Search Results (142)

To efficiently degrade tetracycline (TC) antibiotic pollution, cobalt-based (Co-OMCs/F) and cobalt–copper bimetallic ((Co+Cu)-OMCs/F) monolithic mesoporous carbon catalysts were synthesized using resorcinol–formaldehyde resin as a carbon precursor, with hexamethylenetetramine (HMT) and formaldehyde (CH₂O) as crosslinking agents, followed by high-temperature carbonization under N₂. The materials were characterized by XRD, SEM-EDX, HRTEM, and EPR. Key factors-metal loading, PMS concentration, initial pH, and flow rate-were investigated for their effects on TC degradation. Degradation mechanisms and stability were assessed via radical quenching and continuous-flow cycling tests. Results show optimal performance at a cobalt loading of 0.6 g. Compared to CH₂O, HMT favors a three-dimensional interconnected mesoporous carbon framework with uniform metal distribution and high crystallinity. Under conditions of 25 mg/L TC, 0.33 mmol/L PMS, pH 7, and 2 mL/min flow rate, the (Co+Cu)-OMCs/F (HMT) catalyst achieved ~93% TC degradation over 9 h of continuous operation, and 95% after three reuse cycles, significantly outperforming the single-metal Cu-OMCs/F catalyst. Radical quenching and EPR identified superoxide radicals (·O₂⁻) as the dominant active species (~78% contribution), with sulfate radicals (SO₄^·−), hydroxyl radicals (·OH), and singlet oxygen (¹O₂) playing synergistic roles. The synergistic Co-Cu bimetallic effect, combined with the confinement effect of the mesoporous carbon support and HMT-induced uniform nucleation, endows the catalyst with high activity and long-term stability. This work provides a theoretical basis for designing efficient, reusable, monolithic mesoporous carbon-based PMS activation catalysts for advanced antibiotic wastewater treatment. Full article

The expansion of paper-based and wearable microwave electronics demands conductors that are highly conductive, finely patterned, mechanically robust, and compatible with low-cost, biodegradable substrates. This study reports a laser-scribing strategy for high-performance copper–liquid metal (Cu–LM) conductors on paper based on laser sintering of Cu–LM composite particles, with an auxiliary adhesive transfer step to facilitate integration on flexible substrates. Laser-induced reactive sintering creates a network wherein sintered liquid metal and CuGa₂ acts as a conductive bridge, interconnecting the dispersed Cu particles. This provides efficient electron transport pathways, achieving a high conductivity of 4.2 × 10⁶ S/m under optimal laser conditions, surpassing that of pure eutectic gallium–indium (EGaIn) alloys. The self-healing nature of LM enables exceptional mechanical flexibility and stable electrical performance under severe deformation. The utility of this platform is demonstrated by a miniaturized microwave liquid level sensor that provides multi-parameter water-level detection and sensor calibration. These results establish laser-scribed Cu–LM on paper as a low-cost and disposable option for high-performance microwave sensors and flexible wireless electronics. Full article

Silver-coated copper (Cu@Ag) core–shell nanoparticles are promising interconnect materials for electronic packaging due to their high conductivity, oxidation resistance, and reduced use of precious metals. However, the key factors governing their sintering behavior and mechanical performance are not fully understood. In this study, molecular dynamics simulations were performed to examine the effects of sintering pressure (300–700 MPa), temperature (500–700 K), particle size, and silver shell thickness on atomic diffusion, microstructural evolution, and mechanical properties. Results show that higher pressure improves particle contact, accelerates densification, and strengthens interfacial bonding, with optimal performance achieved at 600–700 MPa. Elevated temperatures enhance atomic mobility, promoting neck growth and pore elimination, with the most active diffusion observed between 650 K and 700 K. Particle size and shell thickness also affect sintering: the Ag6Cu3 configuration exhibits the highest atomic mobility and a balanced combination of strength and ductility. Moderately thick silver shells facilitate surface diffusion and interfacial interdiffusion, while mechanisms such as the Kirkendall effect and local plastic relaxation reduce defect density, yielding stable sintered structures. These findings provide atomic-scale insights into the sintering mechanisms of Cu@Ag nanoparticle solder pastes and offer guidance for optimizing processing parameters in high-performance electronic packaging applications. Full article

