Search Results (109)

This paper investigates the suppression of the cohesive cracking mode (CCM) in the sintered silver (s-Ag) die layer by intentionally introducing anisotropic porosity through two press sintering methods. Full press (FP) and local press (LP) bonding represent the s-Ag formed by pressing the die-attached assemblies (DAAs) on either the entire top surface or only on the silicon carbide (SiC) top surface, respectively. The fabricated DAAs were encapsulated with epoxy molding compounds. Degradation was evaluated using a nine-point bending test (NBT) under cyclic force between 0 and 270 N with a triangle waveform for 3 min per cycle at 150 °C. Scanning tomography images after 500 NBT cycles showed that the LP reduced the inner degradation ratio by up to 21.1% compared to the FP. Cross-sectional scanning electron microscopy revealed that the FP progressed cracking in the s-Ag die layer, whereas the LP showed no evidence of cracking. A finite element analysis revealed that in the FP, the accumulated plastic strain (APS) was concentrated in the s-Ag layer within the inner SiC chip. In contrast, the APS of the LP was preferentially concentrated outside the SiC chip. This preferential localization of damage outside the chip presents a promising approach for enhancing the reliability of packaging products. Full article

Initially, the effects of sheet combinations for joining two sheets, including 780 MPa steel and A5052 aluminum alloy sheets, on the joined cross-sectional shapes of the sheets in a clinch-bonding process and the tension-shear load of joined sheets were investigated. The effect of an adhesive on the amounts of the interlock and the minimum thickness in the upper sheet was not large, whereas the effect of the sheet combination was observed. Subsequently, for joining the upper 980 MPa ultra-high-strength steel and lower aluminum alloy sheets in the clinch-bonding process, the effects of the die shape, punch velocity, and sheet holding force on the joinability were investigated. As a result, defect-free conditions were narrowly constrained. Finally, a method that involved controlling material flow using an adhesive with fine particles to increase friction between the sheets was introduced. The upper 980 MPa steel and lower aluminum alloy sheets were successfully joined using this approach. Full article

Changes in the refractive indices of a GaAs laser chip owing to bonding strain are investigated by two-dimensional (2D) and three-dimensional (3D) finite element method (FEM) simulations. The strain induced by die attach (i.e., the bonding strain) was estimated by fitting simulations to the measured degree of polarisation (DOP) of photoluminescence from the facet of the bonded chip. Changes in the refractive indices were estimated using the strains obtained from fits to DOP data. Differences between the 2D and 3D FEM estimations of the deformation and of the photo-elastic effect are noted. It is recommended that 2D FEM simulations be used as starting points for 3D FEM simulations. Elastic constants for GaAs in plane-of-the-facet coordinate systems for 2D (plane stress and plane strain) and 3D FEM simulations are given. Full article

To address solder paste drawbacks, such as die contamination and flux residue, a polymer-based sheet containing Sn-3.0 (wt%) Ag-0.5Cu solder particles as fillers was fabricated, and its bonding characteristics were analyzed. The reductant in the manufactured sheet evaporated while removing the oxide layers on the solder and copper finish surfaces during heating. Subsequently, the resin component (polymethyl methacrylate) began to decompose thermally and gradually dissipated. Ultimately, the resulting joint formed a solder interconnection with a small amount of residual resin. This joint is expected to exhibit superior thermal conductivity compared with composite joints with a polymer matrix structure. Die-attach tests were conducted in air using the fabricated sheet between Cu finishes. Results showed that joints formed at 300 °C for 30 s and 350 °C for 10 s provided excellent shear strength values of 48.0 and 44.3 MPa, respectively, along with appropriately developed intermetallic compound (IMC) layers at the bonding interface. In contrast, bonding at 350 °C for 60 s resulted in excessive growth of IMC layers at the interface. When comparing size effects of solder particles, type 6 particles exhibited superior shear strength along with a relatively thinner total IMC layer thickness compared to when type 7 particles were used. Full article

