Trends and Recent Advancements in Structural Health Monitoring

A special issue of Processes (ISSN 2227-9717). This special issue belongs to the section "Materials Processes".

Deadline for manuscript submissions: closed (10 January 2024) | Viewed by 258

Special Issue Editors


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Guest Editor
Department of Aerospace Engineering, College of Aeronautics and Engineering, Kent State University, Kent, OH 44242, USA
Interests: materials development; degradation; EBC; CMC; characterization; life model validation; high temperature; performance; NDE; finite elements; fatigue; composite materials
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Guest Editor
The Szewalski Institute of Fluid-Flow Machinery, Polish Academy of Sciences, 14 Fiszera Street, 80-231 Gdańsk, Poland
Interests: structural health monitoring (SHM); nondestructive testing/evaluation (NDT/NDE); adhesive bond assessment; damage identification; signal processing algorithms; phased arrays techniques for Lamb wave-based SHM; guided waves; electromechanical impedance; laser vibrometry
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Mechanical Engineering Department, American University of Beirut, Beirut 1100, Lebanon
Interests: structural health monitoring systems; metallic and composite structures; damage detection; numerical modelling of linear and non-linear problems

Special Issue Information

Dear Colleagues,

Structural health monitoring (SHM) is a technique that can be classified as a non-destructive evaluation (NDE), however, the system is automated and provides continuous monitoring. Typically, this procedure is triggered by damage-tolerant design where the damage has to be checked and inspected at defined intervals/continuously based on NDE modern sensing hardware that is integrated into the structural materials. It is further combined with advanced signal processing software, causing NDE to become a segmented part of the materials and structures and hence automating the conventional inspection process.

A vast amount of work has been performed in this field, and major developments have taken place in various types of structures including, but not limited to, aerospace, mechanical and civil structures. This is despite the many associated challenges with the implementation of SHM technology, such as sensor selection and placement on the structure, data communication and management, data analytics (feature extraction), as well as visualization (data fusion).

This call for papers welcomes manuscripts dealing with recent advancements in the fields of SHM that cover material characterizations and structural components, with a specific focus on additively manufactured components. We invite researchers to submit their related work on any types of sensors (contact and non-contact) applied to SHM systems, innovative research, and reviews. 

The topics include, but are not limited to:

  • Wired and wireless sensing for SHM
  • In situ contact and non-contact sensors in additive manufacturing
  • Sensor integration/embedment during manufacturing
  • Feature extraction and data fusion of sensor networks
  • Damage localization and assessment in additively manufactured systems

Prof. Dr. Ali Abdul-Aziz
Prof. Dr. Pawel H. Malinowski
Dr. Samir Mustapha
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Processes is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • SHM research
  • sensor technology
  • wireless sensing
  • material characterizations
  • additive manufacturing
  • data fusion
  • aerospace

Published Papers

There is no accepted submissions to this special issue at this moment.
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