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38 pages, 27721 KB  
Review
Dimensionality-Controlled Structure and Magnetism in Nickel Ferrite (NiFe2O4): A Novelty-Oriented Theoretical Review
by Mahmoud AlGharram, Tariq AlZoubi, Yahia Makableh and Jestin Mandumpal
Magnetochemistry 2026, 12(6), 69; https://doi.org/10.3390/magnetochemistry12060069 - 16 Jun 2026
Viewed by 215
Abstract
Nickel ferrite (NiFe2O4) is one of the most studied inverse-spinel ferrites because it combines moderate saturation magnetization, comparatively high electrical resistivity, chemical stability, and broad synthesis flexibility. Yet the literature shows that the measured structure and magnetism of NiFe [...] Read more.
Nickel ferrite (NiFe2O4) is one of the most studied inverse-spinel ferrites because it combines moderate saturation magnetization, comparatively high electrical resistivity, chemical stability, and broad synthesis flexibility. Yet the literature shows that the measured structure and magnetism of NiFe2O4 are not intrinsic constants; they evolve strongly with dimensionality, size, thickness, strain state, cation distribution, surface spin disorder, and synthesis pathway. This review develops a unified theoretical and literature-based interpretation of how dimensionality reshapes the structural and magnetic behavior of NiFe2O4 across bulk ceramics, nanoparticles, one-dimensional nanostructures, polycrystalline thin films, and ultrathin epitaxial films. The review is anchored in the two uploaded nickel ferrite attachments and expanded using internet-sourced journal literature on spinel inversion, surface effects, mechanochemical synthesis, sputtered and pulsed laser deposited thin films, and epitaxial ultrathin-film anomalies. The central novelty of this article is the formulation of a dimensionality-dependent framework in which the observed magnetic response is governed by a competition among three coupled factors: (i) the cation-distribution function, which controls the A–B superexchange balance and therefore the net ferrimagnetic moment; (ii) the microstructural coherence function, which measures how crystallinity, strain, defects, and anti-phase boundaries preserve or degrade exchange continuity; and (iii) the surface/interface spin-order parameter, which quantifies the loss or reconfiguration of magnetic order at free surfaces and buried interfaces. Within this framework, bulk NiFe2O4 behaves as a near-equilibrium inverse spinel with relatively stable magnetization, whereas nanoscale NiFe2O4 experiences strong spin canting and finite-size suppression due to the growing fraction of disordered surface spins. Thin films introduce a distinct regime in which strain, texture, anti-phase boundaries, substrate mismatch, and growth kinetics determine both anisotropy and magnetization. In ultrathin epitaxial films, off-equilibrium cation redistribution and interface-controlled electronic reconstruction may even generate magnetization values far above bulk expectations. The review also compares major synthesis routes—solid-state reaction, sol–gel, co-precipitation, hydrothermal growth, reactive milling, combustion, pulsed laser deposition, and radio-frequency sputtering—and explains why each route biases the final dimensionality-dependent properties differently. A set of word-style equations is provided to formalize spinel inversion, finite-size suppression, anisotropy scaling, coercivity trends, and superparamagnetic crossover. Beyond summarizing the field, the review proposes a regime map linking dimensionality to characteristic structural defects and magnetic signatures, and it identifies unresolved questions concerning the true origin of enhanced magnetization in ultrathin NiFe2O4, the interplay between anti-phase boundaries and strain, and the distinction between intrinsic inversion changes and extrinsic substrate artifacts. The resulting article offers a submission-ready, originality-focused review that positions dimensionality as the master variable governing structure–magnetism correlations in nickel ferrite. Full article
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18 pages, 4083 KB  
Article
Mode Discrimination in Quasi-PT-Symmetric Surface-Emitting DFB Semiconductor Lasers with Separated Gain and Radiating-Grating Sections
by Haiyang Ji, Yang Chen, Guangliang Sun, Ziyuan Liao, Yunzhi Zhu, Yongtao Wu, Yufei Wang and Wanhua Zheng
Photonics 2026, 13(6), 567; https://doi.org/10.3390/photonics13060567 - 10 Jun 2026
Viewed by 324
Abstract
Surface-emitting distributed-feedback (SE-DFB) semiconductor lasers based on second-order gratings face a fundamental triple constraint: the spatial co-location of gain, grating feedback, and vertical radiation functions limits single-mode selectivity, surface extraction efficiency, and far-field beam quality simultaneously. We propose a quasi-parity-time (PT)-symmetric SE-DFB laser [...] Read more.
