Search Results (25)

Piezoelectric micromachined ultrasound transducers (PMUTs) have gained significant popularity in the field of ultrasound ranging and medical imaging owing to their small size, low power consumption, and affordability. The scar-free “MIS” (micro-hole inter-etch and sealing) process, a novel bulk-silicon manufacturing technique, has been successfully developed for the fabrication of pressure sensors, flow sensors, and accelerometers. In this study, we utilize the MIS process to fabricate cavity diaphragm structures for PMUTs, resulting in the formation of a flat cavity diaphragm structure through anisotropic etching of (111) wafers in a 70 °C tetramethylammonium hydroxide (TMAH) solution. This study investigates the corrosion characteristics of the MIS technology on (111) silicon wafers, arranges micro-pores etched on bulk silicon around the desired cavity structure in a regular pattern, and takes into consideration the distance compensation for lateral corrosion, resulting in a fully connected cavity structure closely approximating an ortho-hexagonal shape. By utilizing a sputtering process to deposit metallic molybdenum as upper and lower electrodes, as well as piezoelectric materials above the cavity structure, we have successfully fabricated aluminum nitride (AlN) piezoelectric ultrasonic transducer arrays of various sizes and structures. The final hexagonal PMUT cells of various sizes that were fabricated achieved a maximum quality factor (Q) of 251 and a displacement sensitivity of 18.49 nm/V across a range of resonant frequencies from 6.28 MHz to 11.99 MHz. This fabrication design facilitates the achievement of IC-compatible and cost-effective mass production of PMUT array devices with high resonance frequencies. Full article

Micro-droplets are widely used in the fields of chemical and biological research, such as drug delivery, material synthesis, point-of-care diagnostics, and digital PCR. Droplet-based microfluidics has many advantages, such as small reagent consumption, fast reaction time, and independent control of each droplet. Therefore, various micro-droplet generation methods have been proposed, including T-junction breakup, capillary flow-focusing, planar flow-focusing, step emulsification, and high aspect (height-to-width) ratio confinement. In this study, we propose a microfluidic device for generating monodisperse micro-droplets, the microfluidic channel of which has an asymmetric cross-sectional shape and high hypotenuse-to-width ratio (HTWR). It was fabricated using basic MEMS processes, such as photolithography, anisotropic wet etching of Si, and polydimethylsiloxane (PDMS) molding. Due to the geometric similarity of a Si channel and a PDMS mold, both of which were created through the anisotropic etching process of a single crystal Si, the microfluidic channel with the asymmetric cross-sectional shape and high HTWR was easily realized. The effects of HTWR of channels on the size and uniformity of generated micro-droplets were investigated. The monodisperse micro-droplets were generated as the HTWR of the asymmetric channel was over 3.5. In addition, it was found that the flow direction of the oil solution (continuous phase) affected the size of micro-droplets due to the asymmetric channel structures. Two kinds of monodisperse droplets with different sizes were successfully generated for a wider range of flow rates using the asymmetric channel structure in the developed microfluidic device. Full article

Research in asymmetric light transmission interfaces has been recently gaining traction. While traditionally considered for optical circuitry applications, there is a new interest to use these interfaces in luminescent solar concentrators. Previous studies have shown that applying them to the top surface of a concentrator could mitigate surface losses. This paper presents experimental results for proof-of-concept asymmetric light transmission interfaces that may have potential applications in luminescent solar concentrators. The interfaces and the underneath substrate were created in a single step from polydimethylsiloxane using silicon molds fabricated on <100> wafers via anisotropic wet etching. The resulting structures were pyramidal in shape. Large surface areas of nanostructures repeating at 800 nm, 900 nm, and 1000 nm were tested for backward and forward transmission using a spectrometer. Results showed a 21%, 10%, and 0% average transmissivity difference between the forward and backward directions for each periodicity, respectively. The trends seen experimentally were confirmed numerically via COMSOL simulations. Full article

