI platform is demonstrated through case studies involving FOWLP architectures, highlighting its ability to provide quick and precise warpage predictions. Additionally, the platform is available in both uniform resource locator (URL)-based and standalone versions, offering flexibility in usage. This innovation significantly improves design efficiency, enabling engineers to optimize electronic packaging designs, reduce errors, and enhance the overall system performance. The study concludes by showcasing the structure and functionality of the GUI platform, positioning it as a valuable tool for fostering further advancements in electronic packaging. Full article

In advanced microelectronic packaging, high thermo-mechanical loads arise on the solder interconnects. Accurate and efficient modeling of the mechanical behavior is crucial in the design of the package, and the simulation results can provide a basis for estimations of the reliability of the assembly. However, the accuracy of the simulation results depends on the accuracy of the modeled geometry and the modeling simplifications and assumptions employed to achieve computational cost-efficient calculations. In this work, finite element analysis (FEA) of a Fan Out—Wafer Level Packaging (FO-WLP) layout was carried out considering the following variations: modeling domain (2-D and pseudo-3-D) was defined for creating the efficient calculation framework, where soldering material (SAC 305 and SACQ), incorporation of intermetallic compound (IMC), bond pad edge geometry (sharp and blunt) were modeled for cycles of thermal load. Stress and strain analysis was carried out to evaluate the solder behavior for the parameter variations. Furthermore, fatigue indicators were evaluated. An efficient planar simulation framework with 2-D and pseudo-3-D meshed geometries provides a quick estimate for the lower and upper bound for the strain, stress and strain energy-related parameters, respectively. This calculation framework can be employed for extensive parameter studies solved rapidly at low computational costs. Full article

This paper presents an integrated passive device (IPD) structure based on fan-out wafer-level packaging (FOWLP) for the front end of frequency-modulated continuous wave (FMCW) radar systems, focusing on enhancing the integration efficiency and performance of large passive components like antennas. Additionally, a new metric is introduced to assess this structure’s effect on the average noise figure in FMCW systems. Using this metric as a loss function, we apply the support vector machine (SVM) for electromagnetic simulation and the genetic algorithm (GA) for optimization. The sample fitting variance is 2.42 dB, reducing computation time from 12 min to under 1 millisecond, with the entire optimization completed in less than 100 s. The optimized IPD structure is 0.7 × 0.9 × 0.014 ${{\lambda }_0}^3$ in size and achieves over 35 dB isolation between the transmitter and receiver. Compared to the IPD model calculated by empirical formulas, the optimized device lowers the average noise figure by 15.2 dB and increases maximum gain by 4.19 dB. Full article

American football is one of the most popular team sports in the United States. There are approximately 16,000 high school and 890 college football teams, and each team plays around 10–14 games per football season. Contrary to most casual fans’ views, American football is more than speed and power, it requires preparation and strategies. Coaches analyze hours of video of their own and opponents’ games to extract important information such as offensive play formations, personnel packages and opposing coaches’ tendency to gain competitive advantages. This time-consuming and slow process called “tagging” takes away the coaches’ time from other duties and limits the players’ time for preparation and training. In this work, we created three datasets for our experiments to demonstrate the importance of player detection accuracy, which is easily affected by camera placement and player occlusion issues. We applied a unique data augmentation technique to generate data for each specific experiment. Our model achieved a remarkable 98.52% accuracy in play type recognition and 92.38% accuracy in player position recognition for the experiment that assumes no missing players or no occlusion problem, which could be achieved by placing the camera high above the football field. Full article

