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The Evolving Landscape of Ultrasonic Sensing and Testing

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Fault Diagnosis & Sensors".

Deadline for manuscript submissions: 30 July 2026 | Viewed by 1112

Special Issue Editors


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Guest Editor
School of Manufacturing Systems and Networks, Arizona State University, Tempe, Mesa, AZ 85212, USA
Interests: robotic inspection; ultrasonic testing; nondestructive testing

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Guest Editor
Department of Manufacturing Engineering, Georgia Southern University, Statesboro, GA 30460, USA
Interests: ultrasound; acoustic, sound; material testing; acoustic emission; distributed acoustic sensing; noise; vibration; nonlinear; numerical; piezo
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Special Issue Information

Dear Colleagues,

Ultrasonic sensing, having been used in nature for millions of years for communication, navigation, and food foraging, has evolved. This natural technology has been adapted to human applications following the invention of piezoelectric materials, which made its usage possible. Since then, ultrasonic testing has advanced significantly and has been widely applied in both medical and industrial fields, helping save millions of lives.

Today, a new era in ultrasonic testing is emerging, driven by progress in manufacturing processes, the development of new materials, advanced computational algorithms such as AI, high-performance computing tools, and the integration of robotics and automation.

This Special Issue aims to capture recent advancements in ultrasonic testing and provide insight into the future direction of this technology—working toward a safer and more efficient world.

Dr. Ehsan Dehghan-Niri
Dr. Hossein Taheri
Guest Editors

Manuscript Submission Information

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Keywords

  • ultrasonic testing
  • signal processing
  • automation
  • AI
  • ML
  • digital twin
  • ultrasonic imaging
  • ultrasonic process monitoring
  • scanning acoustic microscopy
  • ultrasound metrology
 

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Published Papers (2 papers)

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Research

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10 pages, 1904 KB  
Article
Resonant Ultrasound Spectroscopy Detection Using a Non-Contact Ultrasound Microphone
by Jake Pretula, Nolan Shaw, Ayden Chen, Kyle G. Scheuer and Ray G. DeCorby
Sensors 2025, 25(19), 6154; https://doi.org/10.3390/s25196154 - 4 Oct 2025
Viewed by 700
Abstract
We observed vibrational eigenmodes for a variety of millimeter-scale objects, including glass and sapphire lenses, by placing them on a piezoelectric ‘shaker’ driven by a broadband noise or frequency sweep signal, and using an optomechanical microphone to pick up their vibrational signatures emitted [...] Read more.
We observed vibrational eigenmodes for a variety of millimeter-scale objects, including glass and sapphire lenses, by placing them on a piezoelectric ‘shaker’ driven by a broadband noise or frequency sweep signal, and using an optomechanical microphone to pick up their vibrational signatures emitted into the surrounding air. High-quality vibrational modes were detected over the ~0–8 MHz range for a typical object–microphone spacing of 1–10 mm. The observed eigenfrequencies are shown to be in excellent agreement with numerical predictions. Non-contact detection of resonant vibrational eigenmodes in the MHz ultrasound range could find application in the quality control of numerous industrial parts, such as ball bearings and lenses. Full article
(This article belongs to the Special Issue The Evolving Landscape of Ultrasonic Sensing and Testing)
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Review

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36 pages, 3584 KB  
Review
Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review
by Pouria Meshki Zadeh, Sebastian Brand and Ehsan Dehghan-Niri
Sensors 2025, 25(24), 7499; https://doi.org/10.3390/s25247499 - 10 Dec 2025
Viewed by 220
Abstract
Microelectronic packaging is crucial for protecting, powering, and interconnecting semiconductor chips, playing a critical role in the functionality and reliability of electronic devices. With the growth in complexity and miniaturization of these products, the implementation of efficient inspection techniques becomes crucial in preventing [...] Read more.
Microelectronic packaging is crucial for protecting, powering, and interconnecting semiconductor chips, playing a critical role in the functionality and reliability of electronic devices. With the growth in complexity and miniaturization of these products, the implementation of efficient inspection techniques becomes crucial in preventing failures that may result in device malfunctions. This review paper examines the progress made in utilizing Scanning Acoustic Microscopy (SAM) to assess the structural integrity of microelectronic systems within the broader field of Nondestructive Evaluation/Testing (NDE/T) methods. With an exclusive emphasis on SAM, we point out SAM technological advancements in multi-die stacking, Through Silicon Vias (TSV), and hybrid bonding inspection that improve inspection sensitivity and resolution required to be prepared for upcoming challenges accompanying 3D- and heterogeneous integration architectures. Some of these approaches compromise the depth of inspection for the benefit of lateral resolution, while others do not sacrifice the in-depth range of evaluation. These developments are of the utmost importance in addressing the substantial obstacles associated with examining microelectronic packages, facilitating the early detection of potential failures, and enhancing the reliability and robustness of semiconductor devices. Furthermore, our discussion consists of the fundamental principles and practical approaches of SAM. It also examines recent investigations that integrate SAM with machine learning concepts and the application of deep learning models in order to automate defect detection and characterization, thus substantially augmenting the efficiency of microelectronic package assessments. Full article
(This article belongs to the Special Issue The Evolving Landscape of Ultrasonic Sensing and Testing)
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