Search Results (18)

Pastes were prepared using dendritic Cu particles as fillers, and a compression die attachment process was implemented to establish a pure Cu joint using low-cost materials and high-speed sinter bonding. We aimed to grow an oxidation layer on the particle surface to improve sinter-bondability. Because the growth of the oxidation layer by general thermal oxidation methods makes it difficult to use as a filler owing to agglomeration between particles, we induced oxidation growth by wet surface treatment. Consequently, when the oxidation layer was appropriately grown by surface treatment using an acetic acid–ethanol solution, we obtained an improved joint strength, approximately 2.8 times higher than the existing excellent result based on a bonding time of 10 s. The joint formed in just 10 s at 300 °C in the air under 10 MPa compression showed a shear strength of 28.4 MPa. When the bonding time was increased to 60 s, the joint exhibited a higher strength (35.1 MPa) and a very dense microstructure without voids. These results were attributed to the acceleration of sintering by the in situ formation of more Cu nanoparticles, which effectively reduced the increased oxide layers in the particles using a reducing solvent. Full article

This paper reviews sintered silver (s-Ag) die-attach materials for wide band gap (WBG) semiconductor packaging. WBG devices that die-attach with s-Ag have attracted a lot of attention owing to their low energy loss and high temperature operation capabilities. For their practical operation, a reliability design should be established based on the failure of physics of the s-Ag die layer. This paper first focuses on the material characteristics of the s-Ag and tensile mechanical properties. Then, the s-Ag die-attach reliability is assessed with high-temperature storage, power cycling, and thermal shock tests. Each fracture mode was discussed by considering both the fracture surface analysis results and its mechanical properties. Finally, the effective reliability design parameters of the s-Ag die layer are introduced. Full article

High-moisture extrusion of plant proteins to create meat-like structures is a process that has met with increasing attention in the recent past. In the process, the proteins are thermomechanically stressed in the screw section of the extruder, and the resulting protein gel is structured in the attached cooling die. Various protein sources, notably soy protein isolate (SPI) and wheat gluten, are used to form gels with different networks: SPI creates a physical, non-covalent network, while gluten forms a chemical, covalent one. The food industry frequently adds weak acids to modify taste and shelf life. However, it is known that a change in pH affects the gelation behavior of proteins because the repulsive forces within and between the proteins change. The research reported here was carried out to investigate for the two proteins mentioned the influence of pH modification by the addition of citric acid and acetic acid on gel formation and the meat-like structures produced. For this purpose, materials and parameters were screened using a closed cavity rheometer, followed by extrusion trials at pH 7.36–4.14 for SPI and pH 5.83–3.37 for gluten. The resulting extrudates were analyzed optically and mechanically, and protein solubility was tested in a reducing buffer. For both protein systems, the addition of acid results in less pronounced meat-like structures. At decreasing pH, the complex viscosity of SPI increases (from 11,970 Pa·s to 40,480 Pa·s at 100 °C), the generated gel becomes stronger (strain decreased from 0.62 to 0.48 at 4.5 × 10⁵ Pa), and the cross-linking density grows. For gluten, a decreasing pH results in altered reaction kinetics, a more deformable resulting gel (strain increased from 0.7 to 0.95 at 4.5 × 10⁵ Pa), and a decreased cross-linking density. Solubility tests show that no additional covalent bonds are formed with SPI. With gluten, however, the polymerization reaction is inhibited, and fewer disulfide bonds are formed. Full article

The thermomechanical properties of materials within die-attach joints play an essential role in assessing the reliability of high-power modules. Ag-In transient liquid phase (TLP) bonding serves as an alternative method for die attachment. However, relevant material data for the ζ (Ag₃In) phase, one of the Ag-In intermetallic compound (IMC) products of TLP bonding, are limited. This paper proposes an approach to fabricate a densified and pure bulk sample of the ζ (Ag₃In) phase. The thermomechanical properties of the ζ (Ag₃In) phase were subsequently investigated at elevated temperatures and compared to those of other IMCs frequently observed in die-attach joints. As the temperature increased from 30 °C to 200 °C, the hardness of the ζ (Ag₃In) phase decreased linearly from 1.78 GPa to 1.46 GPa. Similarly, the Young’s modulus also decreased linearly from 82.3 GPa to 66.5 GPa. These properties rank among the lowest levels compared to those of other IMCs. The average coefficient of thermal expansion within the temperature range of 70 °C to 250 °C was approximately 18.63 ± 0.61 μm/m/°C, placing the ζ (Ag₃In) phase at a moderate level. When considering its potential for mitigating thermal stress, these combined properties render the ζ (Ag₃In) phase an appropriate material choice for die-attach joints compared to other IMCs. Full article