This work is devoted to the study of gas-dynamic processes in the operation of climate control systems in the cabins of vehicles (HVAC), focusing on pressure values. This research examines the issue of assessing the required values of air overpressure inside the locomotive cabin, which is necessary to prevent gas exchange between the interior of the cabin and the outside air through leaks in the cabin, including protection against the penetration of harmful substances. The pressure boost in the cabin depends, among other things, on the external air pressure on the locomotive body, the power of the climate system fan, and the ratio of the input and output deflectors. To determine the external air pressure, the problem of train movement in a wind tunnel is considered, the internal and external fluids domain is considered, and the air pressure on the cabin skin is determined using numerical methods CFD based on the Navier–Stokes equations, depending on the speed of movement. The finite-volume modeling package Ansys CFD (Fluent) was used as an implementation. The values of excess internal pressure, which ensures the operation of the climate system under different operating modes, were studied numerically and on the basis of an approximate applied formula. In particular, studies were carried out depending on the speed and movement of transport, on the airflow of the climate system, and on the ratio of the areas of input and output parameters. During a numerical experiment, it was found that for a train speed of 100 km/h, the required excess pressure is 560 kPa, and the most energy-efficient way to increase pressure is to regulate the area of the outlet valves. Full article

The hybrid integration of electronics in flexible substrates using fanned-out, wafer-level packaging (FOWLP) has recently gained significant attention, with numerous applications in wearable electronics, foldable displays, robotics, medical implants, and healthcare monitoring. In this study, a fully additive and scalable manufacturing process flow to realize a low-cost, flexible FOWLP system was introduced. Here, the integration of 36 LED chips in a biocompatible polydimethylsiloxane (PDMS) substrate was demonstrated using a stencil-printed silver (Ag) redistribution layer (RDL). The processes for the integration of chips, i.e., chip first (exposed die embedding), chip first (deep embedding with filled valleys) and chip last (RDL first), were implemented, and the corresponding samples were evaluated electrically. The bendability of the samples was also characterized at different bending diameters. Conclusively, it was shown that by using surface-modified PDMS as a flexible substrate and stretchable Ag paste as interconnect, flexible FOWLP can be produced. Full article

The paper presents a new cost-effective magnetic circuit structure of a coreless permanent magnet synchronous motor (PMSM) with 16 poles and 12 coils for a mass production fan drive unit. 2D and 3D numerical models of the coreless PMSM were developed. Optimisation calculations were carried out using the field model of the machine. Multistage calculations were performed using the professional FEM package, ANSYS Maxwell and the author’s proprietary finite element method (FEM) code. On the basis of the conducted tests and analysis of the obtained results, the “optimal” magnetic circuit structure of the PMSM motor was selected. The prototype motor was subjected to measurement to verify the developed models and the proposed design approach that takes advantage of finite element analysis (FEA). Full article

In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed silicon interconnect fabric integration. This review includes approaches for both design modification studies and packaged device validation. Methods are explored for compatibility in new complex packaging assemblies. Suggestions are proposed for optimizations of the testing practices to account for the challenges anticipated in upcoming HI packaging schemes. Full article

In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ₀). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP’s parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G frequency bands. Compared with previous works, the proposed AiP has significant benefits in terms of its ultralow profile, easy processing, and high gain. Hence, the TMV-embedded FOWLP should be a promising technology for fifth generation (5G) millimeter wave (mm-Wave) applications. Full article

Sensor technologies have sufficiently advanced to provide low-cost devices that can quantify carbon dioxide levels in honeybee hives with high temporal resolution and in a small enough package for hive deployment. Recent publications have shown that summer carbon dioxide levels vary throughout the day and night over ranges that typically exceed 5000 ppm. Such dramatic changes in a measurable parameter associated with bee physiology are likely to convey information about the colony health. In this work, we present data from four UK-based hives collected through the winter of 2022/2023, with a focus on seeing if carbon dioxide can indicate when colonies are at risk of failure. These hives have been fitted with two Sensirion SCD41 photoacoustic non-dispersive infrared (NDIR) carbon dioxide sensors, one in the queen excluder, at the top of the brood box, and one in the crown board, at the top of the hive. Hive scales have been used to monitor the hive mass, and internal and external temperature sensors have been included. Embedded accelerometers in the central frame of the brood box have been used to measure vibrations. Data showed that the high daily variation in carbon dioxide continued throughout the coldest days of winter, and the vibrational data suggested that daily fanning may be responsible for restoring lower carbon dioxide levels. The process of fanning will draw in colder air to the hive at a time when the bees should be using their energy to maintain the colony temperature. Monitoring carbon dioxide may provide feedback, prompting human intervention when the colony is close to collapse, and a better understanding may contribute to discussions on future hive design. Full article