Search Results (51)

Shape memory alloys (SMAs) derive their unique functional properties from martensitic transformations, with the martensitic transformation temperature (T_M) serving as a key design parameter. However, existing empirical rules, such as the valence electron concentration (VEC) and lattice volume (V) criteria, are typically restricted to specific alloy families and lack general applicability. In this work, we used a data-driven methodology to find a generalizable empirical formula for T_M in SMAs by combining high-throughput first-principles calculations, feature engineering, and symbol regression techniques. Key factors influencing T_M were first identified and a predictive machine learning model was subsequently trained based on these features. Furthermore, an empirical formula of T_M = $82(\overline{\rho }·\overline{MP})-700$ was derived, where $\overline{\rho }$ and $\overline{MP}$ represent the weight-average value of density and melting point, respectively. The empirical formula exhibits strong generalizability across a wide range of SMAs, such as NiMn-based, NiTi-based, TiPt-based, and AuCd-based SMAs, etc., offering practical guidance for the compositional design and optimization of shape memory alloys. Full article

The Ni-Au coating with its inherent chemical stability is recognized as an effective method for boosting corrosion resistance in humid environments while preserving exceptional electrical conductivity. However, its anti-corrosion performance is affected by the structure characteristics of the coating due to the high corrosion potentials of Au and Ni. To enhance its protection properties, the deposition process parameters, including deposition time, deposition current density, and zincating times, were investigated. The morphology and structure of the coatings were characterized, while its anti-corrosion performance was assessed through electrochemical and accelerated salt-spray tests. Eventually, the elevated current density in the Ni-Au coating resulted in reduced grain size and improved surface morphology, ensuring superior anti-corrosion performance. Additionally, extending the Ni deposition time provided a second physical barrier for the dense and thick Ni layer to resist the invasion of corrosive media. Furthermore, grey theory was applied to predict the service life of the Ni-Au coating. This research provides valuable insights and constructive guidance for optimizing Ni-Au coating in various engineering applications. Full article

To avoid wear and tear of the slip ring due to electrical corrosion, the slip ring needs to undergo the running-in process under atmospheric conditions without current after assembly. To address the urgent demand for long-service capability space conductive slip rings in the aerospace field, the running-in behavior and failure mechanism between the AgCuNi alloy and Au-electroplated layer are investigated using a ball-on-disc tribometer in this paper. The results show that the transfer film composed of Au plays an important role in modifying the friction during the sliding process. With the accumulation of wear debris composed of Ag on the disc, the contact material of the friction pair changed from Au and Au to Au, Ag and Au, so the surface roughness of wear tracks increased. Finally, the transfer film broke, which made the layer fail. This paper reveals the key element failure mechanism that causes transfer film failure in the running-in contact area, which is used to reveal the friction behavior and failure mechanism of slip ring friction pair materials, and provides a basis for the selection of running-in parameters during the running-in process of slip rings before power-on operation. Full article

Understanding the tribological properties of alloy-based sliding electrical contacts is crucial for both fundamental research and practical applications. Here, to explore the friction, wear, and contact resistance of a AgCuNi alloy/Au-electroplated layer during sliding, a ball-on-disk tribometer was coupled with a source meter. The experiments were conducted under various conditions including a current ranging from 0 to 1.0 A, a normal load ranging from 0.5 to 3.0 N, and a sliding speed of 40 mm/s. The results indicate that the wear of the friction pair is aggravated by both the current and the increase in the normal load. When the current was 0.5 A, the wear loss reached its lowest point. However, as the current increased from 0.5 A to 1.0 A, there was an intensification in Ag transfer from the alloy ball to the Au-electroplated layer, resulting in an increase in wear loss. Both the normal load and current have significant effects on both friction coefficient and contact resistance. The variation in contact resistance over time follows a similar pattern to that of the friction coefficient over time. The formation of a transfer film plays a crucial role in determining contact resistance, wear resistance, and friction coefficient. The experiment demonstrates that optimizing the normal load and current can adjust both the contact resistance and friction coefficient, thereby prolonging service life and ensuring the stability of contacts. Full article