Precise monitoring of forearm muscle groups is crucial for decoding motor intentions in human–machine interfaces (HMIs) and rehabilitation. However, traditional surface electromyography (sEMG) electrodes face significant challenges in densely packed muscle regions with large skin deformations, leading to severe signal crosstalk and unstable contact. Here, we report a flexible, low-cost 16-channel copper electrode array system designed for the high-density monitoring of multiple forearm muscle activities. Through a facile fabrication process, rigid copper is transformed into a conformable sensing interface. The optimized serpentine interconnects endow the array with excellent stretchability and effectively isolate motion-induced stress, ensuring high-quality signal acquisition under complex deformations. The high-density 2 × 8 array enables the spatiotemporal mapping of distributed flexor and extensor muscle groups. Integrated with a customized wireless data acquisition system, the array successfully demonstrates real-time, multi-channel sEMG monitoring of various hand movements (e.g., fist clenching, wrist flexion/extension), clearly revealing specific muscle activation patterns. This low-cost, high-performance flexible sensor array provides a highly promising tool for complex gesture decoding, electromyographic imaging, and next-generation wearable HMIs. Full article

Molybdenum (Mo) is currently considered as a potential diffusion barrier material for copper (Cu) interconnects, and these interconnect structures are generally processed using the technique of chemical mechanical planarization (CMP). While a limited number of publications on Mo CMP are presently available, the considerations for mitigating CMP-induced galvanic corrosion of Mo have remained largely underexplored. Using a model CMP system in pH-neutral slurries of citric acid with silica abrasives, the present work demonstrates how Mo barrier lines in contact with Cu wires in the CMP environment can develop CMP defects of galvanic corrosion. Including imidazole in the slurry considerably reduces the galvanic current of this corrosion process. The mechanisms of galvanic inhibition and material removal are examined by employing strategic tribo-electrochemical measurements. Open-circuit potential and potentiodynamic polarization measurements performed under surface abrasion aid the characterization of CMP-enabling surface reactions. The slurry’s surface chemistry initiates the primary modes of material wear for CMP, and corrosion-induced propagation of subsurface wear mostly governs the measured material removal rates for both Mo and Cu. Although the Cu:Mo selectivity of material removal is affected as the galvanic corrosion of Mo is suppressed, this effect can be controlled by varying the slurry content of imidazole. Full article

High-frequency 5G/6G communications demand copper foils combining sub-micron surface roughness (R_z < 0.6 μm) to minimize the skin effect with (111)-preferred orientation (for electromigration resistance), a balance challenging to achieve in conventional electrodeposition. This study quantifies the synergistic mechanism of a systematic series of additive formulations—from unary sodium 3-mercapto-1-propanesulfonate (MPS) to a quaternary MPS + polyethylene glycol (PEG) + Cl⁻ + gelatin (GEL) formulation—using electrochemical and microstructural analyses. While the ternary MPS + PEG + Cl⁻ system induced severe surface roughening (R_q = 449.5 nm) due to competitive adsorption, the introduction of high-concentration gelatin induced a kinetic bifurcation. It established a distinct “High-N/Low-D” regime—characterized by a 10⁴-fold reduction in diffusion coupled with a 10³-fold enhancement in nucleation, effectively suppressing the growth, reducing roughness from ~449.5 nm to ~81.3 nm via robust steric hindrance. However, this isotropic suppression simultaneously inhibited preferential crystal growth, leading to texture randomization. These findings kinetically quantify the intrinsic trade-off between extreme surface planarization and crystallographic orientation, providing a theoretical framework for designing high-performance interconnect materials. Full article

