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Special Issue "Selected papers from the 2020 IEEE International Worshop on Metrology for Industry 4.0 and IoT"

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Intelligent Sensors".

Deadline for manuscript submissions: 31 October 2020.

Special Issue Editors

Dr. Carlo Massaroni
E-Mail Website
Guest Editor
Unit of Measurements and Biomedical Instrumentation, Università Campus Bio-Medico di Roma, Via Alvaro del Portillo, 00128 Rome, Italy
Interests: design of wearable systems for non-invasive measurement of respiratory and cardiac parameters; tests of available technologies for non-invasive measurement in the medical field; fiber optics for development of sensors and measuring chains for medical field
Special Issues and Collections in MDPI journals
Prof. Dr. Lorenzo Scalise
E-Mail Website
Guest Editor
Department of Industrial Engineering and Mathematical Sciences, Università Politecnica delle Marche, Ancona, Italy
Interests: mechanical and thermal measurements; sensors; measurement methods; ambient assisted living; wearable sensors; optical sensors; biomedical sensors
Special Issues and Collections in MDPI journals

Special Issue Information

Dear Colleagues,

The 2020 IEEE International Workshop on Metrology for Industry 4.0 and IoT ( will be held in Rome, Italy on 3–5 June 2020. Authors of papers presented at the workshop related to Sensors are invited to submit extended versions of their work to this Special Issue for publication.

MetroInd4.0&IoT aims to discuss the contributions of metrology for the development of Industry 4.0 and IoT and the new opportunities offered by Industry 4.0 and IoT for the development of new measurement methods and apparatuses. We aim to provide a platform to gather people who work in the development of instrumentation and measurement methods for Industry 4.0 and IoT. Particular areas of focus include, but are not limited to, new technology for metrology-assisted production in Industry 4.0 and IoT, Industry 4.0 and IoT component measurements, sensors and associated signal conditioning for Industry 4.0 and IoT, and calibration methods for electronic tests and measurement for Industry 4.0 and IoT.


  • industrial sensors;
  • virtual sensors and sensor interfacing;
  • IoT enabled sensors and measurement systems;
  • measurement applications based on IoT;
  • Industrial IoT, Factory of Things, and Internet of Things;
  • Wireless sensor networks and IoT;
  • Wearables and body sensor networks;
  • sensors data management;
  • localization technologies;

Dr. Carlo Massaroni
Dr. Lorenzo Scalise
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers

This special issue is now open for submission.
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