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14 pages, 1957 KiB  
Article
Reliability and Availability Analysis of a Two-Unit Cold Standby System with Imperfect Switching
by Nariman M. Ragheb, Emad Solouma, Abdullah A. Alahmari and Sayed Saber
Axioms 2025, 14(8), 589; https://doi.org/10.3390/axioms14080589 - 29 Jul 2025
Viewed by 224
Abstract
This paper presents a stochastic analysis of a two-unit cold standby system incorporating imperfect switching mechanisms. Each unit operates in one of three states: normal, partial failure, or total failure. Employing Markov processes, the study evaluates system reliability by examining the mean time [...] Read more.
This paper presents a stochastic analysis of a two-unit cold standby system incorporating imperfect switching mechanisms. Each unit operates in one of three states: normal, partial failure, or total failure. Employing Markov processes, the study evaluates system reliability by examining the mean time to failure (MTTF) and steady-state availability metrics. Failure and repair times are assumed to follow exponential distributions, while the switching mechanism is modeled as either perfect or imperfect. The results highlight the significant influence of switching reliability on both MTTF and system availability. This analysis is crucial for optimizing the performance of complex systems, such as thermal power plants, where continuous and reliable operation is imperative. The study also aligns with recent research trends emphasizing the integration of preventive maintenance and advanced reliability modeling approaches to enhance overall system resilience. Full article
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49 pages, 1749 KiB  
Article
A Hybrid Fault Tree–Fuzzy Logic Model for Risk Analysis in Multimodal Freight Transport
by Catalin Popa, Ovidiu Stefanov, Ionela Goia and Filip Nistor
Systems 2025, 13(6), 429; https://doi.org/10.3390/systems13060429 - 3 Jun 2025
Viewed by 630
Abstract
Multimodal freight transport systems, integrating maritime, rail, and road modes, play a vital role in modern logistics but face elevated operational, human, and environmental risks due to their complexity and interdependencies. To address the limitations of conventional risk assessment methods, this study proposes [...] Read more.
Multimodal freight transport systems, integrating maritime, rail, and road modes, play a vital role in modern logistics but face elevated operational, human, and environmental risks due to their complexity and interdependencies. To address the limitations of conventional risk assessment methods, this study proposes a hybrid risk modeling framework that integrates fault tree analysis (FTA), dynamic fault trees (DFTs), and fuzzy logic reasoning. This approach supports the modeling of sequential failures and captures qualitative uncertainties such as human fatigue and inadequate training. The framework incorporates reliability metrics, including Mean Time to Failure (MTTF) and Mean Time Between Failures (MTBF), enabling the quantification of system resilience and identification of critical failure pathways. Application of the model revealed human error, particularly procedural violations, insufficient training, and fatigue, as the dominant risk factor across transport modes. Road transport exhibited the highest probability of risk occurrence (p = 0.9960), followed by rail (p = 0.9937) and maritime (p = 0.9900). By integrating probabilistic reasoning with qualitative insights, the proposed model offers a flexible decision support tool for logistics operators and policymakers, enabling scenario-based risk planning and enhancing system robustness under uncertainty. Full article
(This article belongs to the Section Supply Chain Management)
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16 pages, 5108 KiB  
Article
Advancing Understanding of High-Temperature Micro-Electro-Mechanical System Failures with New Simulation-Assisted Approach
by Weronika Lidia Sadurska, Matthias Imboden, Jürgen Burger and Alex Jean Dommann
Sensors 2025, 25(10), 3120; https://doi.org/10.3390/s25103120 - 15 May 2025
Viewed by 520
Abstract
High-temperature micro-electro-mechanical systems (MEMSs) are critical for applications in extreme environments and applications where the operating temperature can exceed 1000 °C, but their long-term performance is limited by complex failure mechanisms, including material degradation caused by atomic migration. This study introduces a simulation-assisted [...] Read more.