Surface-emitting distributed-feedback (SE-DFB) semiconductor lasers based on second-order gratings face a fundamental triple constraint: the spatial co-location of gain, grating feedback, and vertical radiation functions limits single-mode selectivity, surface extraction efficiency, and far-field beam quality simultaneously. We propose a quasi-parity-time (PT)-symmetric SE-DFB laser with separated gain and radiating-grating sections. In this design, the electrically injected gain section and the passive second-order grating section are placed in different regions along the cavity axis, thereby separating electrical injection from surface emission without epitaxial regrowth. Coupled-mode theory and two-dimensional finite-element simulations demonstrate that the resulting longitudinal non-Hermitian gain–loss asymmetry produces spatial-overlap-dependent threshold discrimination, enabling an isolated low-threshold lasing branch that remains separated from competing cavity modes over the investigated pump-parameter range. Under the HR–AR boundary condition, the proposed design achieves a threshold gain margin of Δg=12.4cm1, more than six times that of a conventional HR–AR DFB benchmark considered here, together with an upward surface extraction efficiency of 23.4% obtained from 2D FEM simulations. A simplified steady-state rate-equation estimate further suggests that the increased threshold margin can support strong side-mode suppression. The design imposes no regrowth requirement and is fully compatible with standard single-growth InP ridge-waveguide fabrication. Full article
(This article belongs to the Section Lasers, Light Sources and Sensors)
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21 pages, 5386 KB  
Article
Ultra-Stable Aqueous Zinc-Ion Batteries Enabled by Trace Ionic Liquid–Polar Solvent Synergistic Induction of Vertically Oriented (101) Facet Epitaxial Growth
by Fenglin Zhang, Die Chen, Luo Zhang, Chenxia Zhao, Ming Zhang, Xinyi Li, Ting He, Zimiao Lu, Xiaohong He, Gengpei Xia and Dingyu Yang
Inventions 2026, 11(3), 57; https://doi.org/10.3390/inventions11030057 - 4 Jun 2026
Viewed by 265
Abstract
Aqueous zinc-ion batteries (AZIBs) are promising for grid-scale storage due to their safety, low cost, and environmental benignity. However, water-dipole enrichment in the inner Helmholtz plane (IHP) of Zn anodes triggers hydrogen evolution, corrosion, and dendrites, limiting cycle life. We report a trace [...] Read more.
Aqueous zinc-ion batteries (AZIBs) are promising for grid-scale storage due to their safety, low cost, and environmental benignity. However, water-dipole enrichment in the inner Helmholtz plane (IHP) of Zn anodes triggers hydrogen evolution, corrosion, and dendrites, limiting cycle life. We report a trace “ionic liquid–polar solvent coupling” strategy: adding only 0.01 M EMIMBF4 and 0.03 M DMSO to 2 M ZnSO4 electrolyte. Hydrophobic EMIM+ adsorbs on the IHP to expel interfacial water, while BF4 enters the primary solvation shell and DMSO penetrates both first and second shells of Zn2+, forming a water-deficient coordination environment. This interfacial–solvation synergy suppresses parasitic reactions and directs preferentially oriented Zn deposition exclusively along the (101) facet, enabling dense vertical plating and in situ formation of a compact, inorganic-rich SEI (ZnCO3–ZnSO3–Zn(OH)2). Consequently, Zn||Zn cells cycle stably for >5362 h at 1 mA cm−2/1 mAh cm−2; Zn||Cu cells achieve 1300 cycles with 99.8% average Coulombic efficiency; and Zn||V2O5 full cells retain 326.4 mAh g−1 after 500 cycles. This work shows that minimal additive loading can simultaneously engineer the electrode–electrolyte interface and crystallographic deposition pathway, offering a simple yet robust design for ultra-stable AZIBs. Full article
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12 pages, 8377 KB  
Article
Molecular Beam Epitaxial Growth and Nonlinear Optical Signatures of Single-Domain Bi2Se3
by Eunice Y. Paik, George J. de Coster, Brandi Wooten, Greg Meissner, Blair C. Connelly and Patrick Taylor
Photonics 2026, 13(6), 529; https://doi.org/10.3390/photonics13060529 - 29 May 2026
Viewed by 262
Abstract
We report a new approach to enhance the photonic response of thin-film topological insulator Bi2Se3 by significantly reducing twin domains and antiphase disorder. The strategy employs closely lattice-matched trigonal substrates combined with surface structuring to preferentially seed a single rotational [...] Read more.
