Mechanical and Thermal Properties of Nanomaterials

A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Nanoelectronics, Nanosensors and Devices".

Deadline for manuscript submissions: closed (31 December 2024) | Viewed by 1348

Special Issue Editors


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Guest Editor
Interuniversity Micro-Electronics Center, Leuven, Belgium
Interests: mechanical engineering; nano-technology; manufacturing; reliability

E-Mail Website
Guest Editor
Interuniversity Micro-Electronics Center, Leuven, Belgium
Interests: reliability of nano-scale materials

Special Issue Information

Dear Colleagues,

Today, nanomaterials are pervasively utilized in various technologies and application domains, including nano-electronics, sensors, energy storage and conversion devices such as batteries, supercapacitors, fuel cells, solar cells, lightweight structures, packaging and biomedical applications. Many of these applications require operation under mechanically and thermally demanding conditions, which necessitate the accurate experimental characterization and modelling of the mechanical and thermal behavior of these nanomaterials. In this context, macroscopic testing approaches, combined with mechanistic constitutive models, have provided significant information. Yet, innovations in methodologies for the direct nano-scale testing, characterization and modelling of mechanical and thermal properties, including elastic, plastic, fatigue, damage and fracture, thermal conductivity, thermal expansion, heat capacities, atomic diffusivities and residual stresses, are urgently needed. In addition, there is an immediate need for innovative methodologies that can determine mechanical and thermal properties at interfaces and surfaces at the nano-scale, such as adhesion/surface energies, thermal contact resistances and surface diffusion at the interfaces and surfaces of nanomaterials.

This Special Issue will provide an overview of recent research outlining the latest advances in nano-scale mechanical, thermal, experimental and model-based characterization methods for nanomaterials. In particular, methodologies that enable these properties to be determined in situ under the actual loading configurations that the nano-components are exposed to in their niche will be explored. In addition, experimental and modelling approaches that quantify and decipher the impact of interface and surface will be investigated, considering the increased significance of interface and surface effects compared to bulk at the nano-scale. We invite authors to contribute original research articles and review articles. Potential topics include, but are not limited to, the following:

  • Nano-electronics;
  • Nano-sensors and nano-probes, including force and stress sensors;
  • MEMS/NEMS based characterization methods;
  • Nanocomposites;
  • Light-weight structures;
  • Nano-fluids;
  • Nano-membranes;
  • Nano-materials for bio-applications;
  • Surface nano-textured materials;
  • Superlattices.

Dr. Houman Zahedmanesh
Dr. Kristof Croes
Guest Editors

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Keywords

  • nanoscale
  • nanomaterials
  • mechanical and thermal properties
  • characterization
  • modelling
  • in-situ testing
  • interfaces
  • surface impact

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Published Papers (1 paper)

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Research

15 pages, 5249 KiB  
Article
A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects
by Ahmed Sobhi Saleh, Kristof Croes, Hajdin Ceric, Ingrid De Wolf and Houman Zahedmanesh
Nanomaterials 2024, 14(22), 1834; https://doi.org/10.3390/nano14221834 - 16 Nov 2024
Cited by 2 | Viewed by 923
Abstract
As electronic devices continue to shrink in size and increase in complexity, the current densities in interconnects drastically increase, intensifying the effects of electromigration (EM). This renders the understanding of EM crucial, due to its significant implications for device reliability and longevity. This [...] Read more.
As electronic devices continue to shrink in size and increase in complexity, the current densities in interconnects drastically increase, intensifying the effects of electromigration (EM). This renders the understanding of EM crucial, due to its significant implications for device reliability and longevity. This paper presents a comprehensive simulation framework for the investigation of EM in nano-interconnects, with a primary focus on unravelling the influential role of microstructure, by considering the impact of diffusion heterogeneity through the metal texture and interfaces. As such, the resulting atomic flux and stress distribution within nano-interconnects could be investigated. To this end, a novel approach to generate microstructures of the conductor metal is presented, whereby a predefined statistical distribution of grain sizes obtained from experimental texture analyses can be incorporated into the presented model, making the model predictive under various scales and working conditions with no need for continuous calibration. Additionally, the study advances beyond the state-of-the-art by comprehensively simulating all stages of electromigration including stress evolution, void nucleation, and void dynamics. The model was employed to study the impact of trench dimensions on the dual damascene copper texture and its impact on electromigration aging, where the model findings were corroborated by comparing them to the available experimental findings. A nearly linear increase in normalized time to nucleation was detected as the interconnect became wider with a fixed height for aspect ratios beyond 1. However, a saturation was detected with a further increase in width for lines of aspect ratios below 1, with no effective enhancement in time to nucleation. An aspect ratio of 1 seems to maximize the EM lifetime for a fixed cross-sectional area by fostering a bamboo-like structure, where about a 2-fold of increase was estimated when going from aspect ratio 2 to 1. Full article
(This article belongs to the Special Issue Mechanical and Thermal Properties of Nanomaterials)
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