Dysregulation of iron and copper homeostasis is a pivotal driver of regulated cell death through two distinct yet interconnected modalities: ferroptosis and cuproptosis. This comprehensive review evaluates the therapeutic modulation of these metal-driven pathways within a dual paradigm: their deployment as a cytotoxic weapon in oncology and their inhibition for neuroprotection. We synthesize evidence ranging from small-molecule synergy to advanced nanomedicine, examining how the interplay between iron and copper governs cellular fate in resistant malignancies and neurodegenerative diseases such as Parkinson’s disease and Multiple Sclerosis. In oncology, bimetallic nanoplatforms and CRISPR-Cas9 nano-ionophores exploit “iron addiction” and metabolic vulnerabilities to induce fatal lipid peroxidation and FDX1-mediated proteotoxic stress, often by circumventing efflux transporters like ATP7A/B. Conversely, neuroprotective strategies focus on site-specific chelation, utilizing brain-penetrant molecules like SK4 (targeting the LAT1 transporter) and radical trapping antioxidants like Cu^II(atsm). Importantly, we elucidate the “iron trap” mechanism, where copper deficiency inactivates multicopper ferroxidases—including ceruloplasmin and hephaestin—thereby triggering iron-dependent ferroptosis. Our analysis reveals a self-amplifying cycle of oxidative damage driven by metal-induced ATP depletion and glutathione exhaustion. By delineating the molecular machinery of iron and copper metabolism, this article provides a roadmap for leveraging regulated cell death to overcome apoptosis resistance in cancer and preserve neural integrity in chronic degeneration. Full article

Biogenic copper-based nanoparticles have attracted attention as potent antimicrobial agents synthesised via environmentally sustainable routes using plants, microorganisms, and biological waste. Green synthesis leverages phytochemicals, enzymes, and proteins as natural reducing and stabilising agents, enabling nanoparticle formation under mild, non-toxic conditions without hazardous reagents. The resulting nanoparticles are typically spherical, <100 nm in size, and enriched with bioactive surface functionalities that contribute to broad-spectrum antimicrobial activity against bacteria, fungi, and biofilms. Their antimicrobial effects arise from interconnected mechanisms, including the generation of reactive oxygen species, the release of Cu² ions, membrane disruption, and interference with vital metabolic and genetic processes. Hybrid systems such as Ag–Cu, Zn–CuO, and CuS nanoparticles further enhance efficacy through synergistic redox and photothermal effects. These properties support applications in medical coatings, wound dressings, food packaging, aquaculture disease management, and sustainable crop protection. However, toxicity is highly context-dependent, influenced by factors such as nanoparticle size, shape, surface chemistry, capping agent, concentration, exposure medium, and the biological system. Small or weakly capped NPs can induce cytotoxicity, hemolysis, developmental defects, or growth inhibition, whereas functionalization or capping can improve selectivity and biocompatibility. Standardised physicochemical characterisation, harmonised toxicity testing, and mechanistic understanding are critical for the safe translation of biogenic CuNPs into regulatory-approved applications. This review summarises recent advances (2015–2025) in the biogenic synthesis of copper-based nanoparticles, highlighting how biological systems govern nanoparticle morphology, stability, and antimicrobial efficiency. It integrates mechanistic insights, compares monometallic and hybrid systems, and evaluates emerging applications in medicine, agriculture, aquaculture, and food safety. The review also identifies current limitations and future directions for standardisation, toxicity evaluation, and regulatory approval. Full article

Nutritional immunity is a major facet of host defense, wherein the host immune system strategically limits pathogen access to critical nutrients, including iron, zinc, vitamins, lipids, and amino acids, to repress microbial proliferation and virulence. This review provides a comprehensive synthesis of the molecular mechanisms that power nutrient immunity, including metal homeostasis, nutrient competition, transporter modulation, hormonal regulation, and direct antimicrobial actions. We examine nutrient-specific strategies employed by the host, such as iron-withholding mechanisms, vitamin deprivation, and copper-mediated toxicity. We also explore how diverse pathogens, including extracellular, intracellular, and eukaryotic pathogens, adapt to these hostile nutritional landscapes through siderophore diversification, regulatory integration, and metabolic rewiring. Comparative genomic analyses reveal convergent evolution in nutrient acquisition systems, illuminating the dynamic arms race between host restriction and microbial evasion. We examine the immunological mechanisms that regulate nutritional immunity. Further, we discuss the translational potential of nutritional immunity, cutting across nutrient-based therapies, host-directed interventions, and emerging diagnostic biomarkers. Finally, we suggest future directions that synergize nutritional immunity with microbiome ecology, global malnutrition, and personalized medicine. By elucidating the interconnection between metabolism and immunity, this review highlights the therapeutic promise of starving or toxifying the pathogen to save the host. Full article

