EuroSPI for Safety–Security–Resilience Integration

A special issue of Technologies (ISSN 2227-7080). This special issue belongs to the section "Information and Communication Technologies".

Deadline for manuscript submissions: 10 January 2027 | Viewed by 62

Editors


E-Mail Website
Guest Editor
ISCN GesmbH, 8020 Graz, Austria
Interests: cybersecurity; functional safety; innovation; automotives; defense

E-Mail Website
Guest Editor
Escuela Técnica Superior de Ingenieros Informáticos, Universidad Politécnica de Madrid, 28660 Madrid, Spain
Interests: software process improvement; software engineering; management information; systems cybersecurity
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Grenoble Institute of Engineering and Management, Grenoble Alpes University, CNRS, Grenoble INP, G-SCOP, 46 Avenue Félix Viallet, 38000 Grenoble, France
Interests: industry 4.0/5.0; sustainable innovation ecosystems; systems and software engineering; functional safety; cybersecurity; ecodesign; circular economy; product-service systems
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

This Special Issue aims to showcase papers that emerge from the EuroSPI community, focusing on the intersection of cybersecurity and operational resilience within industrial and mobility ecosystems. Rooted in real-world industrial applications across sectors, this issue highlights Software and Systems Process Improvement (SPI) and industrial engineering methodologies necessary to secure complex, interconnected environments.

Subject areas include, but are not limited to, the following:

  • Automotive Security Process Engineering: Practical implementation and auditing of Automotive SPICE (A-SPICE) for cybersecurity, ISO/SAE 21434, ISO PAS 5112 and CSMS systems, and UN-R 155.
  • Cybersecurity in Non-Automotive Domains: Cybersecurity in medicine, critical infrastructure, aerospace, and defense.
  • Safety–Security–Resilience Integration in Automotives: Managing design and engineering trade-offs between functional safety (ISO 26262), cybersecurity (ISO 21434), and operational resilience in software-defined vehicles (SDVs).
  • AI Cyber-Resilience: The potential of machine learning, digital twins, and intelligent automation for predictive risk assessment, anomaly detection, or defending against adversarial attacks, including the cyber-resilience of AI algorithms and data.
  • Use of GenAI and AI for Cybersecurity Verification: To analyze vulnerabilities, identify attack paths, design test cases and test programs for cybersecurity verification and validation.
  • V2X and Mobility Infrastructure Security: Securing vehicle-to-everything communications, fleet telematics, cloud backends, and EV charging infrastructure.
  • IT/OT Convergence in Manufacturing: Process models for securing supply chains, product provenance (e.g., SBOM), and the factory floor (OT) alongside corporate IT networks.
  • Industrial Case Studies: Empirical reports, lessons learned, and experience reports on the topics above.
  • Innovation and Strategic Foresight in Cybersecurity: Using modern research systems, GenAI/AI and big cloud data to predict cybersecurity research trends.

In addition to extended versions of high-quality papers presented at EuroSPI conferences (containing at least 50% new technical content), we also welcome standalone original research and review papers on these topics that were not part of the conference.

Dr. Richard Messnarz
Prof. Dr. Ricardo Colomo-Palacios
Dr. Andreas Riel
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Technologies is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • cybersecurity standards and best practices
  • cybersecurity and AI/GenAI
  • software-defined vehicles (SDVs)
  • cybersecurity forecast
  • threat analysis and risk assessment
  • experiences and solutions for cybersecurity
  • safety/AI/cybersecurity integration

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.

Further information on MDPI's Special Issue policies can be found here.

Published Papers

This special issue is now open for submission.
Back to TopTop