Selected Papers from the International Conference on Emerging Trends in Robotics, Communication, VLSI and Artificial Intelligence (ROCV-AI 2026)
A special issue of Future Internet (ISSN 1999-5903). This special issue belongs to the section "Big Data and Augmented Intelligence".
Deadline for manuscript submissions: 31 January 2027 | Viewed by 121
Special Issue Editors
2. School of Mechanical and Mechatronics Engineering, Kyungsung University, 309 Suyeong-ro Nam-gu, Busan 48434, Republic of Korea
Interests: energy conversion and energy storage devices and their technologies; solar cell; VLSI; super capacitors
Interests: VLSI–FPGA prototype designs; machine learning; IoT; hardware security; cognitive radio; wireless communication
Special Issue Information
Dear Colleagues,
The ROCV-AI 2026 (International Conference on Emerging Trends in Robotics, Communication, VLSI and Artificial Intelligence) will be held in KLEF Bowrampet Campus, Hyderabad, India, 15–16 May 2026. The ROCV-AI 2026 (International Conference on Emerging Trends in Robotics, Communication, VLSI and Artificial Intelligence) aims to serve as a premier global forum for researchers, academicians and industry professionals. The conference focuses on emerging and integrated intelligent systems that seamlessly combine robotics, electronics, VLSI hardware, embedded systems, communication technologies and advanced AI algorithms. Key thrust areas include AI-driven robotics, on-chip intelligence and VLSI architectures, secure and low-power electronic systems and next-generation communication technologies. The conference emphasizes advancements in artificial intelligence, machine learning and deep learning for intelligent, connected and real-time robotic and cyber–physical applications. For more information, please visit the following link: https://klh.edu.in/rocv-ai-2026/.
Authors are invited to submit original and unpublished research papers with innovative ideas on topics within the broad areas of robotics, communication, VLSI, and artificial intelligence, including (but not limited to) artificial intelligence and machine learning, the Internet of Things, FPGA design, cryptography, hardware security and secure communication.
Dr. Sunkara Srinivasa Rao
Dr. Kiran Kumar Anumandla
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Future Internet is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- artificial intelligence (AI) and machine learning (ML)
- robotics
- internet of things
- cryptography
- secure communication
- VLSI/FPGA prototype design
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