Nano-Ag paste is one of the most widely used die-attachment materials in modern electronic devices, which are gaining continuously increasing application in transportation industries. The nano-Ag film in a pre-formed dimension and free from the use of chemical dispersing agents has been proposed to be a promising alternative to nano-Ag paste for the die-attachment application. Although the bonding mechanisms of Nano-Ag paste have been extensively studied, little is known about the relationship between the microstructure and mechanical properties of low-temperature-sintered Ag/nano-Ag film/Ag joints. In this work, the influences of temperature, pressure, and dwell time at peak temperature on the microstructure and the shear strength of low-temperature-sintered Ag/nano-Ag film/Ag joints were systematically investigated. Mechanical properties tests indicate that both temperature and pressure have pronounced effects on the bonding strength of sintered Ag/nano-Ag film/Ag joints. TEM and hot nanoindentation characterizations further reveal that the sintering temperature plays the most determinant role in the coarsening of nano-Ag film and, hence, the bonding and fracture behaviors of Ag/nano-Ag film/Ag joints sintered at 210–290 °C. The diffusion-induced coarsening of nano-Ag particles can be activated, but remains sluggish at 250 °C, and the mechanical integrity of sintered joints is circumscribed by the interfacial bonding between nano-Ag film and Ag substrate after sintering at 290 °C. Full article

The present work concerns the intermetallic compound (IMC) existing in the Ag–Sn system and its potential use in electronics as attachment materials allowing the adhesion of the chip to the substrate forming the power module. First, we present the synthesis protocol in polyol medium of a compound with the chemical formula Ag₅Sn_0.9 belonging to the solid solution of composition located between 9 and 16 at.% Sn, known as solid solution ζ (or ζ-Ag₄Sn). This phase corresponds to the peritectic invariant point at 724 °C. Differential thermal analysis and X-ray dispersive analysis confirm the single-phased (monocrystalline) nature of the Ag₅Sn_0.9 powder issued after synthesis. Scanning electron microscopy shows that Ag₅Sn_0.9 particles are spherical, and range in submicronic size of around 0.18 μm. X-ray diffraction analysis reveals that the ζ phase mostly exists under the two allotropic varieties (orthorhombic symmetry and hexagonal symmetry) with however a slight excess of the hexagonal variety (60% for the hexagonal variety and 40% for the orthorhombic variety). The lattice parameters resulting from this study for the two allotropic varieties are in good agreement with the Hume-Rothery rules. Full article

Resin-bonded fixed dental prostheses (RBFDP) are minimally invasive alternatives to traditional full-coverage fixed partial dentures as they rely on resin cements for retention. This study compared and evaluated the tensile bond strength of three different resin-bonded bridge designs, namely, three-unit fixed-fixed, two-unit cantilever single abutment, and three-unit cantilever double-abutted resin-bonded bridge. Furthermore, the study attempted to compare the tensile bond strengths of the Maryland and Rochette types of resin-bonded bridges. Based on the inclusion and exclusion criteria, a total of seventy-five extracted maxillary incisors were collected and later were mounted on the acrylic blocks. Three distinct resin-bonded metal frameworks were designed: three-unit fixed-fixed (n = 30), two-unit cantilever single abutment (n = 30), and a three-unit cantilever double abutment (n = 30). The main groups were further divided into two subgroups based on the retainer design such as Rochette and Maryland. The different prosthesis designs were cemented to the prepared teeth. Later, abutment preparations were made on all specimens keeping the preparation as minimally invasive and esthetic oriented. Impression of the preparations were made using polyvinyl siloxane impression material, followed by pouring cast using die stone. A U-shaped handle of 1.5 mm diameter sprue wax with a 3 mm hole in between was attached to the occlusal surface of each pattern. The wax patterns were sprued and cast in a cobalt–chromium alloy. The castings were cleaned by sandblasting, followed by finishing and polishing. Lastly, based on the study group, specimens for Rochette bridge were perforated to provide mechanical retention between resin cement and metal, whereas the remaining 15 specimens were sandblasted on the palatal side to provide mechanical retention (Maryland bridge). In order to evaluate the tensile bond strength, the specimens were subjected to tensile forces on a universal testing machine with a uniform crosshead speed. The fixed-fixed partial prosthesis proved superior to both cantilever designs, whereas the single abutment cantilever design showed the lowest tensile bond strength. Maryland bridges uniformly showed higher bond strengths across all framework designs. Within the limitations of this study, the three-unit fixed-fixed design and Maryland bridges had greater bond strengths, implying that they may demonstrate lower clinical failure than cantilever designs and Rochette bridges. Full article