High-temperature micro-electro-mechanical systems (MEMSs) are critical for applications in extreme environments and applications where the operating temperature can exceed 1000 °C, but their long-term performance is limited by complex failure mechanisms, including material degradation caused by atomic migration. This study introduces a simulation-assisted approach to analyze and predict the dominant failure modes, focusing on vacancy fluxes and their driving forces, within high-temperature MEMS structures. The focus is on tungsten-based structures operating at a temperature of 1580 °C. This approach couples electric-, stress- and temperature-dependent simulations to evaluate atomic migration pathways, which are key contributors to failure. This study demonstrates that void accumulation, driven by vacancy migration, results in localized current density increase, hotspot formation, and accelerated structural degradation. The mean time to failure (MTTF) is shown to have exponential dependence on temperature and inverse-square dependence on current density, highlighting the critical role of these parameters in device reliability. These findings provide a deeper understanding of the failure mechanisms in high-temperature MEMSs and underscore the need for design strategies that mitigate electromigration and stress-induced void growth to enhance device performance and longevity. Full article
(This article belongs to the Section Physical Sensors)
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20 pages, 1287 KiB  
Article
Integrated Approach to Marine Engine Maintenance Optimization: Weibull Analysis, Markov Chains, and DEA Model
by Damir Budimir, Dario Medić, Vlatka Ružić and Mateja Kulej
J. Mar. Sci. Eng. 2025, 13(4), 798; https://doi.org/10.3390/jmse13040798 - 16 Apr 2025
Viewed by 1016
Abstract
This study addresses the growing need for predictive maintenance in the maritime industry by proposing an optimized strategy for ship engine maintenance. The aim is to reduce unplanned failures that cause significant financial losses and disrupt global logistics flows. The methodology integrates Weibull [...] Read more.
This study addresses the growing need for predictive maintenance in the maritime industry by proposing an optimized strategy for ship engine maintenance. The aim is to reduce unplanned failures that cause significant financial losses and disrupt global logistics flows. The methodology integrates Weibull reliability analysis, Markov chains, and Data Envelopment Analysis (DEA). A dataset of 512 diesel engine components from container ships was analysed, where the Weibull distribution (β = 1.8; α = 18,500 h) accurately modelled failure patterns, and Markov chains captured transitions between operational states (normal, degraded, failure). DEA was used to evaluate the efficiency of different maintenance strategies. Results indicate that targeting interventions in the degraded state significantly reduces downtime and improves component reliability, particularly for high-pressure fuel pumps and turbochargers. Optimizing maintenance extended the Mean Time to Failure (MTTF) up to 22,000 h and reduced the proportion of failures in critical components from 64.3% to 40%. These findings support a transition from reactive to proactive maintenance models, contributing to enhanced fleet availability, safety, and cost-effectiveness. The approach provides a quantitative foundation for predictive maintenance planning, with potential application in fleet management systems and smart ship platforms. Full article
(This article belongs to the Section Ocean Engineering)
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12 pages, 6973 KiB  
Article
Investigation on Electromigration-Induced Failure and Reservoir Effect in AlCu Interconnects
by Yuanxiang Zhang, Guoquan Jiang, Jingbo Zhao and Lihua Liang
Micromachines 2025, 16(4), 458; https://doi.org/10.3390/mi16040458 - 13 Apr 2025
Cited by 1 | Viewed by 651
Abstract
Aluminum–copper alloy (AlCu) is commonly utilized as interconnect material in low-power devices. However, as the size of electronic devices continues to decrease and current density increases, electromigration (EM) has emerged as a significant reliability concern for AlCu interconnects in the microelectronics industry. In [...] Read more.
