Advanced Technologies in Wood-Adhesive Bonds
A special issue of Forests (ISSN 1999-4907).
Deadline for manuscript submissions: closed (20 November 2021) | Viewed by 2973
Special Issue Information
Dear Colleagues,
The decarbonisation of our society can be achieved by increasing the use of wood. In this context, bonded wood products and associated bonding technologies will play an important role in the future. The bonding of wood is a complex process and this technology is based on an interdisciplinary approach covering the fields of chemistry, machinery, and product design. While the understanding of wood bonding has made great progress during the last few years, bonding technologies must be further developed to be competitive. Wood glued products will remain attractive if the adhesive technologies enable, at one time, a fast and sustainable assembly with the material being fully recyclable at the end of its lifetime. The use of green adhesive and innovative curing technologies has demonstrated great potential for solid wood gluing and wood-based panels production. This leads to the need for a better understanding of the field of applications of such advanced technologies.
This Special Issue will cover all the topics from adhesive manufacturing to adhesive curing and bonded wood products. Papers can include reviews and recent unique research on adhesive development, adhesive application and adhesive curing.
Prof. Dr. Frédéric Pichelin
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Forests is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- wood bonding
- adhesives
- curing
- bio-based
- recycling
- bonding on demand
- de-bonding
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