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Advanced Dielectric Composites: Trends and Progress

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Applications".

Deadline for manuscript submissions: closed (29 February 2024) | Viewed by 352

Special Issue Editor


E-Mail Website
Guest Editor
Chemical and Biological Engineering Department, University of Alabama, Tuscaloosa, AL 35487, USA
Interests: environmental remediation; functional material interfaces for soft robotics; polymers and soft materials initiative; sensing; stretchable electronics

Special Issue Information

Dear Colleagues,

Research into advanced dielectric materials has been critical for the advancement of new, more durable, and more powerful circuit designs as well as sensor systems. In particular, polymer dielectrics have enabled more mechanically durable and flexible electronic components that were previously unattainable with traditional ceramic materials. Bulk polymer dielectric materials, however, present their own challenges, particularly with respect to thermal and chemical stability in addition to reduced relative permittivity. To simultaneously take advantage of the mechanical benefits of polymer dielectric materials while also accessing electronic behavior closer to that of ceramics, significant research into polymer composites has been a recent focus. Polymer composites enable multifunctional materials that, when formulated, can properly overcome the challenges associated with the constituent materials while fully benefitting from their advantages. Optimal polymer composites retain some degree of the deformability, flexibility, and/or durability of the polymer while improving upon the electronic, stability, or other properties that polymers traditionally lack. 

The work presented in this Special Issue will showcase the exciting progress made in this field as well as the future directions for further improving polymer dielectric composites and moving towards electronic performance comparable to traditional materials.

Dr. Amanda S. Koh
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • permittivity/dielectric constant
  • composite
  • durability
  • deformable/flexible
  • self-healing
  • novel structures
  • novel fillers
  • low dielectric loss
  • bio-based/recyclable

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Published Papers

There is no accepted submissions to this special issue at this moment.
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