The adhesion between rubber compounds and textile cords plays a critical role in determining the overall performance and durability of rubber-based composites, particularly in tire applications. Despite extensive research on adhesion mechanisms, optimizing adhesion through systematic modeling remains challenging due to the complex interactions between rubber formulations, textile treatment, and processing conditions. This study presents an integrated experimental and predictive modeling approach to investigate and optimize the adhesion performance of nylon 6.6 textile cords in rubber compounds. Initially, the effects of different accelerator types—including diphenyl guanidine (DPG), 2,2′-Dithiobis(benzothiazole) (MBTS), N-tert-butyl-2-benzothiazole sulfenamide (TBBS), and N-cyclohexyl-2-benzothiazole sulfenamide (CBS)—on adhesion properties were systematically evaluated. Key parameters such as cure characteristics, Mooney viscosity, and mechanical properties of the rubber compounds were analyzed using a moving die rheometer (MDR), Mooney viscometer, and tensometer. To enhance adhesion performance, a statistical optimization approach based on the Box–Behnken design was employed, focusing on the influence of accelerator, curing agent, and resin contents. The results indicate that an optimized rubber formulation comprising 1.6 phr curing agent, 0.3 phr resin (HMMM), and 0.5 phr accelerator (MBTS) yields the highest adhesion strength. This study provides the first systematic modeling of adhesion between nylon 6.6 textile cords and rubber compounds using response surface methodology (RSM), offering valuable insights into the material design for improved interfacial bonding in tire manufacturing. Full article

Electronic packaging can transform the chip to a device for assembly. Soldering and bonding are important procedures in the process of electronic packaging. The continuous development of packaging architecture has driven the emergence of improved soldering and bonding processes. At the same time, conventional soldering and bonding processes are still widely used in device packaging. This paper introduces two kinds of technologies in wafer bonding, direct and indirect, expounds on five kinds of die attachment processes, and also describes the process of ball bonding and wedge bonding in wire bonding in detail. Flip chip bonding and methods for making bumps are also described in depth. Bump bonding processes are vital for 3D-SiP packages, and the bonding technology of copper bumps is a research hotspot in the field of advanced packaging. The surface mount technology and sealing technology used in some electronic devices are also briefly introduced. This paper provides insights for researchers studying soldering and bonding in contemporary electronic device packaging. Full article

The application of wide-bandgap semiconductors in next-generation power modules requires cost-effective Cu particles and a reduced bonding time in the die attachment process to enable efficient industrial-scale manufacturing. Therefore, this study aimed to analyze the effect of Cu particle size variation on pressure-assisted sinter-bondability and bond line shear strength. Cu particles were synthesized through a simple wet-chemical process, in which pH variation was employed to obtain submicrometer-sized Cu particles with average diameters of 500, 300, and 150 nm. The synthesized particles exhibited pure Cu composition, forming only a native oxide layer on their surfaces. In pastes containing these Cu particles, smaller particle sizes led to the delayed evaporation of the reducing solvent, which in turn delayed the exothermic reactions associated with particle sintering and oxidation. However, the sintering-induced exothermic peak became more pronounced as the particle size decreased, confirming that smaller particles improved sinterability. Pressure-assisted sinter bonding performed in air at 300 °C indicated that a decreased particle size contributed to the densification of the bond line structure and an increase in shear strength. Specifically, the paste containing 150 nm Cu particles achieved a highly dense microstructure and an exceptional shear strength of 36.7 MPa within just 30 s of sinter bonding. These findings demonstrate that reducing the particle size is essential for enhancing the sinter-bondability of cost-effective Cu particle-based sinter-bonding pastes. Full article

This study addresses the crack formation problem when laser cladding CoCrFeNiAl high-entropy alloy onto H13 hot-work die steel, aiming to identify suitable transition layer materials. Five nickel-based alloys—Inconel 718, Inconel 625, Hastelloy X, FGH4096, and FGH4169—are selected as alternatives. Three-point bending and hot tensile tests are conducted to assess performance under different stress directions. Test results show that the FGH4096 and FGH4169 coatings fail due to insufficient element diffusion and weak interfacial bonding. Cracks appear at the coating–substrate interface of Inconel 625 and Hastelloy X. In contrast, Inconel 718 performs best, with excellent thermal expansion matching and strong stress resistance. In the three-point bending test, the specimens with Inconel 718 transition layers did not show cracks during the loading process, while specimens with some other alloy transition layers cracked or fractured, which proves that Inconel 718 can effectively enhance the bonding force between the coating and the substrate and improve the material’s performance under bending stress. In the hot tensile test, the stress–strain curve of Inconel 718 is at a high position with a high yield strength, showing excellent resistance to plastic deformation and significantly improving the performance of the nickel-based layer under hot tensile conditions. Therefore, Inconel 718 is identified as the optimal transition layer material. Full article