We investigated the selective etching of Si versus Si_1−xGe_x with various Ge concentrations (x = 0.13, 0.21, 0.30, 0.44) in tetramethyl ammonium hydroxide (TMAH) solution. Our results show that the Si_1−xGe_x with a higher Ge concentration was etched slower due to the reduction in the Si(Ge)–OH bond. Owing to the difference in the etching rate, Si was selectively etched in the Si_0.7Ge_0.3/Si/Si_0.7Ge_0.3 multi-layer. The etching rate of Si depends on the Si surface orientation, as TMAH is an anisotropic etchant. The (111) and (010) facets were formed in TMAH, when Si was laterally etched in the <110> and <100> directions in the multi-layer, respectively. We also investigated the effect of the addition of Triton X-100 in TMAH on the wet etching process. Our results confirmed that the presence of 0.1 vol% Triton reduced the roughness of the etched Si and Si_1−xGe_x surfaces. Moreover, the addition of Triton to TMAH could change the facet formation from (010) to (011) during Si etching in the <100>-direction. The facet change could reduce the lateral etching rate of Si and consequently reduce selectivity. The decrease in the layer thickness also reduced the lateral Si etching rate in the multi-layer. Full article

Blazed gratings are the critical dispersion elements in spectral analysis instruments, whose performance depends on structural parameters and topography of the grating groove. In this paper, high diffraction efficiency silicon-blazed grating working at 800–2500 nm has been designed and fabricated. By diffraction theory analysis and simulation optimization based on the accurate boundary integral equation method, the blaze angle and grating constant are determined to be 8.8° and 4 μm, respectively. The diffraction efficiency is greater than 33.23% in the spectral range of 800–2500 nm and reach the maximum value of 85.62% at the blaze wavelength of 1180 nm. The effect of platform and fillet on diffraction efficiency is analyzed, and the formation rule and elimination method of the platform are studied. The blazed gratings are fabricated by anisotropic wet etching process using tilted (111) silicon substrate. The platform is minished by controlling etching time and oxidation sharpening process. The fillet radius of the fabricated grating is 50 nm, the blaze angle is 7.4°, and the surface roughness is 0.477 nm. Finally, the blazed grating is integrated in scanning micromirror to form scanning grating micromirror by MEMS fabrication technology, which can realize both optical splitting and scanning. The testing results show that the scanning grating micromirror has high diffraction efficiency in the spectral range of 810–2500 nm for the potential near-infrared spectrometer application. Full article

Label-free detection of biomolecules using localized surface plasmon resonance (LSPR) substrates is a highly attractive method for point-of-care (POC) testing. One of the remaining challenges to developing LSPR-based POC devices is to fabricate the LSPR substrates with large-scale, reproducible, and high-throughput. Herein, a fabrication strategy for wafer-scale LSPR substrates is demonstrated using reproducible, high-throughput techniques, such as nanoimprint lithography, wet-etching, and thin film deposition. A transparent sapphire wafer, on which SiO₂-nanodot hard masks were formed via nanoimprint lithography, was anisotropically etched by a mixed solution of H₂SO₄ and H₃PO₄, resulting in a patterned sapphire substrate (PSS). An LSPR substrate was finally fabricated by oblique deposition of Au onto the PSS, which was then applied to label-free detection of the binding events of biomolecules. To the best of our knowledge, this paper is the first report on the application of the PSS used as an LSPR template by obliquely depositing a metal. Full article

Droplet-based microfluidics has been widely used as a potent high-throughput platform due to various advantages, such as a small volume of reagent consumption, massive production of droplets, fast reaction time, and independent control of each droplet. Therefore, droplet microfluidic systems demand the reliable generation of droplets with precise and effective control over their size and distribution, which is critically important for various applications in the fields of chemical analysis, material synthesis, lab-on-a-chip, cell research, diagnostic test, and so on. In this study, we propose a microfluidic device with a high-aspect-ratio (HAR) channel, which has a parallelogram cross-section, for generating monodisperse droplets. The HAR channel was fabricated using simple and cheap MEMS processes, such as photolithography, anisotropic wet etching, and PDMS molding, without expensive equipment. In addition, the parallelogram cross-section channel structure, regarded as a difficult shape to implement in previous fabrication methods, was easily formed by the self-alignment between the silicon channel and the PDMS mold, both of which were created from a single crystal silicon through an anisotropic etching process. We investigated the effects of the cross-sectional shape (parallelogram vs. rectangle) and height-to-width ratio of microfluidic channels on the size and uniformity of generated droplets. Using the developed HAR channel with the parallelogram cross-section, we successfully obtained smaller monodisperse droplets for a wider range of flow rates, compared with a previously reported HAR channel with a rectangular cross-section. Full article

