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Electronics and Sensors for Structure Health Monitoring
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Electronics and Sensors for Structure Health Monitoring

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".

Deadline for manuscript submissions: 30 November 2025 | Viewed by 97

Special Issue Editor

Dr. Maximilian C. Scardelletti

E-Mail Website
Guest Editor
Communications and Intelligent Systems Division, National Aeronautics and Space Administration, Glenn Research Center, Cleveland, OH 44135, USA
Interests: electronics; sensors; sensing systems; harsh environments; pressure; radiation; mechanical; vibration; chemical; wide bandgap

Special Issue Information

Dear Colleagues,

Sensors comprise environmental-facing components in electronic control systems that utilize closed-loop control for the safe and reliable operation of the system being monitored. Some leading application areas that currently utilize such sensor systems include consumer products, healthcare, transportation, energy generation/management, and other applications, where the environmental conditions are compatible with silicon-based electronics. Technology advancements have progressed to the point that sensor systems are now being developed for applications where silicon-based electronics are not well suited due to environmental conditions. Examples of these harsh environments include high temperatures, high radiation, harsh chemicals, high pressure, high mechanical wear, and extreme vibration. For such applications, sensors and electronics based on wide-bandgap semiconductors are being developed.

This Special Issue is focused on the sensors and associated electronics required for sensor systems that can operate under harsh environmental conditions. Specifically, we are interested in submissions that focus on electronic devices, circuits, sensors, and sensing systems that can operate in high temperature, high radiation, harsh chemical, extreme mechanical, and other environments that influence the direction of this important and rapidly emerging technology. This Special Issue aims to feature systems based on wide-bandgap semiconductors, but papers that describe approaches that utilize electronics-based silicon and other materials are also welcome to be submitted.

Dr. Maximilian C. Scardelletti
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electronic devices
  • sensors
  • structure health monitoring

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Published Papers (1 paper)

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Research

22 pages, 9340 KiB  
Article
The Effect of Defect Size and Location in Roller Bearing Fault Detection: Experimental Insights for Vibration-Based Diagnosis
by Haobin Wen, Khalid Almutairi, Jyoti K. Sinha and Long Zhang
Sensors 2025, 25(16), 4917; https://doi.org/10.3390/s25164917 (registering DOI) - 9 Aug 2025
Abstract
In rotating machines, any faults in anti-friction bearings occurring during operation can lead to failures that are unacceptable due to considerable downtime losses and maintenance costs. Hence, early fault detection is essential, and different vibration-based methods (VBMs) are explored to recognise incipient fault [...] Read more.
In rotating machines, any faults in anti-friction bearings occurring during operation can lead to failures that are unacceptable due to considerable downtime losses and maintenance costs. Hence, early fault detection is essential, and different vibration-based methods (VBMs) are explored to recognise incipient fault signatures. Based on rotordynamics, if a bearing defect causes metal-to-metal (MtM) impacts during shaft rotation, the impacts excite high-frequency resonance responses of the bearing assembly. The defect-related frequencies are modulated with the resonance responses and rely on signal demodulation for fault detection. However, the current study highlights that the bearing fault/faults may not be detected if the defect in a bearing is not causing MtM impacts nor exciting the high-frequency resonance of the bearing assembly. In a roller bearing, a localised defect may maintain persistent contact between rolling elements and raceways, thereby preventing the occurrence of impulse vibration responses. Due to contact persistence, such defects may not generate impact and may not be detected by existing VBMs, and the bearing could behave as healthy. This paper investigates such specific cases by exploring the relationship between roller-bearing defect characteristics and their potential to generate impact loads during operation. Using an experimental bearing rig, different roller and inner-race defects are presented while their fault characteristic frequencies remain undetected by the envelope analysis, fast Kurtogram, cyclic spectral coherence, and tensor decomposition methods. This study highlights the significance of both the dimension and location of defects within bearings on their detectability based on the rotordynamics concept. Further, simple roller-beam experiments are carried out to visualise and validate the reliability of the experimental observations made on the roller bearing dynamics. Full article
(This article belongs to the Special Issue Electronics and Sensors for Structure Health Monitoring)
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