Aluminum–copper alloy (AlCu) is commonly utilized as interconnect material in low-power devices. However, as the size of electronic devices continues to decrease and current density increases, electromigration (EM) has emerged as a significant reliability concern for AlCu interconnects in the microelectronics industry. In this study, two-level AlCu interconnect structures with a Ti/TiN barrier layer were fabricated using 0.18 μm technology to perform accelerated EM tests. The test samples were subjected to three current levels (1.45 mA, 2.40 mA and 5.30 mA) at three ambient temperatures (200 °C, 225 °C and 250 °C) to investigate the nucleation and evolution of voids during EM degradation and then obtain the mean time to failure (MTTF). The numerical simulation method of atomic density integral (ADI) was used to simulate experimental observations based on the ANSYS platform, considering the coupled effects of electron wind force, stress gradient, temperature gradient, and atomic density gradient. A comparison of the experimental results and numerical simulations proves that the ADI method can be applied successfully to EM failure prediction of AlCu interconnects. Finite element models with different reservoir lengths were built to demonstrate the mechanism of the reservoir effect. The results show that the reservoir can improve the EM lifetime of the interconnect, but there is a critical extension length beyond which increasing extension sizes have no effect on EM lifetime. Full article
(This article belongs to the Topic Advanced Integrated Circuit Design and Application)
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16 pages, 5342 KiB  
Article
Enhancing the Reliability of Shearing Tools: A Modular Approach with Weld Deposition Technology
by Daniela Maria Iovanas and Adela-Eliza Dumitrascu
Materials 2025, 18(7), 1527; https://doi.org/10.3390/ma18071527 - 28 Mar 2025
Viewed by 296
Abstract
The increasing demand for sustainable and cost-effective manufacturing solutions has led to the development of innovative approaches to enhance the durability and reliability of cutting tools. This study presents a novel method for manufacturing shearing tools utilizing interchangeable modular elements loaded by deposition [...] Read more.
The increasing demand for sustainable and cost-effective manufacturing solutions has led to the development of innovative approaches to enhance the durability and reliability of cutting tools. This study presents a novel method for manufacturing shearing tools utilizing interchangeable modular elements loaded by deposition welding with covered electrodes. Using Weibull distribution modeling, a comparative reliability analysis between conventionally manufactured shear tools and the proposed modular design demonstrates a significant increase in the mean time to failure (MTTF). The least squares method (LSM) estimation was used in order to determine the shearing tools’ lifetime, expressed by reliability indices. Experimental results confirm that the modular tools achieve more than double the lifetime of traditional counterparts, with improved resistance to wear and mechanical stress. These findings highlight the potential for widespread industrial application, optimizing tool performance and sustainability in manufacturing processes. Full article
(This article belongs to the Special Issue Advanced Additive Manufacturing and Application)
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16 pages, 298 KiB  
Article
Reliability and Performance Optimization of Multi-Subsystem Systems Using Copula-Based Repair
by Elsayed E. Elshoubary, Taha Radwan and Rasha Abd El-Wahab Attwa
Axioms 2025, 14(3), 163; https://doi.org/10.3390/axioms14030163 - 24 Feb 2025
Viewed by 501
Abstract
This paper proposes a system made up of four subsystems connected in sequence. The first and third subsystems each have one unit, the second has two, and the fourth has three. Every subsystem operates in parallel and is governed by the K-Out-of-n:G rule. [...] Read more.
This paper proposes a system made up of four subsystems connected in sequence. The first and third subsystems each have one unit, the second has two, and the fourth has three. Every subsystem operates in parallel and is governed by the K-Out-of-n:G rule. Nonetheless, each subsystem needs at least one operational unit in order for the system to work. While a unit’s failure has an exponential distribution, repair is simulated using a general distribution and a distribution from the Gumbel–Hougaard family of copula. This study’s primary objective is to assess and contrast the system performance while our system is running under these two different repair policies. The problem is solved by combining the supplementary variable technique with Laplace transforms. We use reliability metrics to assess system performance. The second objective of this study is to present a reduction approach plan aimed at improving the overall reliability metrics of our system. Full article
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13 pages, 2164 KiB  
Article
Estimating the Reliability and Sensitivity of a Public Address System Through the Markov Decision Process
by Pardeep Kumar and Amit Kumar
Telecom 2024, 5(4), 1179-1191; https://doi.org/10.3390/telecom5040059 - 26 Nov 2024
Viewed by 1147
Abstract
This research aims to evaluate the reliability indices of a public address system (PAS) through the Markovian approach. Many organizations and businesses use this system to address or broadcast a message or pass on important information to the huge gatherings assembled at big [...] Read more.