We report a new approach to enhance the photonic response of thin-film topological insulator Bi2Se3 by significantly reducing twin domains and antiphase disorder. The strategy employs closely lattice-matched trigonal substrates combined with surface structuring to preferentially seed a single rotational domain before epitaxy. Characterization using optical second harmonic generation (SHG), nonlinear optical tensor analysis, X-ray diffraction, and atomic force microscopy confirms the near-single crystal Bi2Se3 heteroepitaxial layers. These results show a clear six-fold symmetric sin2(3ϕ) SHG pattern at normal incidence, and a vanishingly small 100-to-1 peak-height ratio from X-ray pole-scans showing negligible twinning. These results show that this approach can yield near perfect single crystal heteroepitaxial Bi2Se3 whose photonic properties converge to those of bulk-grown single crystals. Full article
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8 pages, 3079 KB  
Communication
Improving 3C-SiC Quality Through Wafer-Bonded Switchback Epitaxy
by Gerard Colston, Kushani H. Perera, Arne Renz, Peter Gammon, Marina Antoniou, Philip A. Mawby and Vishal A. Shah
Materials 2026, 19(9), 1896; https://doi.org/10.3390/ma19091896 - 5 May 2026
Viewed by 491
Abstract
The crystallinity of cubic silicon carbide (3C-SiC) epilayers is improved through the use of a novel wafer bonding and regrowth technique resulting in a reduction in planar defects. The process involves the epitaxial growth of a 3–6 µm thick 3C-SiC seed on silicon [...] Read more.
The crystallinity of cubic silicon carbide (3C-SiC) epilayers is improved through the use of a novel wafer bonding and regrowth technique resulting in a reduction in planar defects. The process involves the epitaxial growth of a 3–6 µm thick 3C-SiC seed on silicon (Si), which is polished and bonded to a new handle wafer before the original substrate and defective interface region of the 3C-SiC epilayer are removed. Further epitaxial growth on this Bonded Switchback template results in higher quality 3C-SiC epilayers through the reduction in crystal mosaicity, stacking fault defects, and elimination of interface voids. The process could be applied to 3C-SiC grown on both on- and off-axis substrates, and the form of the new handle has no impact on the growth process, enabling this technology to be applied to sapphire or hexagonal 4H-SiC substrates. The use of such substrates would overcome the thermal budget limitations of Si substrates for 3C-SiC heteroepitaxy and ion implantation. Bonded Switchback can improve material quality for applications in power electronics, as well as see the heterogeneous integration of 3C-SiC into other device structures, potentially leading to a new range of hybrid 3C-SiC/Si devices without the high density of defects observed at the interface between these two materials. Full article
(This article belongs to the Section Thin Films and Interfaces)
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17 pages, 1928 KB  
Article
C-Axis Oriented LiNbO3 Thin Film Grown by Chemical Beam Epitaxy for Surface Acoustic Wave Device Applications
by Nikolay Smagin, Thanh Ngoc Kim Bui, Zakariae Oumekloul, Rahma Moalla, William Maudez, Estelle Wagner, Marc Duquennoy, Rayen Kalai Mathlouthi, Yves Deblock, Hatem Dahmani, Denis Remiens, Julien Carlier and Giacomo Benvenuti
Sensors 2026, 26(9), 2858; https://doi.org/10.3390/s26092858 - 2 May 2026
Viewed by 1981
Abstract
High-frequency surface acoustic wave (SAW) devices require piezoelectric thin films combining strong electromechanical coupling, high acoustic velocity, and compatibility with scalable fabrication. Lithium niobate (LiNbO3) is a promising material, but the growth of high-quality thin films remains challenging because of lithium [...] Read more.