Sintered silver paste is widely used as the die-attachment material for power semiconductors. However, sintered silver joints encounter problems, such as severe coarsening of sintered pores and oxidation issues, in harsh high-temperature environments. These lead to the deterioration of the die-attachment joints. In this paper, a novel method of sintering silver joints is demonstrated, where silver–indium alloy paste is used to improve the reliability of sintered Ag joints. The silver–indium (Ag–In) alloy paste was fabricated through mechanical alloying using the ball-milling technique. The well-bonded sintered Ag–In alloy joints inhibited pore coarsening better than pure sintered Ag joints and significantly enhanced the mechanical properties at high operating temperatures. Lastly, an oxidation mechanism for the sintered joint was proposed, and strategies to prevent such high-temperature oxidation were discussed. Full article

Solder joints in electronic packages are frequently exposed to thermal cycling in both real-life applications and accelerated thermal cycling tests. Cyclic temperature leads the solder joints to be subjected to cyclic mechanical loading and often accelerates the cracking failure of the solder joints. The cause of stress generated in thermal cycling is usually attributed to the coefficients of thermal expansion (CTE) mismatch of the assembly materials. In a die-attach structure consisting of multiple layers of materials, the effect of their CTE mismatch on the thermal stress at a critical location can be very complex. In this study, we investigated the influence of different materials in a die-attach structure on the stress at the chip–solder interface with the finite element method. The die-attach structure included a SiC chip, a SAC solder layer and a DBC substrate. Three models covering different modeling scopes (i.e., model I, chip–solder layer; model II, chip–solder layer and copper layer; and model III, chip–solder layer and DBC substrate) were developed. The 25–150 °C cyclic temperature loading was applied to the die-attach structure, and the change of stress at the chip–solder interface was calculated. The results of model I showed that the chip–solder CTE mismatch, as the only stress source, led to a periodic and monotonic stress change in the temperature cycling. Compared to the stress curve of model I, an extra stress recovery peak appeared in both model II and model III during the ramp-up of temperature. It was demonstrated that the CTE mismatch between the solder and copper layer (or DBC substrate) not only affected the maximum stress at the chip–solder interface, but also caused the stress recovery peak. Thus, the combined effect of assembly materials in the die-attach structure should be considered when exploring the joint thermal stresses. Full article

An emerging topic is electrical discharge (ED) coating with its application on complex shapes and cavities to repair components or act as functional coatings. Because it is a variant process of an electric discharge machine (EDM) with the ability to coat on electrically conductive substrates, there is a possibility that next-generation electrical discharge machining components may exploit the attachment phenomenon to enhance recast layer properties. Previously, researchers have obtained ED coating by mixing the powder in a dielectric medium and/or by using powder metallurgy electrodes. In this work, primarily, an insight in the formation of ED coating on-die sinks electrical discharge machine, using conventional electrode materials viz., bronze on titanium alloy (Ti-6Al-4V) is made. The bronze electrode on the titanium substrate obtained a crack-free copper coating of ~20 microns thickness. In order to perform the experiments, three combinations were made using five parameters: current (Amps), ton (µs), Toff (µs), duty cycle (%), and flushing pressure as constant (bar). After obtaining the coating, a combination of input parameters was selected by optimizing the output performance parameters, viz., the electrical discharge deposition rate, coating thickness, micro-cracks, and elemental coating composition. Secondarily, different optimization techniques viz., grey relational analysis, the technique for order of preferences by similarity to ideal solution, −nD angle method and information divergence method were implemented to find out the suitable combination of parameters where the latter two methods were introduced for the first time in this area of EDM optimization. A study was conducted to check whether the latter two methods are optimization techniques or multi-criteria decision-making techniques. The optimization of existing reactor types and the development of new reactors in wastewater treatment through EDC, by which energy could be saved by replacing the conventional techniques. Full article

