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Integrating Cloud Computing, Sensing Technologies, and Digital Twins in IoT Applications

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Communications".

Deadline for manuscript submissions: 15 February 2026 | Viewed by 983

Special Issue Editors


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Guest Editor
Department of Electrical and Electronic Engineering, University of Cagliari, 09127 Cagliari, Italy
Interests: Internet of Things; ad hoc networks; efficient resource allocation; smart buildings; crowdsensing/crowdsourcing
Special Issues, Collections and Topics in MDPI journals

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Guest Editor Assistant
Department of Electrical and Electronic Engineering, Via Marengo,09123, Cagliari, Italy
Interests: Internet of Things; sensor networks; smart buildings; behaviour analysis; e-health

Special Issue Information

Dear Colleagues,

The Internet of Things (IoT) has revolutionized the way we interact with our environment, creating a seamless network of interconnected devices that collect, process, and exchange data. As IoT applications continue to expand, the need for more sophisticated and holistic approaches to data management and system modelling has become evident. Cloud computing, sensing technologies, and digital twins are opening new frontiers in observing, analyzing, and understanding different environments and human behaviour, with far-reaching implications across various domains. From healthcare and personal wellness to ambient intelligence and smart cities, the applications are diverse and vast.

Cloud computing provides the scalable computational resources and storage capabilities necessary to handle the data volumes generated by IoT devices. Sensing technologies allow the systems to capture real-time data from the physical world. Digital twins bridge the gap between the physical and digital realms, offering virtual representations of objects, humans, systems, and processes within IoT environments.

This Special Issue aims to explore the cutting-edge developments in cloud computing, digital twins, and sensing technologies within the IoT context, with a particular focus on their integration to create more intelligent, responsive, and user-centric IoT systems.

The key topics of interest include (but are not limited to) the following:

  • Scalable cloud architectures for processing sensor data and updating digital twins in real-time;
  • Novel sensing strategies and technologies for different IoT scenarios;
  • Edge and fog computing paradigms to support cloud-based IoT environments;
  • Security and privacy considerations in cloud-based IoT networks;
  • Integration of AI and machine learning for intelligent data processing in IoT;
  • User-centric IoT solutions;
  • Vertical applications (e.g., e-Health, Smart Buildings, Smart cities, etc.);
  • Integrated sensing and communications;
  • Digital twin;
  • Ambient intelligence .

Dr. Virginia Pilloni
Guest Editor 

Dr. Francesca Marcello
Guest Editor Assistant

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Internet of Things
  • digital twin
  • sensing technologies
  • edge and fog computing
  • ambient intelligence

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Published Papers (1 paper)

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Research

42 pages, 16651 KiB  
Article
Internet of Things-Cloud Control of a Robotic Cell Based on Inverse Kinematics, Hardware-in-the-Loop, Digital Twin, and Industry 4.0/5.0
by Dan Ionescu, Adrian Filipescu, Georgian Simion and Adriana Filipescu
Sensors 2025, 25(6), 1821; https://doi.org/10.3390/s25061821 - 14 Mar 2025
Viewed by 659
Abstract
The main task of the research involves creating a Digital Twin (DT) application serving as a framework for Virtual Commissioning (VC) with Supervisory Control and Data Acquisition (SCADA) and Cloud storage solutions. An Internet of Things (IoT) integrated automation system with Virtual Private [...] Read more.
The main task of the research involves creating a Digital Twin (DT) application serving as a framework for Virtual Commissioning (VC) with Supervisory Control and Data Acquisition (SCADA) and Cloud storage solutions. An Internet of Things (IoT) integrated automation system with Virtual Private Network (VPN) remote control for assembly and disassembly robotic cell (A/DRC) equipped with a six-Degree of Freedom (6-DOF) ABB 120 industrial robotic manipulator (IRM) is presented in this paper. A three-dimensional (3D) virtual model is developed using Siemens NX Mechatronics Concept Designer (MCD), while the Programmable Logic Controller (PLC) is programmed in the Siemens Totally Integrated Automation (TIA) Portal. A Hardware-in-the-Loop (HIL) simulation strategy is primarily used. This concept is implemented and executed as part of a VC approach, where the designed PLC programs are integrated and tested against the physical controller. Closed loop control and RM inverse kinematics model are validated and tested in PLC, following HIL strategy by integrating Industry 4.0/5.0 concepts. A SCADA application is also deployed, serving as a DT operator panel for process monitoring and simulation. Cloud data collection, analysis, supervising, and synchronizing DT tasks are also integrated and explored. Additionally, it provides communication interfaces via PROFINET IO to SCADA and Human Machine Interface (HMI), and through Open Platform Communication—Unified Architecture (OPC-UA) for Siemens NX-MCD with DT virtual model. Virtual A/DRC simulations are performed using the Synchronized Timed Petri Nets (STPN) model for control strategy validation based on task planning integration and synchronization with other IoT devices. The objective is to obtain a clear and understandable representation layout of the A/DRC and to validate the DT model by comparing process dynamics and robot motion kinematics between physical and virtual replicas. Thus, following the results of the current research work, integrating digital technologies in manufacturing, like VC, IoT, and Cloud, is useful for validating and optimizing manufacturing processes, error detection, and reducing the risks before the actual physical system is built or deployed. Full article
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