High-frequency surface acoustic wave (SAW) devices require piezoelectric thin films combining strong electromechanical coupling, high acoustic velocity, and compatibility with scalable fabrication. Lithium niobate (LiNbO3) is a promising material, but the growth of high-quality thin films remains challenging because of lithium volatility and process-control issues. In this work, chemical beam epitaxy (CBE) was investigated as an alternative route for the deposition of c-axis-oriented LiNbO3 thin films on C-plane sapphire at a relatively low growth temperature of 400 °C. Structural characterization confirmed high crystalline quality, with clear (006) and (0012) XRD reflections and a rocking-curve full width at half maximum of 0.04°. To evaluate acoustic performance, a SAW delay line and a one-port resonator were fabricated on 350 nm thick films using e-beam lithography. The devices operated in the 1–3 GHz range and exhibited electromechanical coupling factors of about 0.3% for the Rayleigh mode at 1.7 GHz and 3% for the Sezawa mode at 2.75 GHz. Propagation velocities ranged from 5094 to 8250 m/s, and the Rayleigh-mode resonator quality factor reached about 500. These results demonstrate the feasibility of CBE-grown LiNbO3 films for SAW device applications. Full article
(This article belongs to the Special Issue Smart Sensors Based on Optoelectronic and Piezoelectric Materials)
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17 pages, 4120 KB  
Article
Initial and Middle Stages of Quantum Dots Growth: From Dynamics of Superstructures to Island-Size Distributions
by Olzhas Kukenov, Vladimir Dirko, Kirill Lozovoy and Andrey Kokhanenko
Nanomaterials 2026, 16(9), 510; https://doi.org/10.3390/nano16090510 - 23 Apr 2026
Viewed by 926
Abstract
The dynamics of initial layer-by-layer growth and subsequent nucleation of quantum dots of Si and Ge on Si(001) were studied combining reflection high-energy electron diffraction, scanning electron microscopy and atomic force microscopy. It was shown that the processes occurring at the initial stage [...] Read more.
The dynamics of initial layer-by-layer growth and subsequent nucleation of quantum dots of Si and Ge on Si(001) were studied combining reflection high-energy electron diffraction, scanning electron microscopy and atomic force microscopy. It was shown that the processes occurring at the initial stage determine further growth of the heterostructure and final shape and density of nanoislands. The mechanisms of terrace formation, occurrence and dynamics of dimer rows of the 2 × N superstructure, and effects of temperature on the growth characteristics were described. The obtained experimental dependences show the critical relationship between the synthesis parameters (growth temperature), epitaxial growth processes and the characteristics of the resulting nanoislands. The fundamental studies conducted make it possible to create self-organizing quantum dots of a given size and density for advanced optoelectronics, including infrared photosensitive elements and single-photon detectors. Full article
(This article belongs to the Section Synthesis, Interfaces and Nanostructures)
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34 pages, 1888 KB  
Review
Heteroepitaxial 3C-SiC for MEMS Applications
by Angela Garofalo, Annamaria Muoio, Luca Belsito, Sergio Sapienza, Matteo Ferri, Alberto Roncaglia and Francesco La Via
Micromachines 2026, 17(4), 502; https://doi.org/10.3390/mi17040502 - 21 Apr 2026
Cited by 1 | Viewed by 1219
Abstract
Silicon carbide (SiC) has emerged as a highly attractive material for microelectromechanical systems (MEMS) operating in harsh environments, owing to its outstanding mechanical, thermal, and chemical properties. This review provides a comprehensive overview of the advantages and limitations of SiC-based MEMS, with particular [...] Read more.