This research aims to evaluate the reliability indices of a public address system (PAS) through the Markovian approach. Many organizations and businesses use this system to address or broadcast a message or pass on important information to the huge gatherings assembled at big premises. This system is the nerve of these organizations and businesses. The major components of a PAS are a microphone, mixer, amplifier, and speaker. These components should work in harmony with one another to execute the intended task. Any failure in these components leads to big issues for the public, and they may miss very important information. Therefore, the reliability assessment of this system is of utmost importance. The authors used the Markovian decision process to model the PAS by analyzing the various failure rates and repairs of the components. The explicit expressions for reliability, availability, and MTTF have been obtained for clear understanding about the PAS behavior with time as well as different failures. The sensitivity analysis of reliability is performed as well to determine the critical components of the system. The obtained results show that the reliability of the PAS at 2000 operated hours is 0.8. Also, the finding reflects that the PAS reliability is much sensitive with the failure rate of microphone, mixer, and amplifier. Full article
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21 pages, 2410 KiB  
Article
Assessing the Bridge Structure’s System Reliability Utilizing the Generalized Unit Half Logistic Geometric Distribution
by Ahlam H. Tolba, Osama Abdulaziz Alamri and Hanan Baaqeel
Mathematics 2024, 12(19), 3072; https://doi.org/10.3390/math12193072 - 30 Sep 2024
Cited by 1 | Viewed by 771
Abstract
Reliability is now widely recognized across various industries, including manufacturing. This study investigates a system composed of five components, one of which is a bridge network. The components are assumed to follow the generalized unit half logistic geometric distribution (GUHLGD) with equal failure [...] Read more.
Reliability is now widely recognized across various industries, including manufacturing. This study investigates a system composed of five components, one of which is a bridge network. The components are assumed to follow the generalized unit half logistic geometric distribution (GUHLGD) with equal failure rates over time. The following three improvement methods are considered: reduction, cold duplication, and hot duplication. The reliability function and mean time to failure (MTTF) are employers liability equivalence factors (REFs). Additionally, the λ fractiles of both the original and enhanced systems are obtained. Numerical results illustrate the effectiveness of these techniques, with cold duplication shown to be the most effective, offering higher reliability and MTTF compared to hot duplication. The enhanced system outperforms the original system overall. Full article
(This article belongs to the Section E2: Control Theory and Mechanics)
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15 pages, 2276 KiB  
Article
Reliability and Sensitivity Analysis of Wireless Sensor Network Using a Continuous-Time Markov Process
by Amit Kumar, Sujata Jadhav and Omar Mutab Alsalami
Mathematics 2024, 12(19), 3057; https://doi.org/10.3390/math12193057 - 29 Sep 2024
Cited by 2 | Viewed by 1766
Abstract
A remarkably high growth has been observed in the uses of wireless sensor networks (WSNs), due to their momentous potential in various applications, namely the health sector, smart agriculture, safety systems, environmental monitoring, military operations, and many more. It is quite important that [...] Read more.
A remarkably high growth has been observed in the uses of wireless sensor networks (WSNs), due to their momentous potential in various applications, namely the health sector, smart agriculture, safety systems, environmental monitoring, military operations, and many more. It is quite important that a WSN must have high reliability along with the least MTTF. This paper introduces a continuous-time Markov process, which is a special case of stochastic process, based on modeling of a wireless sensor network for analyzing the various reliability indices of the same. The modeling has been conducted by considering the different components, including the sensing unit, transceiver, microcontroller, power supply, standby power supply unit, and their failures/repairs, which may occur during their functioning. The study uncovered different important assessment parameters like reliability, components-wise reliability, MTTF, and sensitivity analysis. The critical components of a WSN are identified by incorporating the concept of sensitivity analysis. The outcomes emphasize that the proposed model will be ideal for understanding different reliability indices of WSNs and guiding researchers and potential users in developing a more robust wireless sensor network system. Full article
(This article belongs to the Special Issue Graph Theory and Network Theory)
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10 pages, 270 KiB  
Article
Exact Reliability and Signature Formulas for Linear m-Consecutive-k-out-of-n: F Systems
by Gökhan Gökdere and Ayse Bugatekin
Axioms 2024, 13(8), 541; https://doi.org/10.3390/axioms13080541 - 9 Aug 2024
Cited by 1 | Viewed by 819
Abstract
An m-consecutive-k-out-of-n: F (m/C/k/n: F) system consists of n linearly ordered components such that the system fails if and only if there are at least m nonoverlapping runs of k consecutive failed components. [...] Read more.
