Developments in 3D Metrology Selected from the 3D Metrology Conference
A special issue of Metrology (ISSN 2673-8244).
Deadline for manuscript submissions: closed (30 November 2024) | Viewed by 5593
Special Issue Editors
Interests: precise 3D measurement; primarily large volume metrology (LVM) requiring sub-millimetre measurements for the manufacture and assembly of large components
Special Issues, Collections and Topics in MDPI journals
Interests: metrology laser trackers micro thrust coordinate metrology
Special Issues, Collections and Topics in MDPI journals
Interests: photogrammetry; 3D imaging; metrology; heritage recording
Special Issues, Collections and Topics in MDPI journals
Interests: production metrology; networked, adaptive production; 5G applications in manufacturing; metrology-assisted robotics; assembly; production intelligence; quality management
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The 3D Metrology Conference (www.3dmc.events) was established as an annual European event in 2016. So far, apart from two online events due to COVID in 2020 and 2021, it has been held in Germany, the UK and Spain. The 2024 event will return to the UK at Loughborough University’s Intelligent Automation Centre. Despite our excellent university links, this conference is not a conventional academic event. Until the return to live events in November 2022, it offered only presentations and posters but no associated papers. The intention was, and remains to be, to encourage industrial end users of 3D metrology (3DM) technologies to present their applications and challenges in a relaxed environment where researchers and developers can also present novel solutions and new technologies relevant to 3D measurement and metrology. However, it was decided in 2022 to offer presenters the option of submitting related articles to our most recent media partner, MDPI’s Metrology. Therefore, this Special Issue showcases selected 3DM developments presented at the 2022, 2023 and 2024 conferences.
The conference intertwines application and development, which should help the industry benefit from developments that focus on real problems. The spectrum of technologies covered by the 3D Metrology Conference is centred on portable coordinate metrology in large-object manufacturing, e.g., with laser tracking and close-range photogrammetry, but it also embraces small-scale and sub-surface measurements at one end, e.g., with 3D microscopy and computed tomography, and construction challenges at the other, e.g., with long-range laser scanning and drone inspection. The conference further welcomes relevant input based on technologies such as motion capture and augmented reality, and new analysis techniques such as artificial intelligence (AI) and machine learning (ML). This is a vibrant field where ideas can be exchanged across a wide spectrum. The cooperation between the conference and Metrology will provide another opportunity to encourage the further development and application of 3DM technologies.
Dr. Stephen Kyle
Prof. Ben Hughes
Prof. Dr. Stuart Robson
Prof. Dr. Robert Schmitt
Guest Editors
Manuscript Submission Information
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Keywords
- portable coordinate metrology (PCM)
- large-volume metrology (LVM)
- close-range photogrammetry
- laser tracking
- 3D surface inspection (from area scanning to detailed roughness)
- CMM technology advances
- computed tomography (CT) for metrology applications
- metrology-assisted manufacturing (e.g., machining, assembly)
- robotic and automated PCM
- point-cloud analysis
- virtual metrology systems
- metrology integration with digital twins
- mixed robotic and human workspaces
- multiple object tracking
- 3D data analysis for quality maintenance
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