Microwave, RF, and mm-Wave Circuits for Advanced Wireless Communications and Sensing
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Communications".
Deadline for manuscript submissions: 15 August 2026 | Viewed by 10
Special Issue Editors
Interests: in-band full duplex techniques; interference mitigation; secure communications; asynchronous localizations; wireless communications; remote sensing; wideband transceivers; bio-medical sensing and systems
Interests: ultra-wideband (UWB) communication systems; high data rate secure communication systems with multiple-input multiple-output (MIMO) capabilities; millimeter-wave technologies for 5G applications
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
For this Special Issue, we are seeking original research and review papers on microwave, RF, and millimeter-wave circuit technologies that enable advanced wireless communications and sensing. Contributions should present novel circuit topologies, architectures, design methodologies, modeling approaches, measurement techniques, and integration strategies that demonstrably improve performance, efficiency, linearity, bandwidth, or manufacturability across microwave through mm-wave frequencies. We particularly encourage submissions that explore novel semiconductor platforms (CMOS, SiGe, GaN, III-V), metamaterial and metasurface-enabled components, frequency-agile and reconfigurable components, antenna–circuit co-design, packaging and thermal management, AI-assisted design and optimization, compact calibration and on-chip measurement techniques, energy-efficient or compact implementations, and system-level integration for 5G/6G, satellite, radar, imaging, and biomedical sensing applications. Manuscripts must include rigorous analysis supported by simulation and experimental validation, including measured prototype results where applicable, and discuss practical impact, scalability, and potential pathways to real-world deployment. Review articles and perspective pieces that synthesize emerging trends, challenges, and future research directions are also welcome. Submit manuscripts addressing theory, design, fabrication, testing, and system demonstration; deadline and submission details appear on the journal website.
Dr. Satheesh Bojja Venkatakrishnan
Dr. Elias Alwan
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- RF and mm-Wave circuits
- wideband transceivers
- beamforming and phased arrays
- self-interference cancelation (SIC)
- antenna–circuit co-design
- AI-assisted circuit design
- metamaterial components
- on-chip measurement and calibration
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