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Electronics and Sensors for Structure Health Monitoring
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Electronics and Sensors for Structure Health Monitoring

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".

Deadline for manuscript submissions: 20 June 2026 | Viewed by 2257

Special Issue Editor

Dr. Maximilian C. Scardelletti

E-Mail Website
Guest Editor
Communications and Intelligent Systems Division, National Aeronautics and Space Administration, Glenn Research Center, Cleveland, OH 44135, USA
Interests: electronics; sensors; sensing systems; harsh environments; pressure; radiation; mechanical; vibration; chemical; wide bandgap

Special Issue Information

Dear Colleagues,

Sensors comprise environmental-facing components in electronic control systems that utilize closed-loop control for the safe and reliable operation of the system being monitored. Some leading application areas that currently utilize such sensor systems include consumer products, healthcare, transportation, energy generation/management, and other applications, where the environmental conditions are compatible with silicon-based electronics. Technology advancements have progressed to the point that sensor systems are now being developed for applications where silicon-based electronics are not well suited due to environmental conditions. Examples of these harsh environments include high temperatures, high radiation, harsh chemicals, high pressure, high mechanical wear, and extreme vibration. For such applications, sensors and electronics based on wide-bandgap semiconductors are being developed.

This Special Issue is focused on the sensors and associated electronics required for sensor systems that can operate under harsh environmental conditions. Specifically, we are interested in submissions that focus on electronic devices, circuits, sensors, and sensing systems that can operate in high temperature, high radiation, harsh chemical, extreme mechanical, and other environments that influence the direction of this important and rapidly emerging technology. This Special Issue aims to feature systems based on wide-bandgap semiconductors, but papers that describe approaches that utilize electronics-based silicon and other materials are also welcome to be submitted.

Dr. Maximilian C. Scardelletti
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electronic devices
  • sensors
  • structure health monitoring

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Published Papers (3 papers)