Superhydrophobic surfaces on 6082 aluminum alloy substrates are tailored by low-cost chemical surface treatments coupled to a fluorine-free alkyl-silane coating deposition. In particular, three different surface treatments are investigated: boiling water, HF/HCl, and HNO₃/HCl etching. The results show that the micro-nano structure and the wetting behavior are greatly influenced by the applied surface texturing treatment. After silanization, all the textured surfaces exhibit a superhydrophobic behavior. The highest water contact angle (WCA, ≈180°) is obtained by HF/HCl etching. Interestingly, the water sliding angle (WSA) is affected by the anisotropic surface characteristics. Indeed, for the HF/HCl and the HNO₃/HCl samples, the WSA in the longitudinal direction is lower than the transversal one, which slightly affects the self-cleaning capacity. The results point out that the superhydrophobic behavior of the aluminum alloys surface can be easily tailored by performing a two-step procedure: (i) roughening treatment and (ii) surface chemical silanization. Considering these promising results, the aim of further studies will be to improve the knowledge and optimize the process parameters in order to tailor a superhydrophobic surface with an effective performance in terms of stability and durability. Full article

We report the fabrication, electromagnetic simulation and measurement of inverted silicon pyramidal arrays with randomly distributed nanoholes that act as an anti-reflectivity coating. The fabrication route combines the advantages of anisotropic wet etching and metal-assisted chemical etching. The former is employed to form inverted silicon pyramid arrays, while the latter is used to generate randomly distributed nanoholes on the surface and sidewalls of the generated inverted silicon pyramidal arrays. We demonstrate, numerically and experimentally, that such a structure facilitates the multiple reflection and absorption of photons. The resulting nanostructure can achieve the lowest reflectance of 0.45% at 700 nm and the highest reflectance of 5.86% at 2402 nm. The average reflectance in the UV region (250–400 nm), visible region (400–760 nm) and NIR region (760–2600 nm) are 1.11, 0.63 and 3.76%, respectively. The reflectance at broadband wavelength (250–2600 nm) is 14.4 and 3.4 times lower than silicon wafer and silicon pyramids. In particular, such a structure exhibits high hydrophobicity with a contact angle up to 132.4°. Our method is compatible with well-established silicon planar processes and is promising for practical applications of anti-reflectivity coating. Full article

Black silicon (BSi) fabrication via surface texturization of Si-wafer in recent times has become an attractive concept regarding photon trapping and improved light absorption properties for photovoltaic applications. In this study, surface texturization has been conducted on mono-crystalline Si(100) wafer using a wet chemical anisotropic etching process with IPA:KOH solution to form micro-pyramidal surface structures. Moreover, the optimized properties of the fabricated BSi wafers are used for numerical simulation using PC1D software to analyze the performance of the solar cell and establish the correlation among relevant parameters. Effects such as doping concentration, texturization, passivation, and anti-reflection coating of BSi on the solar cell performance have numerically been investigated. Results show that textured surface obtained from the wet chemical anisotropic etching process has successfully reduced the reflectance of the BSi wafer and surpassed the solar cell efficiency by 2%, which is mainly attributed to the optical confinement of the textured pyramids on the surface with a height of 1–2 μm and angles of 70 degrees. Furthermore, the doping concentration of the p-type wafer and n-type emitter were optimized to be 1 × 10¹⁶ cm⁻³ and 1 × 10¹⁸ cm⁻³, respectively. In the case of device optimization, the SiO₂ passivation layer with a refractive index of 1.48 and the Si₃N₄ ARC layer with a refractive index of 2.015 has been identified as the best combination for the solar cell performance. These optimized parameters eventually result in 23.14% conversion efficiency from numerical simulation for solar cells that use black silicon wafers as fabricated in this study. Full article

Electrocatalysts featuring robust structure, excellent catalytic activity and strong stability are highly desirable, but challenging. The rapid development of two-dimensional transition metal chalcogenide (such as WO₃, MoS₂ and WS₂) nanostructures offers a hopeful strategy to increase the active edge sites and expedite the efficiency of electronic transport for hydrogen evolution reaction. Herein, we report a distinctive strategy to construct two-dimensional MoS₂@dWO₃ heterostructure nanosheets by in situ wet etching. Synthesized oxygen-incorporated MoS₂-was loaded on the surface of defective WO₃ square nanoframes with abundant oxygen vacancies. The resulting nanocomposite exhibits a low overpotential of 191 mV at 10 mA cm⁻² and a very low Tafel slope of 42 mV dec⁻¹ toward hydrogen evolution reaction. The long-term cyclic voltammetry cycling of 5000 cycles and more than 80,000 s chronoamperometry tests promises its outstanding stability. The intimate and large interfacial contact between MoS₂ and WO₃, favoring the charge transfer and electron–hole separation by the synergy of defective WO₃ and oxygen-incorporated MoS₂, is believed the decisive factor for improving the electrocatalytic efficiency of the nanocomposite. Moreover, the defective WO₃ nanoframes with plentiful oxygen vacancies could serve as an anisotropic substrate to promote charge transport and oxygen incorporation into the interface of MoS₂. This work provides a unique methodology for designing and constructing excellently heterostructure electrocatalysts for hydrogen evolution reaction. Full article