Polymer materials attract more and more interests for a biocompatible package of novel implantable medical devices. Medical implants need to be packaged in a biocompatible way to minimize FBR (Foreign Body Reaction) of the implant. One of the most advanced implantable devices is neural prosthesis device, which consists of polymeric neural electrode and silicon neural signal processing integrated circuit (IC). The overall neural interface system should be packaged in a biocompatible way to be implanted in a patient. The biocompatible packaging is being mainly achieved in two approaches; (1) polymer encapsulation of conventional package based on die attach, wire bond, solder bump, etc. (2) chip-level integrated interconnect, which integrates Si chip with metal thin film deposition through sacrificial release technique. The polymer encapsulation must cover different materials, creating a multitude of interface, which is of much importance in long-term reliability of the implanted biocompatible package. Another failure mode is bio-fluid penetration through the polymer encapsulation layer. To prevent bio-fluid leakage, a diffusion barrier is frequently added to the polymer packaging layer. Such a diffusion barrier is also used in polymer-based neural electrodes. This review paper presents the summary of biocompatible packaging techniques, packaging materials focusing on encapsulation polymer materials and diffusion barrier, and a FEM-based modeling and simulation to study the biocompatible package reliability. Full article

The potential of an innovation for establishing a simultaneous mechanical, thermal, and electrical connection between two metallic surfaces without requiring a prior time-consuming and expensive surface nanoscopic planarization and without requiring any intermediate conductive material has been explored. The method takes advantage of the intrinsic nanoscopic surface roughness on the interconnecting surfaces: the two surfaces are locked together for electrical interconnection and bonding with a conventional die bonder, and the connection is stabilized by a dielectric adhesive filled into nanoscale valleys on the interconnecting surfaces. This “nano-locking” (NL) method for chip interconnection and bonding is demonstrated by its application for the attachment of high-power GaN-based semiconductor dies to its device substrate. The bond-line thickness of the present NL method achieved is under 100 nm and several hundred times thinner than those achieved using mainstream bonding methods, resulting in a lower overall device thermal resistance and reduced electrical resistance, and thus an improved overall device performance and reliability. Different bond-line thickness strongly influences the overall contact area between the bonding surfaces, and in turn results in different contact resistance of the packaged devices enabled by the NL method and therefore changes the device performance and reliability. The present work opens a new direction for scalable, reliable, and simple nanoscale off-chip electrical interconnection and bonding for nano- and micro-electrical devices. Besides, the present method applies to the bonding of any surfaces with intrinsic or engineered surface nanoscopic structures as well. Full article

Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed interconnect and, additionally, as a copper clip-attach. The electrical and thermal performances of the copper-sinter paste interconnections (“sinterconnects”) were compared to a system with wire bonds. The results indicate comparable characteristics of the sinterconnect structures to the wire-bonded ones. Moreover, the performance of copper sinterconnects in a power module was further quantified at higher load currents via finite element analysis. It was identified that the full-area thermal and electrical contact facilitated by the planar sinterconnects can reduce ohmic losses and enhance the thermal management of the power packages. Full article

This study aimed to develop an extrusion and pultrusion system for producing carbon fiber-filled thermoplastic pellets. The extruder delivers a plastic melt to an impregnation die in sufficient volume and is pulled out along with the fibers. The fibers pass in a sideways stretched condition through spreader pins attached in the melt pool, which can then be wetted optimally. The wetting effect was also improved by immersing fiber in a coupling agent solution at an elevated temperature before feeding to the extruder die. For machine performance testing, polypropylene was used as a matrix resin with the following parameters: a screw speed of 5 rpm, a die temperature of 210 °C, and a pulling speed of 56 mm/s. The pull-out test was conducted to assess the interfacial shear strength (IFSS) between fibers and matrix. Scanning electron microscopy (SEM) was applied to characterize the quality of fiber impregnation. SEM characterized a good bonding performance between carbon fiber and the matrix. The average IFSS of the results indicated a good resistance of fiber–matrix bonding against a pulling force. It proved that the combination of the extrusion–pultrusion system can produce high-quality filaments as a raw material of composite pellets. Full article

Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging. Full article