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Research

22 pages, 6063 KB  
Article
The KUYUY Accelerograph and SIPA System: Towards Low-Cost, Real-Time Intelligent Seismic Monitoring in Peru
by Carmen Ortiz, Jorge Alva, Roberto Raucana, Michael Chipana, José Oliden, Nelly Huarcaya, Grover Riveros and José Valverde
Sensors 2026, 26(1), 254; https://doi.org/10.3390/s26010254 - 31 Dec 2025
Viewed by 544
Abstract
Accelerographs are essential instruments for quantifying strong ground motion, serving as the foundation of modern earthquake engineering. In Peru, the first accelerographic station was installed in Lima in 1944; since then, various institutions have promoted the expansion of the national network. However, this [...] Read more.
Accelerographs are essential instruments for quantifying strong ground motion, serving as the foundation of modern earthquake engineering. In Peru, the first accelerographic station was installed in Lima in 1944; since then, various institutions have promoted the expansion of the national network. However, this network’s spatial coverage and instrumentation remain insufficient to properly characterize strong motion and support seismic risk reduction policies. In this context, the KUYUY accelerograph is presented as a low-cost, low-noise device equipped with real-time telemetry and high-performance MEMS sensors. Its interoperability with the Intelligent Automatic Processing System (SIPA) enables real-time monitoring and automated signal analysis for seismic microzonation studies and rapid damage assessment, contributing to seismic risk reduction in Peru. The validation process included static gravity calibration, field comparison with a reference accelerograph, and an initial deployment in Lima and Yurimaguas. The results demonstrate the proposed accelerograph’s linear response, temporal stability, and amplitude consistency with respect to high-end instruments, with differences below 5–10%. Full article
(This article belongs to the Special Issue Electronics and Sensors for Structure Health Monitoring)
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15 pages, 2964 KB  
Article
Evaluation of a Silicon Carbide Static Induction Transistor for High Frequency/High Temperature Sensor Interface Circuits: Measurements and Modeling
by Jonathon R. Grgat, Maximilian C. Scardelletti and Christian A. Zorman
Sensors 2025, 25(22), 7051; https://doi.org/10.3390/s25227051 - 18 Nov 2025
Viewed by 440
Abstract
In this paper, we report on the characterization of a silicon carbide static induction transistor (SiC SIT) for potential use in sensor interface circuits that operate at frequencies up to 100 MHz and temperatures up to 400 °C. Measurements were performed to generate [...] Read more.
In this paper, we report on the characterization of a silicon carbide static induction transistor (SiC SIT) for potential use in sensor interface circuits that operate at frequencies up to 100 MHz and temperatures up to 400 °C. Measurements were performed to generate current–voltage curves, capacitive transistor characteristics, and high-frequency scattering parameters at temperatures between 25 and 400 °C. The measured data were used to extrapolate the transconductance, gm, as a function of temperature and to develop a small signal model. Circuit simulation tools were used to generate scattering parameters, which were compared to the measured values. At 400 °C, the maximum difference between the measured and simulated scattering parameters for frequencies from 20 to 100 MHz were all less than 0.1 dB, indicating strong agreement between the model and measurement results. The average transition frequency, ft, calculated from measured parameters was 197.8 MHz, which compares favorably to the simulated value from the model (200 MHz). This is also the first paper to report the characterization of a SiC SIT at temperatures above 100 °C. The high-temperature model is the first of its kind for a silicon carbide static induction transistor and the findings reported herein provide a platform to stimulate further development for sensor interface circuits that require transistors that operate at both high frequency and high temperature. Full article
(This article belongs to the Special Issue Electronics and Sensors for Structure Health Monitoring)
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22 pages, 9340 KB  
Article
The Effect of Defect Size and Location in Roller Bearing Fault Detection: Experimental Insights for Vibration-Based Diagnosis
by Haobin Wen, Khalid Almutairi, Jyoti K. Sinha and Long Zhang
Sensors 2025, 25(16), 4917; https://doi.org/10.3390/s25164917 - 9 Aug 2025
Cited by 2 | Viewed by 979
Abstract
In rotating machines, any faults in anti-friction bearings occurring during operation can lead to failures that are unacceptable due to considerable downtime losses and maintenance costs. Hence, early fault detection is essential, and different vibration-based methods (VBMs) are explored to recognise incipient fault [...] Read more.
In rotating machines, any faults in anti-friction bearings occurring during operation can lead to failures that are unacceptable due to considerable downtime losses and maintenance costs. Hence, early fault detection is essential, and different vibration-based methods (VBMs) are explored to recognise incipient fault signatures. Based on rotordynamics, if a bearing defect causes metal-to-metal (MtM) impacts during shaft rotation, the impacts excite high-frequency resonance responses of the bearing assembly. The defect-related frequencies are modulated with the resonance responses and rely on signal demodulation for fault detection. However, the current study highlights that the bearing fault/faults may not be detected if the defect in a bearing is not causing MtM impacts nor exciting the high-frequency resonance of the bearing assembly. In a roller bearing, a localised defect may maintain persistent contact between rolling elements and raceways, thereby preventing the occurrence of impulse vibration responses. Due to contact persistence, such defects may not generate impact and may not be detected by existing VBMs, and the bearing could behave as healthy. This paper investigates such specific cases by exploring the relationship between roller-bearing defect characteristics and their potential to generate impact loads during operation. Using an experimental bearing rig, different roller and inner-race defects are presented while their fault characteristic frequencies remain undetected by the envelope analysis, fast Kurtogram, cyclic spectral coherence, and tensor decomposition methods. This study highlights the significance of both the dimension and location of defects within bearings on their detectability based on the rotordynamics concept. Further, simple roller-beam experiments are carried out to visualise and validate the reliability of the experimental observations made on the roller bearing dynamics. Full article
(This article belongs to the Special Issue Electronics and Sensors for Structure Health Monitoring)
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