
Journal Menu
► ▼ Journal Menu-
- Materials Home
- Aims & Scope
- Editorial Board
- Reviewer Board
- Topical Advisory Panel
- Instructions for Authors
- Special Issues
- Topics
- Sections & Collections
- Article Processing Charge
- Indexing & Archiving
- Editor’s Choice Articles
- Most Cited & Viewed
- Journal Statistics
- Journal History
- Journal Awards
- Society Collaborations
- Conferences
- Editorial Office
Journal Browser
► ▼ Journal BrowserNeed Help?
Announcements
14 October 2025
Welcoming New Editorial Board Members of Materials Joined in September 2025
We are pleased to announce that five new scholars have been appointed Editorial Board Members (EBMs) for Materials (ISSN: 1996-144), effective September 2025. We wish our new members success in both their personal research and their efforts to develop the journal.
Name: Dr. Enric Stern-Taulats
Affiliation: Universitat de Barcelona, Spain
Interests: functional materials; phase transitions; coupling of degrees of freedom; solid-state cooling; magnetic shape-memory alloys; rare-earth compounds; ferroelectric oxides
Name: Prof. Dr. Liang Fang
Affiliation: Chongqing University, China
Interests: semiconductor thin films and optoelectronic devices; micro-nano fabrication of thin film transistors; wear-resistant and corrosion-resistant surface treatment technology; new nano energy storage materials
Prof. Dr. Liang Fang’s publications in Materials:
1. “Fabrication and Optoelectronic Properties of Advanced Quinary Amorphous Oxide Semiconductor InGaZnSnO Thin Film”
by Hongyu Wu, Liang Fang, Zhiyi Li, Fang Wu, Shufang Zhang, Gaobin Liu, Hong Zhang, Wanjun Li and Wenlin Feng
Materials 2025, 18(9), 2090; https://doi.org/10.3390/ma18092090
2. “Surface-Modification Strategy to Produce Highly Anticorrosive Ti3C2Tx MXene-Based Polymer Composite Coatings: A Mini-Review”
by Shufang Zhang, Guoqin Zhang, Liang Fang, Zhiheng Wang, Fang Wu, Gaobin Liu, Qirui Wang and Hongen Nian
Materials 2025, 18(3), 653; https://doi.org/10.3390/ma18030653
3. “Study on Quantitative Adjustment of CD Bias and Profile Angle in the Wet Etching of Cu-Based Stacked Electrode”
by Dan Liu, Liang Fang, Zhonghao Huang, Jianguo An, Xu Wu, Fang Wu, Wenxiang Chen and Gaobin Liu
Materials 2025, 18(1), 116; https://doi.org/10.3390/ma18010116
4. “Formation Mechanism and Prevention of Cu Undercut Defects in the Photoresist Stripping Process of MoNb/Cu Stacked Electrodes”
by Dan Liu, Liang Fang, Zhonghao Huang, Haibo Ruan, Wenxiang Chen, Jing Xiang, Fang Wu and Gaobin Liu
Materials 2024, 17(20), 5008; https://doi.org/10.3390/ma17205008
Materials is currently recruiting Editorial Board Members and Guest Editors. Please contact the Editorial Office if you are interested in these positions.
Materials Editorial Office