Sn-10Bi low-bismuth-content solder alloy provides a potential alternative to the currently used Sn-Ag-Cu series due to its lower cost, excellent ductility, and strengthening resulting from the Bi solid solution and precipitation. This study primarily investigates the interfacial evolution and shear strength characteristics of Sn-10Bi joints on a Ni/Au surface finish during the as-soldered and subsequent isothermal aging processes. To improve the joint performance, a 0.2 or 0.5 wt.% dopant of Zn was incorporated into Sn-10Bi solder. The findings demonstrated that a 0.2 or 0.5 wt.% Zn dopant altered the composition of the intermetallic compound (IMC) formed at the interface between the solder and Ni/Au surface finish from Ni₃Sn₄ to Ni₃(Sn, Zn)₄. The occurrence of this transformation is attributed to the diffusion of Zn atoms into the Ni₃Sn₄ lattice, resulting in the substitution of a portion of the Sn atoms by Zn atoms, thereby forming the Ni₃(Sn, Zn)₄ IMC during the soldering process, which was also verified by calculations based on first principles. Furthermore, a 0.2 or 0.5 wt.% Zn dopant in Sn-10Bi significantly inhibited the Ni₃(Sn, Zn)₄ growth after both the soldering and thermal aging processes. Zn addition can enhance the shear strength of solder joints irrespective of the as-soldered or aging condition. The fracture mode was determined by the aging durations—with the brittle mode occurring for as-soldered joints, the ductile mode occurring for aged joints after 10 days, and again the brittle mode for joints after 40 days of aging. Full article

To meet the demands for high-temperature performance and lightweight materials in aerospace engineering, the Au-Ni solder is often utilized for joining dissimilar materials, such as Ti₃Al-based alloys and Ni-based high-temperature alloys. However, the interaction between Ti and Ni can lead to the formation of brittle phases, like Ti₂Ni, TiNi, and TiNi₃, which diminish the mechanical properties of the joint and increase the risk of crack formation during the welding process. Cu doping has been shown to enhance the mechanical properties and high-temperature stability of the Au-Ni brazed joint’s central area. Due to the difficulty in accurately controlling the solid solution content of Cu in the Au-Ni alloy, along with the high cost of Au, traditional experimental trial-and-error methods are insufficient for the development of Au-based solders. In this study, first principles calculations based on density functional theory were employed to analyze the effect of Cu content on the stability of the Au-2.0Ni-xCu (x = 0, 0.25, 0.5, 0.75, 1.0, 1.25 wt%) alloy phase structure. The thermal properties of the alloy were determined using Gibbs software fitting. The results indicate that the Au-2.0Ni-0.25Cu alloy exhibits the highest plastic toughness (B/G = 5.601, ν = 0.416, Cauchy pressure = 73.676 GPa) and a hardness of 1.17 GPa, which is 80% higher than that of Au-2.0Ni. This alloy balances excellent strength and plastic toughness, meeting the mechanical performance requirements of brazed joints. The constant pressure specific heat capacity (C_p) of the Au-2.0Ni-xCu alloy is higher than that of Au-2.0Ni and increases with Cu content. At 1000 K, the C_p of the Au-2.0Ni-0.25Cu alloy is 35.606 J·mol⁻¹·K⁻¹, which is 5.88% higher than that of Au-2.0Ni. The higher C_p contributes to enhanced high-temperature stability. Moreover, the linear expansion coefficient (CTE) of the Au-2.0Ni-0.25Cu alloy at 1000 K is 8.76 × 10⁻⁵·K⁻¹, only 0.68% higher than Au-2.0Ni. The lower CTE helps to reduce the risk of solder damage caused by thermal stress. Therefore, the Au-2.0Ni-0.25Cu alloy is more suitable for brazing applications in high-temperature environments due to its excellent mechanical properties and thermal stability. This study provides a theoretical basis for the performance optimization and engineering application of the Au-2.0Ni-xCu alloy as a gold-based solder. Full article

The aerobic oxidation of 5-hydroxymethylfurfural (HMF) to 2,5-furandicarboxylic acid (FDCA) plays a pivotal role in the synthesis of renewable, biodegradable plastics and sustainable chemicals. Although supported gold nanoclusters (NCs) exhibit significant potential in this process, they often suffer from low selectivity. To address this challenge, a series of gold-M (M means Ni, Fe, Cu, and Pd) bimetallic NCs catalysts were designed and synthesized to facilitate the selective oxidation of HMF to FDCA. Our findings indicate that the introduction of doped metals, particularly Ni and Pd, not only improves the reaction rates for HMF tandem oxidation but also promotes high yields of FDCA. Various characterizations techniques, including X-ray diffraction (XRD), transmission electron microscopy (TEM), X-ray photoelectron spectroscopy (XPS), in situ diffuse reflectance infrared Fourier transform spectroscopy of CO adsorption (CO-DRIFTS), and temperature-programmed desorption of oxygen (O₂-TPD), were employed to scrutinize the structural and electronic properties of the prepared catalysts. Notably, an electronic effect was observed across the Au-based bimetallic catalysts, facilitating the activation of reactant molecules and enhancing the catalytic performance. This study provides valuable insights into the alloy effects, aiding in the development of highly efficient Au-based bimetallic catalysts for biomass conversions. Full article

