Recent Advances in Electronic Materials: From Properties to Applications
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Electronic Materials, Devices and Applications".
Deadline for manuscript submissions: 30 April 2026 | Viewed by 3
Special Issue Editor
Special Issue Information
Dear Colleagues,
Electronic materials underpin modern technologies in communication, power conversion, sensing, and computing. Continued progress in these areas depends on materials that deliver higher performance, improved reliability, and greater energy efficiency. This Special Issue highlights recent advances in novel electronic materials as well as variations of established materials where changes in composition, structure, or interfaces enable improved device performance.
We welcome studies that explore how materials development contributes to advances in device characteristics and system integration. Topics of interest include wide and ultra-wide bandgap semiconductors, two dimensional materials, dielectric and ferroelectric films, and advanced interface or packaging materials. Submissions may address improvements in electrical and thermal properties, stability and reliability, or new functionalities that expand the range of device applications.
Both experimental and theoretical studies are suitable. Submissions may include work on material synthesis and growth, structural and functional characterization, computational modelling across different scales, or demonstrations at the device level. Applications in high power and high frequency electronics, optoelectronics, and communication systems are of particular relevance.
The goal of this Special Issue is to provide a platform that connects progress in materials research with advances in semiconductor device performance. By drawing together contributions from diverse perspectives, it aims to highlight how innovations in materials can be translated into the next generation of electronic technologies.
Dr. Yiwen Song
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- semiconductor devices
- two-dimensional materials
- dielectric and ferroelectrics
- device reliability
- materials characterizations
- wide bandgap materials
- interface engineering
- material growth
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