An m-consecutive-k-out-of-n: F (m/C/k/n: F) system consists of n linearly ordered components such that the system fails if and only if there are at least m nonoverlapping runs of k consecutive failed components. Our motivation in this work is to obtain efficient formulas for the signature and reliability of the m/C/k/n: F system with independent and identical (i.i.d) components that are easy to implement and have a low computational time. We demonstrate that the reliability formula derived for this system requires less computational time than the m/C/k/n: F system formula currently in use. For the minimal and maximal signatures of the m/C/k/n: F system, we provide precise equations. In addition, the average number of faulty components at the time of an m/C/k/n: F system failure and mean time to failure (MTTF) of an m/C/k/n: F system are analyzed through the system signature. Full article
17 pages, 309 KiB  
Article
Studying the Efficiency of the Apache Kafka System Using the Reduction Method, and Its Effectiveness in Terms of Reliability Metrics Subject to a Copula Approach
by Elsayed E. Elshoubary and Taha Radwan
Appl. Sci. 2024, 14(15), 6758; https://doi.org/10.3390/app14156758 - 2 Aug 2024
Cited by 3 | Viewed by 1728
Abstract
This research envisages a system composed of three subsystems connected in series. Each subsystem comprises three units connected in parallel. For the system to function, at least one unit per subsystem must remain operational. Unit failure is governed by an exponential distribution, while [...] Read more.
This research envisages a system composed of three subsystems connected in series. Each subsystem comprises three units connected in parallel. For the system to function, at least one unit per subsystem must remain operational. Unit failure is governed by an exponential distribution, while unit repair is governed by either a general distribution or a Gumbel–Hougaard family copula distribution. The primary goal of this research is to compare the overall performance of our system under these two different regimes for performing repairs. Laplace transforms and supplementary variable methods are employed in solving the system. Our metrics for evaluating system performance are the availability, reliability, mean time to failure, and cost. The second goal of this research is to showcase a strategy for reduction that enhances the overall efficiency and availability of our system. Full article
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16 pages, 4149 KiB  
Article
Development of a Convenient and Quantitative Method for Evaluating Photosensitizing Activity Using Thiazolyl Blue Formazan Dye
by Smee Kang, Yeong Ji Oh, Mi-Ri Kim, Yu Na Jung, Eiseul Song, Hyowon Lee and Jungil Hong
Molecules 2024, 29(11), 2471; https://doi.org/10.3390/molecules29112471 - 24 May 2024
Cited by 1 | Viewed by 1345
Abstract
Photosensitizers cause oxidative damages in various biological systems under light. In this study, the method for analyzing photosensitizing activity of various dietary and medicinal sources was developed using 1-(4,5-dimethylthiazol-2-yl)-3,5-diphenylformazan (thiazolyl blue formazan; MTT-F) as a probe. Significant and quantitative decolorization of MTT-F was [...] Read more.
