Joint Design and Integration in Smart IoT Systems, 2nd Edition
A special issue of Future Internet (ISSN 1999-5903). This special issue belongs to the section "Internet of Things".
Deadline for manuscript submissions: 28 February 2026 | Viewed by 103
Special Issue Editors
Interests: cyber security and privacy; data- and machine-learning-driven applications in cyber-physical systems/Internet of Things
Special Issues, Collections and Topics in MDPI journals
Interests: cyber-physical systems; Internet of Things; computer security; quantum cryptography; data mining
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The use of Internet of Things (IoT) technology spans various application domains (e.g., transportation, energy, healthcare, manufacturing, and agriculture). A smart system empowered by IoT technology (also called a smart IoT system) integrates sensing, communication, and computation components into one system. The architecture of smart systems is composed of physical, communication, and computation layers. The physical layer comprises heterogeneous devices that facilitate sensing and actuation and capture and preprocess data from the surrounding environment. The communication layer enables efficient and reliable data transmission among components by leveraging network protocols, standards, and technologies. The computation layer provides intelligent decision making and automation through the use of edge/cloud computing and AI technologies.
Smart systems are large, distributed, and complex systems, empowered through diverse IoT technologies and involving the integration and management of heterogeneous components in different layers. However, there are numerous challenges associated with the design, integration, management, and coordination of smart systems. Developing cross-component and cross-layer architectures, standards, and frameworks is necessary to support efficient smart systems. Likewise, the scalability, interoperability, connectivity, security, and resilience requirements of smart systems must also be carefully considered. The papers in this Special Issue address the above challenges and propose solutions for the joint design and integration of smart systems at various levels.
We invite original research papers that focus on, but are not limited to, the following topics related to smart systems:
- Integration design architecture and frameworks;
- Co-design of sensing and communication components;
- Co-design of communication and computing components;
- Co-design of sensing and computing components;
- Co-design of sensing, communication, and computing components;
- AI-assisted co-design of sensing, communication, and computing components;
- Modeling and simulation environments for evaluating co-design methodologies;
- Security and privacy in the co-design and integration of smart systems;
- Data science, engineering, and practice in the co-design and integration of smart systems;
- Machine learning models and architectures in the co-design and integration of smart systems.
Prof. Dr. Wei Yu
Dr. Guobin Xu
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Future Internet is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- Internet of Things
- smart systems
- integration design architecture
- co-design modeling and simulation
- machine learning and data science/engineering in IoT
- security in IoT
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Related Special Issue
- Joint Design and Integration in Smart IoT Systems in Future Internet (11 articles)
