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Devices and Applications of Flexible Electronics and Intelligent Systems including Selected Papers from EEET 2023

A special issue of Sensors (ISSN 1424-8220).

Deadline for manuscript submissions: 30 May 2024 | Viewed by 159

Special Issue Editors

School of Electrical and Electronic Engineering, University of Manchester, Manchester, UK
Interests: sensors; instrumentation; electrical capacitance tomography
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Zhiwei Zhao
E-Mail Website
Guest Editor
School of Electronic Science and Engineering, Southeast University, Nanjing, China
Interests: investigations of various devices based on nanomaterials using various nanotechnologies and exploring their applications in sensors, optoelectronic detecting, new energy, power management systems, etc.

Special Issue Information

Dear Colleagues,

Welcome to the Special Issue on "Devices and Applications of Flexible Electronics and Intelligent Systems". This Special Issue serves as a platform for exploring cutting-edge developments at the intersection of flexible electronics and intelligent systems. It includes the papers selected from the 6th International Conference on Electronics and Electrical Engineering Technology (EEET 2023), which will be held on December 1–3, 2023 in Nanjing, China. The conference website is http://www.eeet.org/.

Flexible electronics have ignited a revolution in electronic device design, offering malleable, lightweight, and versatile solutions that transcend traditional rigid form factors. When integrated with intelligent systems, these innovations find applications across diverse fields, including healthcare, wearables, robotics, and beyond.

In this Special Issue, we invite contributions that delve into the design, fabrication, and real-world applications of flexible electronics, often in tandem with intelligent systems. Researchers, engineers, and innovators are encouraged to submit their work so that we may shed light on the latest breakthroughs, address challenges, and pave the way for the future of technology.

Join us in this exploration of the dynamic realm where flexibility meets intelligence, shaping the next generation of devices and applications. We eagerly anticipate your contributions to this Special Issue.

Authors of selected high-quality papers that fit Sensors’ scope from the conference will be invited to submit extended versions of their original papers (50% extension of the contents of the conference paper). In addition to the EEET 2023 papers, other independent submissions are also welcome.

Prof. Dr. Wuqiang Yang
Prof. Dr. Zhiwei Zhao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • flexible electronics
  • intelligent systems
  • wearable technology
  • Internet of Things (IoT)
  • human-machine interaction
  • bioelectronics
  • flexible sensors
  • smart materials
  • healthcare applications
  • robotics

Published Papers

This special issue is now open for submission.
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