Latest Advances in Grinding Technology

Special Issue Editor


E-Mail Website
Guest Editor
School of Engineering, Faculty of Computing, Engineering and Science, University of South Wales, Pontypridd, Wales CF37 1DL, UK
Interests: grinding technology; computational fluid dynamics, aerodynamics; heat transfer analysis; artificial intelligence used in manufacturing

Special Issue Information

Dear Colleagues,

This Special Issue on the “Latest Advances in Grinding Technology” will highlight state-of-the-art advances in grinding technology. It is known that the grinding manufacturing process is the most expensive and costly operation in manufacturing; it is an operation that is difficult to avoid with respect to the manufacturing of hard materials and in the production of complex three-dimensional shapes.

This Special Issue will cover the following avenues:

  1. The use of nanotechnology in grinding operations;
  2. The use of neural networks and artificial intelligence in optimizing the grinding process;
  3. The use of ultrasound wave technology during the process of grinding;
  4. The new techniques in dressing operations for expensive diamond and other highly advanced grinding wheels;
  5. The latest techniques and investigations in coolant usage and operations;
  6. Ultra-precision grinding operations;
  7. Latest techniques for in-process grinding monitoring to achieve high-precision, high-efficiency, and low-cost operations;
  8. Optical and aero-mechanical profiling of grinding surface topography profiling;
  9. Process modeling and theoretical background of the heat transfer aspects of the grinding process.

Dr. Talal Maksoud
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Journal of Manufacturing and Materials Processing is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Ultra-precision Grinding
  • Nanotechnology in grinding operation
  • Surface profiling techniques
  • In-process grinding monitoring operations
  • Artificial intelligence usage in grinding-process modeling techniques

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Published Papers

There is no accepted submissions to this special issue at this moment.
Back to TopTop