Silicon carbide (SiC) has emerged as a highly attractive material for microelectromechanical systems (MEMS) operating in harsh environments, owing to its outstanding mechanical, thermal, and chemical properties. This review provides a comprehensive overview of the advantages and limitations of SiC-based MEMS, with particular emphasis on the strong interdependence between material structure, mechanical properties, and epitaxial growth processes. The role of defects, residual stress, and crystal quality is discussed in relation to device performance and reliability. Special attention is devoted to cubic SiC grown on silicon substrates, highlighting how growth-induced features influence the mechanical response of micromachined structures. Furthermore, a detailed analysis of the quality factor (Q-factor) is presented for 3C-SiC (111)/Si resonators, including the development of analytical models and their validation through numerical simulations performed using COMSOL Multiphysics (Version 6.1). The necessity of incorporating anisotropic loss factors in numerical modeling is demonstrated to be essential for accurately describing the experimentally observed behavior. This review aims to provide design guidelines and modeling strategies for the optimization of SiC MEMS, supporting their further development for high-performance and extreme-environment applications, including pressure sensors, mechanical resonators and high-stress-tolerant sensors. Full article
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10 pages, 2420 KB  
Article
Performance Investigation of AlGaInP Light-Emitting Diodes
by Weiwei Sun, Shaobo Ge, Junyan Li, Lujun Shen, Xinyu Zhao, Ronghua Shi, Jin Zhang and Yingxue Xi
Nanomaterials 2026, 16(8), 480; https://doi.org/10.3390/nano16080480 - 17 Apr 2026
Viewed by 551
Abstract
Previous studies have shown that the external quantum efficiency (EQE) of conventional red Micro-Light emitting diodes(Micro-LEDs) decreases markedly with reducing chip size. This degradation is generally attributed to enhanced non-radiative recombination at sidewall defects, which leads to increased carrier loss in size-scaled LEDs. [...] Read more.
Previous studies have shown that the external quantum efficiency (EQE) of conventional red Micro-Light emitting diodes(Micro-LEDs) decreases markedly with reducing chip size. This degradation is generally attributed to enhanced non-radiative recombination at sidewall defects, which leads to increased carrier loss in size-scaled LEDs. In this work, AlGaInP quaternary semiconductor epitaxial wafers incorporating multiple quantum wells (MQWs) with different well-layer strain states were grown by metal–organic chemical vapor deposition (MOCVD). Through wafer bonding, photolithography, etching, and metal evaporation, these epitaxial structures were fabricated into Micro-LED arrays with single-pixel pitches of 10, 20, 50, and 100 μm. The experimental results reveal that, with increasing indium (In) composition in the GaInP well layers—corresponding to a gradual increase in lattice mismatch (Δa/a) from 0% to 1%—smaller-sized Micro-LED arrays exhibit superior EQE performance. For devices with a pixel pitch of 10 μm, the EQE of Micro-LED arrays with a 1% lattice mismatch in the well layer is approximately three times higher than that of lattice-matched (0%) counterparts. In contrast, for devices with a pixel pitch of 100 μm, the EQE of lattice-matched (0%) Micro-LED arrays is about 1.3 times higher than that of devices with a 1% lattice mismatch. These results indicate that, to achieve maximum EQE in Micro-LEDs, the strain state of the MQW-layer material must be carefully considered as a priority factor. Optimal device performance requires appropriate matching between LED size and the well-layer growth strain. Full article
(This article belongs to the Section Nanoelectronics, Nanosensors and Devices)
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23 pages, 11106 KB  
Article
Design of CoNiCrFeCu-xSc High-Entropy Alloy Fillers for Braze-Welding of WC-Co to Steel
by Peiquan Xu, Shicheng Sun, Benben Li and Leijun Li
Materials 2026, 19(8), 1606; https://doi.org/10.3390/ma19081606 - 16 Apr 2026
Cited by 1 | Viewed by 429
Abstract
Efficient joining of hard metals to steels is crucial for supporting sustainable manufacturing under emissions strategies to minimize CO2. CoNiCrFeCu high-entropy alloy containing scandium (Sc) was designed as a filler for laser braze-welding of WC-Co and steel. The designed compositions with [...] Read more.