This review extensively discusses current developments in bimetallic nanoparticle–GO and bimetallic nanoparticle–MOF nanocomposites as potential catalysts for HER, along with their different synthesis methodologies, structural characteristics, and catalytic mechanisms. The photoelectrocatalytic performance of these catalysts was also compared based on parameters such as Tafel slope, current density, onset potential, turnover frequency, hydrogen yield, activation energy, stability, and durability. The review shows that the commonly used metal alloys in the bimetallic nanoparticle–GO-based catalysts for HERs include Pt-based alloys (e.g., PtNi, PtCo, PtCu, PtAu, PtSn), Pd-based alloys (e.g., PdAu, PdAg, PdPt) or other combinations, such as AuNi, AuRu, etc., while the most used electrolyte sources are H₂SO₄ and KOH. For the bimetallic nanoparticle MOF-based catalysts, Pt-based alloys (e.g., PtNi, PtCu), Pd-based alloys (e.g., PdAg, PdCu, PdCr), and Ni-based alloys (e.g., NiMo, NiTi, NiAg, NiCo) took the lead, with KOH being the most frequently used electrolyte source. Lastly, the review addresses challenges and prospects, highlighting opportunities for further optimization and technological integration of the catalysts as promising alternative photo/electrocatalysts for future hydrogen production and storage. Full article

The evolution of the microstructure and hardness changes in the Au-15Ag-12Cu-6Ni alloy during the processes of cold rolling and annealing were investigated and the heat treatment regimen for the alloy was optimized in this article. The hardness of the alloy continuously increases with the cold rolling reductions, leading to continuous deformation of the grains during the cold rolling process, ultimately resulting in smaller grain sizes. Subsequent annealing induces recovery and recrystallization, achieving complete recrystallization at 700 °C. An intriguing softening effect is observed after annealing at 700 °C, manifesting in a significant reduction in hardness to 238 (Hv_0.5). The cold deformation texture of the alloy aligns with the recrystallization texture type, exhibiting only a certain degree of angular deviation. This is primarily characterized by <111>//RD texture and a texture deviating 60° from RD towards TD. The performance of the finished sheet improves with the precipitation of ordered phases AuCu after a 300 °C heat treatment for 0.5 h, resulting in a remarkable hardness of 380 (Hv_0.5). Full article

A microwave transmitter/receiver using the low-temperature co-fired ceramic substrate and ball grid array packaging demonstrates superior properties, including high integration, miniaturization, and high electromagnetic shielding. However, it holds limitations of inadequate hermeticity (that is, gas or moist impermeability), high cost, and low reproducibility. In this work, we aim to overcome these difficulties by introducing a new packing technique. The packaging utilizes an electroless plated Ni/Pd/Au surface, resulting in a significant enhancement of the packaging hermeticity by orders of magnitude, approaching the level of <5 × 10⁻⁹ Pa·m³/s. Both Sn63Pb37 and Au80Sn20 solder alloys demonstrate exceptional solderability, attributed to Pd atoms diffusing to the Au layer during soldering at 310 °C. A reliability test of the packaging shows that the shear strength of the solder balls drops after thermal shocks but negligibly affects the hermeticity of the packaging. Furthermore, a meticulously designed internal vertical interconnect structure and I/O interconnections were engineered in the ball grid array packaging, showcasing excellent transmission characteristics within the 10–40 GHz frequency range while ensuring effective isolation between ports. Full article

The eXTP (enhanced X-ray Timing and Polarization) satellite is a prominent X-ray astronomy satellite designed primarily for conducting deep space X-ray astronomical observations. The satellite’s scientific payload consists of X-ray focusing mirrors. In order to fulfill the requirements of weight reduction and enhanced effective area, the thickness of mirrors is reduced to the sub-millimeter range and a multi-layer nested structure is employed. Manufacturing mirrors poses a significant challenge to both their quality and efficiency. The present research investigates the optimal replication process for mandrel ultraprecision machining, polishing, coating, electroforming nickel, and demolding. It analyzes the factors contributing to the challenging separation and the inability to release the mirror shells. Additionally, an automatic demolding device is developed, and the X-ray performance of the replication mirrors is verified. The fabrication process flow of the mirrors was initially introduced. To ensure the easy release of the mirror shells from the mandrels, a layer of diamond-like carbon (DLC) was applied as a release layer between the Au and NiP alloy. The adhesion strength of Au-C was found to be significantly lower than that of Au-NiP, as demonstrated by both molecular dynamic simulation and tensile testing. The development of an automatic demolding device with force feedback has been successfully completed. The reduction in the half-power diameter (HPD) of the mirror from 48 inches to 25 inches is an improvement that surpasses the production target. Full article

