Condition Monitoring in Manufacturing with Advanced Sensors

Dear Colleagues,

The application of advanced sensors in condition monitoring has become a transformative factor in modern manufacturing environments. This Special Issue, "Condition Monitoring in Manufacturing with Advanced Sensors", focuses on the integration of sensor technologies to improve process efficiency, product quality, and operational reliability. Condition monitoring systems, powered by a variety of sensors, such as temperature, vibration, and strain sensors, enable the real-time detection of equipment malfunctions and process deviations. This proactive approach minimizes downtime, reduces maintenance costs, and supports predictive maintenance strategies.

This Special Issue is directly aligned with the core scope of Sensors, as it emphasizes the critical role of sensors in industrial applications. The journal promotes advancements in sensor technology, deployment, and integration with intelligent systems, all of which are essential for modern manufacturing. By addressing the development and application of advanced sensors for condition monitoring in manufacturing, this Special Issue contributes significantly to the ongoing discourse on enhancing industrial processes through sensor-driven innovation.

The Special Issue invites contributions that explore innovations in sensor technologies, data analytics, and machine learning for the manufacturing industry. We welcome interdisciplinary research that showcases how advanced sensors can enhance performance, optimize resource usage, and ensure the seamless operation of manufacturing processes.

Dr. Uros Zuperl
Guest Editor

Manuscript Submission Information

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.