Efficient joining of hard metals to steels is crucial for supporting sustainable manufacturing under emissions strategies to minimize CO2. CoNiCrFeCu high-entropy alloy containing scandium (Sc) was designed as a filler for laser braze-welding of WC-Co and steel. The designed compositions with different Sc levels were melted and cast in a high-vacuum non-consumable arc furnace. The results showed that the as-cast microstructure was a complex mixture of a networked Ni2Si, elongated Cr-Fe-Co solid-solution phase, and Fe-Ni-Co-Cu solid-solution phase. Scandium was shown to have formed compounds with nickel/cobalt and copper. The TG-DSC analysis confirmed that the melting points of the designed compositions were between 973.7 °C and 981.5 °C. The maximum spreading area of the CoNiCrFeCu-0.9Sc composition on AISI 1045 steel was 64.83 mm2, and on the WC-Co cermet it was 78.63 mm2. The interface between the fusion zone and AISI 1045 steel exhibited an epitaxial growth of dendrites from the steel base metal. The interface between WC-Co and the fusion zone exhibited a partial penetration of brazing filler into the Co matrix, forming a metallurgical bonding between the dissimilar materials. Sc, as an alloying element in the filler metal, enhanced the bond formation because it decreased the solidus temperature and increased wetting. Full article
(This article belongs to the Section Metals and Alloys)
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9 pages, 1597 KB  
Communication
High-Gain AlInAsSb SACM Avalanche Photodiode for SWIR Detection at Room Temperature
by Ming Liu, Shupei Jin, Dongliang Zhang, Songlin Yu, Mingxin Yao, Xiaoning Guan, Feng Zhou and Pengfei Lu
Photonics 2026, 13(4), 374; https://doi.org/10.3390/photonics13040374 - 14 Apr 2026
Viewed by 484
Abstract
We report the design, epitaxial growth, and room-temperature operation of a high-gain AlInAsSb-based avalanche photodiode (APD) for short-wavelength infrared (SWIR) detection at 1.55 µm. The device employs SAGCM structure to confine the electric field within the multiplication region while suppressing dark current. High-quality [...] Read more.
We report the design, epitaxial growth, and room-temperature operation of a high-gain AlInAsSb-based avalanche photodiode (APD) for short-wavelength infrared (SWIR) detection at 1.55 µm. The device employs SAGCM structure to confine the electric field within the multiplication region while suppressing dark current. High-quality AlInAsSb layers were grown on GaSb substrates by molecular beam epitaxy using a digital alloy approach, achieving excellent surface morphology (Ra < 0.2 nm) and uniform superlattice periodicity. Electrical characterization reveals a well-defined breakdown voltage near −17 V and a peak internal multiplication gain of 200 at 300 K under 0.2 mW illumination at 1550 nm—among the highest gains reported to date for antimonide-based APDs operating at room temperature. Variable-temperature dark current analysis indicates a transition from tunneling-dominated to thermally generated dark current as temperature increases from 100 K to 300 K. These results demonstrate the strong potential of AlInAsSb SAGCM APDs for eye-safe, high-sensitivity applications in LIDAR, free-space optical communication, and low-light SWIR imaging. Full article
(This article belongs to the Section Lasers, Light Sources and Sensors)
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15 pages, 16090 KB  
Article
Effect of the Annealing Treatment on the Microstructure and Properties of TC4 Titanium Alloy TIG and Laser-Welded Joints
by Yansong Wang, Yulang Xu, Jingyong Li, Xuzhi Lan, Dan Song and Yanxin Qiao
Metals 2026, 16(4), 424; https://doi.org/10.3390/met16040424 - 13 Apr 2026
Viewed by 505
Abstract
This study compares the microstructural evolution and mechanical properties of TC4 (Ti-6Al-4V) titanium alloy joints welded by Tungsten Inert Gas (TIG) and laser processes, following a post-weld annealing treatment at 650 °C for 2 h. Distinct microstructures were obtained: the TIG-welded joint developed [...] Read more.