The increasing demand for higher resolution and faster machinery in silicon wafer inspection is driven by the rise in electronic device production and the decreasing size of microchips. This paper presents the design and implementation of a device capable of accurately measuring the surface of silicon wafers using the stitching technique. We propose an optical system design for measuring the surface profile, specifically targeting the roughness and nanotopography of a silicon wafer. The device achieves a lateral resolution of 7.56 μm and an axial resolution of 1 nm. It can measure a full 300-mm wafer in approximately 60 min, acquiring around 400 million data points. The technique utilized is a wavefront phase sensor, which reconstructs the surface shape using two images displaced a certain distance from the conjugate plane in the image space of a 4f system. The study details the calibration process and provides a method for converting local measurement coordinates to global coordinates. Quantitative phase imaging was obtained by using the wave front intensity image algorithm. The conclusive results validate the method different metrics over a wafer with bonded dies. In addition, the device demonstrates the ability to distinguish different dies that are thinned along with die-to-wafer bonding onto a carrier wafer to obtain the difference in coplanarity between the die and its surroundings as well as to detect defects during the die-to-wafer bonding. Lastly, the residual stress in the thin film deposited over the die is obtained using the Stoney model. Full article

The die bonding process is one of the most critical steps in the front-end semiconductor packaging process, as it significantly affects the yield of the entire IC packaging process. This research aims to find an efficient, intelligent vision detection model to identify whether each chip correctly adheres to the IC substrate; by utilizing the detection model to classify the type of defects occurring in the die bond images, the engineers can analyze the leading causes, enabling timely adjustments to key machine parameters in real-time, improving the yield of the die bond process, and significantly reducing manufacturing cost losses. This study proposes the lightweight Yolov7-tiny model using Depthwise-Separable and Ghost Convolutions and Sigmoid Linear Unit with β parameter (DSGβSI-Yolov7-tiny), which we can apply for real-time and efficient detection and prediction of die bond quality. The model achieves a maximum FPS of 192.3, a precision of 99.1%, and an F1-score of 0.97. Therefore, the performance of the proposed DSGβSI-Yolov7-tiny model outperforms other methods. Full article

Pastes were prepared using dendritic Cu particles as fillers, and a compression die attachment process was implemented to establish a pure Cu joint using low-cost materials and high-speed sinter bonding. We aimed to grow an oxidation layer on the particle surface to improve sinter-bondability. Because the growth of the oxidation layer by general thermal oxidation methods makes it difficult to use as a filler owing to agglomeration between particles, we induced oxidation growth by wet surface treatment. Consequently, when the oxidation layer was appropriately grown by surface treatment using an acetic acid–ethanol solution, we obtained an improved joint strength, approximately 2.8 times higher than the existing excellent result based on a bonding time of 10 s. The joint formed in just 10 s at 300 °C in the air under 10 MPa compression showed a shear strength of 28.4 MPa. When the bonding time was increased to 60 s, the joint exhibited a higher strength (35.1 MPa) and a very dense microstructure without voids. These results were attributed to the acceleration of sintering by the in situ formation of more Cu nanoparticles, which effectively reduced the increased oxide layers in the particles using a reducing solvent. Full article

Improving the hardness and wear resistance of die cutting tools is an important issue in the study of the service life of die cutting equipment. Using laser cladding technology, nickel-based composite coatings with varying BiFeO₃ contents were prepared on a 45 steel substrate, because BiFeO₃ can have an effect on the dilution rate and microstructure of the sample; morover BiFeO₃ is a new type of multiferroic material with certain magneto-electric coupling effects which can be prepared for the study of added magnetic fields. The microstructure and morphology were characterized to determine the optimal BiFeO₃ content. Based on the optimal addition of BiFeO₃, a comparative analysis was conducted to investigate the effect of different magnetic field strengths under a composite energy field on the microstructure, hardness, and wear resistance of Ni-based WC cladding layers. The results show that the optimal addition of BiFeO₃ was 5 wt%. At this concentration, there were no significant porosity defects in the coating, and the dilution rate was appropriate (4.77%). Additionally, the interface bonding strength was also increased. With optimal BiFeO₃ addition, stirring with different magnetic field strengths was applied to the cladding layer, and the results show that the aspect ratio of the cladding layer gradually increased with increasing the alternating magnetic field strength. When the magnetic field strength in the composite energy field was 40 mT, the microstructure was fine and uniform, the hardness of the cladding layer reached the highest level, about 925.2 HV_1.0, the wear resistance was also the best, the friction coefficient of the cladding layer was about 0.54, and the width of the wear mark was about 0.53 mm. Full article