Photosensitizers cause oxidative damages in various biological systems under light. In this study, the method for analyzing photosensitizing activity of various dietary and medicinal sources was developed using 1-(4,5-dimethylthiazol-2-yl)-3,5-diphenylformazan (thiazolyl blue formazan; MTT-F) as a probe. Significant and quantitative decolorization of MTT-F was observed in the presence of photosensitizers used in this study under light but not under dark conditions. The decolorization of MTT-F occurred irradiation time-, light intensity-, and photosensitizer concentration-dependently. The decolorized MTT-F was reversibly reduced by living cells; the LC-MS/MS results indicated the formation of oxidized products with −1 m/z of base peak from MTT-F, suggesting that MTT-F decolorized by photosensitizers was its corresponding tetrazolium. The present results indicate that MTT-F is a reliable probe for the quantitative analysis of photosensitizing activities, and the MTT-F-based method can be an useful tool for screening and evaluating photosensitizing properties of various compounds used in many industrial purposes. Full article
(This article belongs to the Section Analytical Chemistry)
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16 pages, 3270 KiB  
Article
Lifetime Analysis of Dies Manufactured by Conventional Processes and Reconditioned by Deposition Welding Operation
by Daniela Maria Iovanas and Adela-Eliza Dumitrascu
Materials 2024, 17(7), 1469; https://doi.org/10.3390/ma17071469 - 22 Mar 2024
Cited by 1 | Viewed by 1124
Abstract
The refurbishment of dies by the deposition welding of wear areas is an efficient and economical process. The aim of this study was to conduct a comparative analysis of the lifetimes of different types of dies for the manufacturing of wagon wheels. The [...] Read more.
The refurbishment of dies by the deposition welding of wear areas is an efficient and economical process. The aim of this study was to conduct a comparative analysis of the lifetimes of different types of dies for the manufacturing of wagon wheels. The analyzed dies were manufactured by conventional processes (Type I) and reconditioned through a deposition welding procedure using a dedicated electrode (Type II). The Anderson–Darling test was conducted to analyze the goodness of fit of the lifetime data specific to the die types. The maximum likelihood estimation method (MLE) with a 95% confidence interval (CI) was applied in order to estimate the lifetime distribution parameters. It was found that the lifetimes of type II dies were longer than those of type I dies. The mean time to failure (MTTF) recorded for reconditioned dies was 426 min, while the mean time to failure of dies manufactured by conventional processes was approximatively 253 min. In addition, an accentuated hazard rate for type I dies compared to type II dies was observed. The results of this analysis emphasized the fact that dies can be restored to their initial operating capacity by successfully using deposition welding procedures that confer a high resistance to operational loads. At the same time, the use of these procedures allows for the sustainable development of resources and waste management. Full article
(This article belongs to the Special Issue Manufacturing Technology, Materials and Methods (Second Edition))
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15 pages, 8317 KiB  
Article
Reliability Assessment of On-Wafer AlGaN/GaN HEMTs: The Impact of Electric Field Stress on the Mean Time to Failure
by Surajit Chakraborty and Tae-Woo Kim
Micromachines 2023, 14(10), 1833; https://doi.org/10.3390/mi14101833 - 26 Sep 2023
Cited by 2 | Viewed by 3248
Abstract
We present the mean time to failure (MTTF) of on-wafer AlGaN/GaN HEMTs under two distinct electric field stress conditions. The channel temperature (Tch) of the devices exhibits variability contingent upon the stress voltage and power dissipation, thereby influencing the long-term [...] Read more.
We present the mean time to failure (MTTF) of on-wafer AlGaN/GaN HEMTs under two distinct electric field stress conditions. The channel temperature (Tch) of the devices exhibits variability contingent upon the stress voltage and power dissipation, thereby influencing the long-term reliability of the devices. The accuracy of the channel temperature assumes a pivotal role in MTTF determination, a parameter measured and simulated through TCAD Silvaco device simulation. Under low electric field stress, a gradual degradation of IDSS is noted, accompanied by a negative shift in threshold voltage (ΔVT) and a substantial increase in gate leakage current (IG). Conversely, the high electric field stress condition induces a sudden decrease in IDSS without any observed shift in threshold voltage. For the low and high electric field conditions, MTTF values of 360 h and 160 h, respectively, were determined for on-wafer AlGaN/GaN HEMTs. Full article
(This article belongs to the Special Issue GaN-Based Semiconductor Devices, Volume II)
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