Endometriosis (EDT) is a chronic, estrogen-dependent disease characterized by inflammation, fibrosis, pelvic pain, and infertility. Current therapies show limited long-term efficacy and adverse effects, underscoring the need for novel therapeutic approaches. Elevated copper (Cu) levels have been reported in both patients and animal models of EDT, making Cu chelation a promising strategy. This work aimed to evaluate the impact of ammonium tetrathiomolybdate (TM) on the expression of markers related to the interconnected processes of inflammation, innervation, and fibrogenesis in mice with induced EDT. Twenty-four female C57BL/6 mice were assigned to Sham, EDT, or EDT+TM groups. Treatment with TM began on postoperative day 15, with samples collected one month after EDT induction. Peritoneal fluid cytokines (TNF-α, IL-1β, IL-6, TGF-β1) were quantified by ELISA. Endometriotic-like lesions were examined for mRNA expression of cytokines, neurotrophins (Ngf, Bdnf, Ngfr), neural markers (Uchl1, Gap43), neuropeptides and nociceptive markers (Tac1/Tacr1, Calca/Calcrl/Ramp1, Trpv1), and fibrogenic markers (Vim, Acta2, Col1a1, Fmod) by RT-qPCR. Neurotrophin protein levels were measured by ELISA, and collagen content was assessed through Masson’s staining. TM significantly modulated inflammatory, neural, nociceptive, and fibrogenic markers, reducing most of them along with collagen content. These findings suggest that TM could impact key pathological mechanisms involved in EDT. Full article

The connectivity demands of high-performance computing (HPC), artificial intelligence (AI) and data centers are driving the development of a new generation of multimode optical components. This paper discusses the vertical cavity surface emitting laser (VCSEL) bandwidth and noise performance needed to support 106 Gbd line rates with PAM4 modulation for 200 Gbps per lane multimode optical links. A −3 dB bandwidth greater than 35 GHz and a RIN of less than −152 dB/Hz are demonstrated. No uncorrectable errors were observed over 50 m of OM4 fiber, demonstrating good link stability. VCSEL device performance and the associated wear-out life are presented. Leveraging good device reliability and low power consumption of VCSEL-based links, a novel VCSEL near-packaged optics (NPO) concept is proposed for optical interconnects in AI scale-up network applications. Optical interconnects allow for longer reaches, compared to copper interconnects, which facilitate larger AI clusters with network disaggregation. The proposed VCSEL NPO can achieve an energy efficiency of ~1 pJ/bit, which is the highest among optical interconnects. Full article

Liquid gallium (Ga) enables low-temperature transient liquid phase bonding (TLPB), but optimizing microstructure and joint performance remains challenging. Here, we developed a copper (Cu)-powder/liquid-Ga composite paste for Cu/Cu interconnects and systematically studied the effects on the interconnect joint performance of Cu powder particle size (Cu_PS, 10–20, 20–30 and 30–40 μm) and Cu mass fraction (Cu_MF, 10–30 wt%). The microstructure, electrical conductivity, and shear strength of the joint were evaluated, followed by an assessment of bonding temperature, pressure, and time. Under bonding conditions of 220 °C, 5 MPa and 720 min, a dense intermetallic compound (IMC) microstructure predominantly composed of Cu₉Ga₄ and CuGa₂ was formed, yielding an electrical conductivity of approximately 1.1 × 10⁷  S·m⁻¹ and a shear strength of 52.2 MPa, thereby achieving a synergistic optimization of electrical and mechanical properties; even under rapid bonding conditions of 220 °C, 5 MPa and 1 min, the joint still attained a shear strength of 39.2 MPa, demonstrating the potential of this process for high-efficiency, short-time interconnection applications. These results show that adjusting the composite paste formulation and dosage enables Cu–Ga TLPB joints that combine high conductivity with robust mechanical integrity for advanced packaging. Full article