In recent years, there has been a lack of information in the literature regarding the extrusion and connection of closed profiles from oxygen-free copper in bridge dies. Available studies contain information on the processes of extrusion and connection of profiles from aluminium alloys and various types of steel. However, there is a lack of detailed data on the values of technological parameters for which copper is joined in the extrusion process. Therefore, one of the goals of this work is to fill the gap in the literature regarding the extrusion of oxygen-free copper in bridge dies. In this work, the authors determined the thermo-mechanical conditions at which oxygen-free copper will be joined. This paper describes the effects of charge temperature and hydrostatic pressure in the weld zone of a bridge die on copper bonding in the fabrication of tubular profiles. Physical tests of the welding process under the conditions of upsetting a material consisting of two parts were carried out using the Gleeble 3800 metallurgical process simulator with the PocketJaw module in the standard configuration for SICO (strain-induced crack opening) tests. For the numerical simulations, the commercial computer programme FORGE^®NxT 2.1. using the finite element method (FEM) was used. Based on the analysis of the test results obtained, it was found that complete material bonding during the extrusion process could be achieved for a charge temperature higher than 600 °C and a hydrostatic pressure of 45–65 MPa. Full article

Metal composite parts are widely used in different industries owing to their significant improvement in material properties, such as mechanical strength, electrical conductivity, and corrosion resistivity, compared to traditional single metals. Such composite parts can be manufactured and processed in different ways to achieve the desired geometry and quality. Among various metal forming techniques, drawing is the most commonly used process to produce long composite wires or rods from raw single materials. During the drawing process of composite wires or rods, not only does the core radius ratio change, but the core or sleeve layer may also undergo necking or fracture due to excessive tensile stresses in the softer layer. In this paper, bimetallic rods with AISI-1006 low-carbon steel cores and C10100 oxygen-free electronic copper sleeves are modeled using the finite element software DEFORM. The simulation models are verified by drawing experiments. The effects of initial bonding conditions, the initial core ratio, reduction ratio, semi-die angle, drawing speed, and friction on the plastic deformation behavior of the bimetallic rods are investigated. The results indicate that the initial bonding conditions have a great impact on the deformation behavior of the billets in terms of strain distribution, material flow, residual stress, and the final core ratio. The permissible forming parameters for obtaining a sound product are investigated as well. With the aid of these analyses, the drawing process and the quality of the products can be controlled steadily. Full article

Laser cladding technology is an effective surface modification technique. In order to prepare coating with excellent properties on the surface of the cold heading die punch, stellite-6 cladding coating with different proportions of Y₂O₃ was prepared on the surface of W6Mo5Cr4V2 high-speed steel using laser cladding technology in this paper. The effects of different Y₂O₃ contents on the macroscopic morphology, microstructure, phase analysis, microhardness, and tribological properties of the stellite-6 coatings were investigated. It was determined that the optimal Y₂O₃ content for the stellite-6 powder was 2%. The results showed that the coating with 2%Y₂O₃ had the least number of pores and cracks and exhibited good surface flatness when joined. The microstructure became finer and denser, composed mainly of branch, cellular, equiaxed, and columnar grains. The coating consisted mainly of γ-Co, Fe-Cr, and Co₃Fe₇ strengthening phases, indicating good metallurgical bonding between the coating and the substrate. The average microhardness reached 539 HV when 2%Y₂O₃ was added, a 15.2% increase compared with the unmodified multilayer coating. The friction coefficient of the clad layer was 0.356, a 21.8% improvement over the unmodified stellite-6 coating. The average worn area of the cross-section was 3398.35 μm², a reduction of approximately 27.8% compared with the unmodified stellite-6 clad layer. The wear surface primarily exhibited abrasive wear, with fewer cavities and a smoother surface. Full article