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Sensing Technologies in Additive Manufacturing
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Sensing Technologies in Additive Manufacturing

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: 31 May 2025 | Viewed by 4703

Special Issue Editor

Dr. Ehsan Marzbanrad

E-Mail Website
Guest Editor
Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, ON N2L 3W8, Canada
Interests: sensors; printed electronics; additive manufacturing
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The integration of sensors into additively manufacturing technologies and printed parts has huge potential to address critical aspects, such as monitoring, control, optimization, defect detection, and prevention. This Special Issue explores the cutting-edge applications of sensing technology in various additive manufacturing processes, including Laser Powder Bed Fusion, Directed Energy Deposition, Electron Beam, Binder Jetting, Wire Arc Additive, and Solid-State additive manufacturing.

These are the key topics of this Special Issue:

  • Innovative sensor technologies for monitoring, control, and optimizing printing processes and enhancing efficiency.
  • Utilizing sensors for real-time defect detection and prevention, guaranteeing the production of high-quality parts.
  • The incorporation of artificial intelligence in conjunction with sensors for online monitoring and the adaptive control of manufacturing processes.
  • Embedding sensors within manufactured components to create smart parts that can provide real-time data about their performance and health throughout their lifecycle.
  • Employing Additive Manufacturing technologies for direct writing on 3D parts.

Dr. Ehsan Marzbanrad
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

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Published Papers (3 papers)

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Research

13 pages, 12527 KiB  
Article
A 3D-Printed Bi-Material Bragg-Based Reflectarray Antenna
by Walid Chekkar, Jerome Lanteri, Tom Malvaux, Julien Sourice, Leonardo Lizzi, Claire Migliaccio and Fabien Ferrero
Sensors 2024, 24(20), 6512; https://doi.org/10.3390/s24206512 - 10 Oct 2024
Viewed by 1529
Abstract
This paper presents a 3D-printed fully dielectric bi-material reflectarray with bandgap characteristics for multi-band applications. To achieve bandgap characteristics, a “1D Bragg reflector” unit cell is used. The latter is a layered structure characterized by a spatial distribution of refractive index that varies [...] Read more.
This paper presents a 3D-printed fully dielectric bi-material reflectarray with bandgap characteristics for multi-band applications. To achieve bandgap characteristics, a “1D Bragg reflector” unit cell is used. The latter is a layered structure characterized by a spatial distribution of refractive index that varies periodically along one dimension. By appropriately selecting the dimensions, the bandgap can be shifted to cover the desired frequency bands. To validate this bandgap characteristic, a (121.5 mm × 121.5 mm) with an f/D ratio of 0.5 reflectarray was fabricated. The measured gain at 27 GHz is 27.22 dBi, equivalent to an aperture efficiency of 35.05%, demonstrating good agreement between simulated and measured performances within the frequency range of 26–30 GHz. Additionally, the transparency of the reflectarray was verified by measuring the transmission coefficient, which exhibited a high level of transparency of 0.32 dB at 39 GHz. These features make the proposed reflectarray a good candidate for multi-band frequency applications. Full article
(This article belongs to the Special Issue Sensing Technologies in Additive Manufacturing)
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18 pages, 7503 KiB  
Article
Detecting Near-Surface Sub-Millimeter Voids in Additively Manufactured Ti-5V-5Al-5Mo-3Cr Alloy Using a Transmit-Receive Eddy Current Probe
by Brendan Sungjin Halliday, Allyson Eastmure, Peter Ross Underhill and Thomas Walter Krause
Sensors 2024, 24(13), 4183; https://doi.org/10.3390/s24134183 - 27 Jun 2024
Cited by 1 | Viewed by 995
Abstract
Additive Manufacturing (AM) Direct Laser Fabrication (DLF) of Ti-5Al-5V-5Mo-3Cr (Ti5553) is being developed as a method for producing aircraft components. The additive manufacturing process can produce flaws near the surface, such as porosity and material voids, which act as stress raisers, leading to [...] Read more.
Additive Manufacturing (AM) Direct Laser Fabrication (DLF) of Ti-5Al-5V-5Mo-3Cr (Ti5553) is being developed as a method for producing aircraft components. The additive manufacturing process can produce flaws near the surface, such as porosity and material voids, which act as stress raisers, leading to potential component failure. Eddy current testing was investigated to detect flaws on or near the surface of DLF Ti5553 bar samples. For this application, the objective was to develop an eddy current probe capable of detecting flaws 500 µm in diameter, located 1 mm below the component’s surface. Two initial sets of coil parameters were chosen: The first, based on successful experiments that demonstrated detection of a near surface flaw in Ti5553 using a transmit-receive array probe, and the second, derived from simulation by Finite Element Method (FEM). An optimized transmit receive coil design, based on the FEM simulations, was constructed. The probe was evaluated on Ti5553 samples containing sub-surface voids of the target size, as well as samples with side-drilled holes and samples with holes drilled from the opposing inspection surface. The probe was able to effectively detect 80% of the sub-surface voids. Limitations included the probe’s inability to detect sub-surface voids near sample edges and a sensitivity to surface roughness, which produces local changes in lift-off. Multifrequency mixing improved signal-to-noise ratio when surface roughness was present on average by 22%. A probe based on that described in this paper could benefit quality assurance of additively manufactured aircraft components. Full article
(This article belongs to the Special Issue Sensing Technologies in Additive Manufacturing)
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13 pages, 5393 KiB  
Article
Adaptive Fabrication of Electrochemical Chips with a Paste-Dispensing 3D Printer
by Ten It Wong, Candy Ng, Shengxuan Lin, Zhong Chen and Xiaodong Zhou
Sensors 2024, 24(9), 2844; https://doi.org/10.3390/s24092844 - 29 Apr 2024
Viewed by 1613
Abstract
Electrochemical (EC) detection is a powerful tool supporting simple, low-cost, and rapid analysis. Although screen printing is commonly used to mass fabricate disposable EC chips, its mask is relatively expensive. In this research, we demonstrated a method for fabricating three-electrode EC chips using [...] Read more.
Electrochemical (EC) detection is a powerful tool supporting simple, low-cost, and rapid analysis. Although screen printing is commonly used to mass fabricate disposable EC chips, its mask is relatively expensive. In this research, we demonstrated a method for fabricating three-electrode EC chips using 3D printing of relatively high-viscosity paste. The electrodes consisted of two layers, with carbon paste printed over silver/silver chloride paste, and the printed EC chips were baked at 70 °C for 1 h. Engineering challenges such as bulging of the tubing, clogging of the nozzle, dripping, and local accumulation of paste were solved by material selection for the tube and nozzle, and process optimization in 3D printing. The EC chips demonstrated good reversibility in redox reactions through cyclic voltammetry tests, and reliably detected heavy metal ions Pb(II) and Cd(II) in solutions using differential pulse anodic stripping voltammetry measurements. The results indicate that by optimizing the 3D printing of paste, EC chips can be obtained by maskless and flexible 3D printing techniques in lieu of screen printing. Full article
(This article belongs to the Special Issue Sensing Technologies in Additive Manufacturing)
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