Low Power in FD-SOI Technology
A special issue of Journal of Low Power Electronics and Applications (ISSN 2079-9268).
Deadline for manuscript submissions: closed (15 January 2019) | Viewed by 543
Special Issue Editors
Interests: SOI MOS devices; digital and analog circuits, as well as sensors; MEMS and solar cells; ultra low-voltage low-power; microwave; biomedical; radiation-hardened and high-temperature electronics and microsystems
Special Issues, Collections and Topics in MDPI journals
Interests: ultralow-power CMOS digital and analog design; arithmetic circuits; reconfigurable computing and the design of digital/mixed-signal/analog circuits in emerging technologies
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Due to its unique inherent properties, fully depleted silicon-on-insulator (FD-SOI) is gaining a consolidated position on a number of new markets, ranging from Internet of Things (IoT) to automotive, from e-health to big data and machine learning, etc. Designing circuits in FD-SOI offers many intrinsic advantages compared to conventional silicon technologies, including the capability to optimize the power/performance trade-offs, to lower the operating voltage, or to improve robustness to PVT variations. In addition, for analog and RF applications, FD-SOI components offer high control capabilities in gain, noise, mismatch… Specific technological features such as adaptive back biasing or hybrid SOI/bulk implementations also enable the creation of new circuit architectures. SOI technology finally offer unique capabilities for co-integrating highly-sensitive sensors and MEMS. These characteristics become increasingly attractive as we move further into the world of low power, high performance mobile and wearable sensing, computing and communicating.
This special issue is devoted to the latest developments in power-efficient circuit and system design in the FD-SOI technology, in a broad sense. It will reflect a wide spectrum of research topics from architecture design, to analog, digital, RF, sensors or MEMS modules, microsystems or SoC, modelling and test. Authors are invited to submit regular papers following the Journal of Low Power Electronics and Applications submission guidelines.
- Energy harvesting and power management circuit for IoT devices.
- Modelling, design, simulation and characterization of Devices, Circuits and Systems for ultra-low voltage and ultra-low power consumption.
- Highly power-efficient circuits for digital and analog computing, RF transmission.
- Co-integration of sensors or MEMS.
- Reconfigurable architectures.
- IoT security features including low-power encryption and authentication.
- Circuits, systems and methods for on-chip energy-efficient machine learning.
Prof. Denis Flandre
Dr. Marco Lanuzza
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Journal of Low Power Electronics and Applications is an international peer-reviewed open access quarterly journal published by MDPI.
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Keywords
- FD-SOI
- Analog/RF circuits
- Digital circuits
- System-on-chip
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