Special Issue "Structural Health Monitoring and Their Applications Across Industry"
A special issue of Inventions (ISSN 2411-5134). This special issue belongs to the section "Inventions and Innovation in Electrical Engineering/Energy/Communications".
Deadline for manuscript submissions: closed (30 November 2018).
Interests: electronic instruments and measurement; structral health monitoring; computer simulation; advanced manufactrung technology
Structural health monitoring is used to evaluate the “state” of a structure at every moment during its life. It involves the integration of structure design, sensors, smart materials, data transmission and analysis. Structural health monitoring is the new way of non-destructive evaluation, however these techniques have not been widely used in practical engineering due to wiring problems associated with large-scale structural health monitoring.
The aim of this Special Issue is for researchers to gain an in-depth understanding of structural health monitoring techniques and analyze the different applications through various cross-industry case studies, including oil and gas, rail, nuclear, aerospace, thermal and renewable energy, highlighting the latest developments on testing methods and sensor development and promoting more accurate results for defect identification.
Dr. Qing Wang
Manuscript Submission Information
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- non-destructive testing method
- sensor development
- life cycle prediction
- defects inspection and identification