The Ildeus mafic–ultramafic complex represents plutonic roots of a Triassic magmatic arc tectonically emplaced into the thickened uppermost crust beneath the Mesozoic Stanovoy collided margin. The mafic–ultramafic complex cumulates host Ni-Co-Cu-Pt-Ag-Au sulfide-native metal-alloy mineralization produced through magmatic differentiation of subduction-related primary mafic melt. This melt was sourced in the metal-rich sub-arc mantle wedge hybridized by reduced high-temperature H-S-Cl fluids and slab/sediment-derived siliceous melts carrying significant amounts of Pt, W, Au, Ag, Cu and Zn. Plutonic rocks experienced a pervasive later-stage metasomatic upgrade of the primary sulfide–native metal–alloy assemblage in the presence of oxidized hydrothermal fluid enriched in sulfate and chlorine. The new metasomatic assemblage formed in a shallow epithermal environment in the collided crust includes native gold, Ag-Au, Cu-Ag and Cu-Ag-Au alloys, heazlewoodite, digenite, chalcocite, cassiterite, galena, sphalerite, acanthite, composite Cu-Zn-Pb-Fe sulfides, Sb-As-Se sulfosalts and Pb-Ag tellurides. A two-stage model for magmatic–hydrothermal transport of some siderophile (W, Pt, Au) and chalcophile (Cu, Zn, Ag) metals in subduction–collision environments is proposed. Full article

Igneous rocks from the Russian Far East contain Cu-Ag-Au microspherules with distinct exterior and interior structures, compositions and assemblages of Cu-rich micro-inclusions. Natural microspherules are compared in this study with technogenic Cu-Ag-Au microspherules, which are experimentally produced and extracted from gold scrap jewelry. The following set of diagnostic criteria are considered to distinguish natural from technogenic microspherules on a genetic basis as follows: (1) compacted-related features versus cellular appearance of the exterior; (2) lack of exsolution- or crystallization-related features in natural and domain-type internal structure in technogenic microspherules; (3) absence of spherical copper-oxide inclusions along with meniscus-type textural boundaries in technogenic mcirospherules; (4) pure copper-oxide composition of inclusions versus the common presence of Fe, Ni, Zn, Cu and Na in natural microspherules. The diagnostic characteristics of natural Cu-Ag-Au microspherules suggest extremely fast cooling rates during their formation, which is possible during violent explosive volcanic eruptions or injection of partially molten, pulverized metal alloys into shallow intra-crustal cavities and fault-related tectonic gashes. Full article

Non-recessed ohmic contact resistance (R_c) on ultrathin-barrier (UTB) AlGaN(<6 nm)/GaN heterostructure was effectively reduced to a low value of 0.16 Ω·mm. The method called the ‘ohmic-before-passivation’ process was adopted to eliminate the effects of fluorine plasma etching, in which an alloyed Ti/Al/Ni/Au ohmic metal stack was formed prior to passivation. The recovery of 2-D Electron Gas (2DEG) adjacent to the ohmic contact was enhanced by composite double-layer dielectric with AlN/SiN_x passivation. It is found that the separation between the recovered 2DEG and the ohmic contacting edge can be remarkably reduced, contributing to a reduced transfer length (L_T) and low R_c, as compared to that of ohmic contact to the AlGaN(~20 nm)/GaN heterostructure with a pre-ohmic recess process. Thermionic field emission is verified to be the dominant ohmic contact mechanism by temperature-dependent current-voltage measurements. The low on-resistance of 3.9 Ω·mm and the maximum current density of 750 mA/mm with V_g = 3 V were achieved on the devices with the optimized ohmic contact. The non-recessed ohmic contact with the ‘ohmic-before-passivation’ process is a promising strategy to optimize the performance of low-voltage GaN-based power devices. Full article

Embedding energetically stable single metal atoms in the surface of Pt nanocatalysts exposed to varied temperature (T) and hydrogen pressure (P) could open up new possibilities in selective and dynamical engineering of alloyed Pt catalysts, particularly interesting for hydrogenation reactions. In this work, an environmental segregation energy model is developed to predict the stability and the surface composition evolution of 24 Metal M-promoted Pt surfaces (with M: Cu, Ag, Au, Ni, Pd, Co, Rh and Ir) under varied T and P. Counterintuitive to expectations, the results show that the more reactive alloy component (i.e., the one forming the strongest chemical bond with the hydrogen) is not the one that segregates to the surface. Moreover, using DFT-based Multi-Scaled Reconstruction (MSR) method and by extrapolation of M-promoted Pt nanoparticles (NPs), the shape dynamics of M-Pt are investigated under the same ranges of T and P. The results show that under low hydrogen pressure and high temperature ranges, Ag and Au—single atoms (and Cu to a less extent) are energetically stable on the surface of truncated octahedral and/or cuboctahedral shaped NPs. This indicated that coinage single-atoms might be used to tune the catalytic properties of Pt surface under hydrogen media. In contrast, bulk stability within wide range of temperature and pressure is predicted for all other M-single atoms, which might act as bulk promoters. This work provides insightful guides and understandings of M-promoted Pt NPs by predicting both the evolution of the shape and the surface compositions under reaction gas condition. Full article