The optimization of mesa etch for a quasi-vertical gallium nitride (GaN) Schottky barrier diode (SBD) by inductively coupled plasma (ICP) etching was comprehensively investigated in this work, including selection of the etching mask, ICP power, radio frequency (RF) power, ratio of mixed gas, flow rate, and chamber pressure, etc. In particular, the microtrench at the bottom corner of the mesa sidewall was eliminated by a combination of ICP dry etching and tetramethylammonium hydroxide (TMAH) wet treatment. Finally, a highly anisotropic profile of the mesa sidewall was realized by using the optimized etch recipe, and a quasi-vertical GaN SBD was demonstrated, achieving a low reverse current density of 10⁻⁸ A/cm² at −10 V. Full article

This paper presents etching of convex corners with sides along <n10> and <100> crystallographic directions in a 25 wt% tetramethylammonium hydroxide (TMAH) water solution at 80 °C. We analyzed parallelograms as the mask patterns for anisotropic wet etching of Si (100). The sides of the parallelograms were designed along <n10> and <100> crystallographic directions (1 < n < 8). The acute corners of islands in the masking layer formed by <n10> and <100> crystallographic directions were smaller than 45°. All the crystallographic planes that appeared during etching in the experiment were determined. We found that the obtained types of 3D silicon shape sustain when n > 2. The convex corners were not distorted during etching. Therefore, no convex corner compensation is necessary. We fabricated three matrices of parallelograms with sides along crystallographic directions <310> and <100> as examples for possible applications. Additionally, the etching of matrices was simulated by the level set method. We obtained a good agreement between experiments and simulations. Full article

Electrostatically-defined quantum dots (QDs) in silicon are an attractive platform for quantum computation. Localized single electron spins define qubits and provide excellent manipulation and read-out fidelities. We propose a scalable silicon-based qubit device that can be fabricated by industry-compatible processes. The device consists of a dense array of QDs localized along an etched silicon nano-ridge. Due to its lateral confinement, a simple dense array of metallic top-gates forms an array of QDs with controllable tunnel-couplings. To avoid potential fluctuations because of roughness and charged defects at the nano-ridge sidewall, the cross-section of the nano-ridge is trapezoidal and bounded by atomically-flat {111} facets. In addition to side-gates on top of the low-defect oxidized {111} facets, we implement a global back-gate facilitated by the use of silicon-on-insulator. The most relevant process modules are demonstrated experimentally including anisotropic wet-etching and local oxidation of the silicon nano-ridge, side-gate formation with chemical-mechanical polishing, and top-gate fabrication employing the spacer process. According to electrostatic simulations, our device concept allows forming capacitively-coupled QD double-arrays or adjacent charge detectors for spin-readout. Defining a logical qubit or realizing a single electron conveyor for mid-range qubit-coupling will be future applications. Full article

In this paper, we propose and investigate the modal characteristics of wedge surface plasmon polariton (SPP) waveguides for guiding surface plasmon waves. The wedge SPP waveguides are composed of a silver layer deposited onto the surface of a wedge-shaped silicon dielectric waveguide. The wedge-shaped silicon dielectric waveguides are explored from the anisotropic wet etching property of single crystal silicon. The wedge SPP waveguides are embedded in a dielectric medium to form the metal–dielectric interface for guiding the surface plasmon waves. The propagation characteristics of the wedge SPP waveguides at the optical telecommunication wavelength of 1.55 μm are evaluated by a numerical simulation. The influence of the physical parameters such as the dimensions of the wedge SPP waveguide and the refractive index of the dielectric medium on the propagation of the surface plasmon wave is investigated. In addition, by comparing the propagation characteristics, we derive the wedge SPP waveguide with the optimal performance. Full article