Aging is a multifactorial process marked by a progressive decline in physiological function and increased vulnerability to diseases such as neurodegeneration, cancer, cardiovascular disorders, and infections. A central feature of aging is inflammaging, a state of chronic low-grade inflammation driven by cellular senescence, mitochondrial dysfunction, and oxidative stress. Recently, two regulated forms of non-apoptotic cell death—ferroptosis and cuproptosis—have emerged as critical mechanisms linking redox imbalance, mitochondrial stress, and disrupted metal homeostasis to age-related pathology. Ferroptosis, an iron-dependent process characterized by lipid peroxidation and impaired glutathione peroxidase 4 (GPX4) activity, and cuproptosis, a copper-dependent mechanism associated with protein lipoylation stress, both intersect with aging-related changes in mitochondrial and metabolic function. Importantly, these two forms of cell death should not be viewed as entirely separate pathways but rather as interconnected axes within a broader metal–redox–metabolic network. Disturbances in copper or iron homeostasis, glutathione (GSH)/GPX4 dysfunction, mitochondrial and iron-sulfur (Fe–S) cluster compromise, and enhanced lipid peroxidation may converge to lower cellular survival thresholds, thereby exacerbating oxidative damage, immune dysfunction, and tissue degeneration and ultimately fueling aging and inflammaging. This review offers a unique integrated perspective that situates ferroptosis and cuproptosis within a unified framework of aging biology, emphasizing their roles in age-related diseases and the therapeutic potential of targeting these pathways through nutritional, pharmacological, and lifestyle interventions. Full article

High-flexibility copper foils are critical for reliable flexible interconnects and displays. In this work, commercial-purity copper belts were processed by triple-layer stacked cold rolling to ultrathin foils, producing distinct surface- and layer-dependent deformation structures in the bright, matte, and central-interface layers; subsequent annealing at 600 °C then promoted orientation-selective recrystallization. Under the present conditions, the center-interface layer of the triple-rolled foil achieved the highest flexural-fatigue life (≈8.0 × 10⁴ cycles) within a window of cube ≈ 30–45% and grain size ≈ 40–60 μm. In this regime, grain-size control stabilizes intergranular slip compatibility, reduces elastic–plastic mismatch, and mitigates strain localization during cyclic bending. Even without aggressive cube enrichment, high flexural fatigue resistance can likewise be achieved through deliberate control of grain size. These findings establish a clear processing–microstructure–property linkage and indicate that layer-dependent control of texture and grain size can enhance flexural-fatigue performance in triple-layer stacked-rolled copper foils for flexible electronics. Full article

Ensuring efficient heat transfer to maintain optimal system performance is crucial in modern electronics owing to the rise of artificial intelligence. In the last few decades, scholars have explored various strategies for enhancing electronic device thermal management, focusing on the effects of fin shape, dimension, and spacing on heat transfer efficiency. Recent advancements in additive manufacturing have enabled fabrication of complex geometries, such as triply periodic minimal surfaces (TPMSs), which represent promising alternatives to conventional designs. This study presents a comparative analysis of the thermal performance and fluid flow characteristics of two foam TPMS-based (gyroid and primitive) heat sinks with wavy fins made using aluminum foam. COMSOL Multiphysics version 5.1, employed along with the implemented finite element method, was used to simulate convective heat transfer, pressure drop, the Nusselt number, and thermal performance at different fluid velocities along the length of a channel. The foam structure was heated by a copper plate, and the Nusselt number was evaluated over porosity levels from 0.1 to 0.9. A porosity between 0.5 and 0.7 offers the best balance of cooling performance and pumping power. Foam TPMS heat sinks, particularly those with a gyroid structure, provide enhanced thermal dissipation owing to their high surface area-to-volume ratio and interconnected geometry. Our findings confirm that TPMS heat sinks have promising potential for use as alternatives to conventional wavy designs for advanced thermal management applications. Full article