This study compares the microstructural evolution and mechanical properties of TC4 (Ti-6Al-4V) titanium alloy joints welded by Tungsten Inert Gas (TIG) and laser processes, following a post-weld annealing treatment at 650 °C for 2 h. Distinct microstructures were obtained: the TIG-welded joint developed a heterogeneous mixture of short-rod α and lamellar β, while the laser-welded joint formed a more homogeneous equiaxed α structure with uniformly distributed β-phase nanoparticles. Electron backscatter diffraction (EBSD) results confirmed that the annealing treatment significantly weakened the strong welding-induced texture and disrupted the epitaxial growth mode of columnar grains. Mechanical testing demonstrated that annealing improved the strength-toughness balance, but the extent and mechanism differed between the two processes. For the TIG-welded joint, the ultimate tensile strength slightly decreased, while elongation and impact toughness increased by 18% and 10.4%, respectively. In contrast, the laser-welded joint maintained its original strength while achieving greater improvements in ductility and toughness, with elongation and impact toughness increasing by 20% and 15.2%, respectively. This divergence is attributed to insufficient recrystallization and the persistence of residual coarse grains, limiting the TIG joint’s performance. However, in the laser-welded joint, the pinning effect of β-phase nanoparticles and associated grain refinement enhanced ductility without compromising strength. Full article
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10 pages, 5251 KB  
Article
Temperature-Dependent Sn Incorporation and Defect Formation in Pseudomorphic SiSn Layers on Si (001) via Molecular Beam Epitaxy
by Diandian Zhang, Nirosh M. Eldose, Dinesh Baral, Hryhorii Stanchu, Mourad Benamara, Wei Du, Gregory J. Salamo and Shui-Qing Yu
Crystals 2026, 16(4), 262; https://doi.org/10.3390/cryst16040262 - 13 Apr 2026
Viewed by 600
Abstract
SiSn alloys have attracted growing interest for group-IV bandgap engineering, although their epitaxial growth remains challenging due to the extremely low equilibrium solubility of Sn in Si. In this work, fully strained (pseudomorphic) SiSn epitaxial layers were grown on Si (001) substrates by [...] Read more.
SiSn alloys have attracted growing interest for group-IV bandgap engineering, although their epitaxial growth remains challenging due to the extremely low equilibrium solubility of Sn in Si. In this work, fully strained (pseudomorphic) SiSn epitaxial layers were grown on Si (001) substrates by means of molecular beam epitaxy. A systematic investigation reveals a strong inverse correlation between growth temperature and Sn incorporation efficiency. Despite a constant Sn flux, the incorporated Sn composition decreases from 5.5% to 3.2% as the growth temperature increases, indicating a pronounced temperature dependence of Sn incorporation. Reflection high-energy electron diffraction indicates a gradual transition of the growth from two-dimensional to three-dimensional with increasing film thickness. Structural characterization by means of X-ray diffraction, atomic force microscopy, and transmission electron microscopy confirms the pseudomorphic growth and smooth surface morphology and reveals twins and stacking faults near the surface region. These results establish a quantitative reference for SiSn growth kinetics and provide guidance for future studies of SiSn and SiGeSn alloys in silicon-compatible electronic and optoelectronic applications. Full article
(This article belongs to the Section Inorganic Crystalline Materials)
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8 pages, 1950 KB  
Article
Controllable Growth of Ordered In-Plane Ge Hut Wires on Trench-Patterned Si Substrate
by Fei Gao, Ming Ming, Jie-Yin Zhang and Jian-Jun Zhang
Nanomaterials 2026, 16(7), 423; https://doi.org/10.3390/nano16070423 - 31 Mar 2026
Viewed by 520
Abstract
The controllable growth of in-plane Ge nanowires provides alternative material foundations for the scalability of Ge-based semiconductor qubit devices. Here, ordered in-plane Ge hut wires with controllable size are grown on the trench-patterned Si substrate by molecular beam epitaxy. By tuning the thickness [...] Read more.
