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New Prospects in Fiber Optic Sensors and Applications: 2nd Edition

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Optical Sensors".

Deadline for manuscript submissions: 20 May 2026 | Viewed by 115

Special Issue Editors


E-Mail Website
Guest Editor
Department of Electrical and Computer Engineering, University of Massachusetts Lowell, One University Ave., Lowell, MA 01854, USA
Interests: fiber optics; photoacoustics; fiber optical sensors; ultrasound
Special Issues, Collections and Topics in MDPI journals
Electrical and Computer Engineering Department, University of Massachusetts Lowell, 1 University Ave., Lowell, MA 01854, USA
Interests: fiber-optic sensors; non-destructive testing; photoacoustics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Following the success of our Special Issue entitled “New Prospects in Fiber Optic Sensors and Applications (https://www.mdpi.com/journal/sensors/special_issues/RGNLA8BYU2)”, we are delighted to announce the launch of its second edition, continuing to spotlight the emerging fiber-optic sensors technologies and applications through open access publications.

We invite you to explore several highly cited papers from the original issue:

  • Rapid and Accurate Shape-Sensing Method Using a Multi-Core Fiber Bragg Grating-Based Optical Fiber
    https://www.mdpi.com/1424-8220/25/14/4494
    Authors: Georgios Violakis, Nikolaos Vardakis, Zhenyu Zhang, Martin Angelmahr and Panagiotis Polygerinos
  • Blast-Assisted Subsurface Characterisation Using a Novel Distributed Acoustic Sensing Setup Based on Geometric Phases
    https://www.mdpi.com/1424-8220/24/1/30
    Authors: Sabahat Shaheen, Konstantin Hicke and Katerina Krebber
  • Experimental Investigations of Distributed Fiber Optic Sensors for Water Pipeline Monitoring
    https://www.mdpi.com/1424-8220/23/13/6205
    Authors: Manuel Bertulessi, Daniele Fabrizio Bignami, Ilaria Boschini, Marina Longoni, Giovanni Menduni and Jacopo Morosi

Fiber-optic sensors have been extensively developed and utilized over the past four decades. They continue to gain broad acceptance due to their compact size, immunity to electromagnetic interference (EMI) and reliability in harsh environments involving high temperature and humidity.

Historically, three major waves of fiber-optic sensor development can be identified, each characterized by distinct technological breakthroughs:

  1. The first wave featured fiber-optic gyroscopes based on the Sagnac effect and fiber-optic hydrophones, employing Mach–Zehnder interferometers. These devices achieved practical implementation, leading to both commercial and military systems still in use today.
  2. The second wave introduced Fabry–Perot interferometer–based sensors, which have been applied in a wide variety of engineering and scientific fields, with numerous applications reported in the literature.
  3. The third wave emerged with the invention of in-line fiber Bragg grating (FBG) optical filters for telecommunications. It was later discovered that FBGs served as excellent optical transducers for sensing multiple physical parameters, ushering in a new era of distributed sensing technologies.

In recent years, novel concepts and applications have continued to expand the field. Examples include the following:

  • Fiber-optic current sensors (FOCS) utilizing the magneto-optic (Faraday) effect;
  • Long-distance distributed strain and temperature sensing systems, such as Brillouin optical time-domain reflectometers (BOTDR);
  • Fiber-optic biosensors (FOBSs) for medical diagnostics and therapeutic monitoring.

Moreover, new research trends are integrating AI-assisted data analytics, chip-based miniaturization and advanced signal processing to enhance sensor accuracy, reduce cost and enable real-time field deployment. Progress in prototype development for commercialization, biomedical applications and harsh-environment monitoring is further driving the next generation of fiber-optic sensing technologies.

This Special Issue, titled “New Prospects in Fiber Optic Sensors and Applications: 2nd Edition,” aims to highlight both traditional and emerging developments in fiber-optic sensing. Contributions are invited in the areas of novel sensor design, advanced fabrication and packaging, AI-enhanced signal processing, field testing and monitoring and application-driven system integration.

Prof. Dr. Xingwei Wang
Dr. Xu Guo
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • fiber-optic sensors
  • distributed fiber-optic sensing systems
  • fiber-optic biomedical sensors
  • photoacoustics
  • signal processing and AI
  • harsh-environment sensing
  • miniaturization and chip integration
  • prototype development and commercialization

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