The controllable growth of in-plane Ge nanowires provides alternative material foundations for the scalability of Ge-based semiconductor qubit devices. Here, ordered in-plane Ge hut wires with controllable size are grown on the trench-patterned Si substrate by molecular beam epitaxy. By tuning the thickness of the SiGe alloy layer, which acts as strain buffered layer, GeSi mounds with controllable size are achieved. Subsequently, through the deposition of a Ge layer followed by in situ annealing, we realize the size-controllable growth of the Ge nanowire with a height from 1.8 nm to 4.0 nm, as characterized by AFM and TEM techniques. These size-tunable and catalyst-free Ge hut wires provide a promising pathway toward the fabrication of integrated nanowire-based quantum devices. Full article
(This article belongs to the Special Issue Preparation and Characterization of Nanomaterials)
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28 pages, 21159 KB  
Article
Defect Evolution, Texture Modification, and T6 Response of LPBF AA7075 Reinforced with AlCoCrFeNi2.1 Eutectic HEA Particles
by Qiongqi Xu, Baljit Singh Bhathal Singh, Yi Zhang, Mohd Shahriman Adenan, Shengcong Zeng and Shixi Gan
Coatings 2026, 16(3), 370; https://doi.org/10.3390/coatings16030370 - 15 Mar 2026
Cited by 1 | Viewed by 900
Abstract
Laser powder bed fusion (LPBF) of AA7075 is severely constrained by a narrow process window and susceptibility to defect formation (hot cracking and porosity), which often dominates performance. In this study, 5 wt.% AlCoCrFeNi2.1 high-entropy alloy (HEA) particles, volumetric energy density (VED [...] Read more.
Laser powder bed fusion (LPBF) of AA7075 is severely constrained by a narrow process window and susceptibility to defect formation (hot cracking and porosity), which often dominates performance. In this study, 5 wt.% AlCoCrFeNi2.1 high-entropy alloy (HEA) particles, volumetric energy density (VED = 74–222 J·mm−3), and subsequent T6 heat treatment were systematically investigated to reveal their combined effects on defect structure, crystallographic texture/substructure, and tensile behaviour. Quantitative EBSD shows a measurable grain refinement in the as-built state (average grain size 13.44 → 11.80 µm, ~12%) accompanied by a pronounced weakening of the <001> fibre texture (maximum MRD 4.94 → 2.38), indicating disrupted epitaxial growth and a more dispersed orientation distribution. After T6, the reinforced alloy retains a higher low-angle boundary fraction (31.62% vs. 24.17% in unreinforced AA7075) and a higher kernel average misorientation (0.80° vs. 0.60°), consistent with particle-stabilised substructure retention and retarded recovery. Across all VEDs, AA7075-HEA exhibits higher microhardness (compared with AA7075, the addition of HEA increases the hardness by roughly 20–50 HV) and tensile strength, with the intermediate VED (140.74 J·mm−3, T6 states) yielding the best performance. While macroscopic cracking is not fully eliminated, the results clarify that HEA-enabled texture/substructure modifications can contribute to enhanced defect tolerance and are more effectively translated into tensile performance when the as-built defect severity is controlled. These findings provide quantitative insights into defect–microstructure–property coupling in LPBF AA7075-HEA composites from as-built to T6 states. Full article
(This article belongs to the Special Issue Innovations, Applications and Advances of High-Entropy Alloy Coatings)
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