Advances in Intelligent Information Processing

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".

Deadline for manuscript submissions: 28 February 2026 | Viewed by 13

Special Issue Editors


E-Mail Website
Guest Editor
School of Artificial Intelligence, Beijing University of Posts and Telecommunications, Beijing 100876, China
Interests: multimodal computing; medical images; smart healthcare; edge computing and data analytics; scientific intelligence
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
School of Artificial Intelligence, Beijing University of Posts and Telecommunications, Beijing 100876, China
Interests: multimedia information intelligence and transmission; industrial big data intelligence; intelligent edge computing
School of Artificial Intelligence, Beijing University of Posts and Telecommunications, Beijing 100876, China
Interests: intelligent information processing; decision-making; wireless internet research and application; information system security

Special Issue Information

Dear Colleagues,

In the era of big data and artificial intelligence, intelligent information processing has emerged as a transformative force across diverse fields, from healthcare and finance to autonomous systems and smart cities. This Special Issue, entitled “Advances in Intelligent Information Processing”, brings together cutting-edge research and innovative methodologies that push the boundaries of data analysis, machine learning, and cognitive computing.

Featuring contributions from leading experts, this Special Issue explores novel algorithms, scalable architectures, and real-world applications that enhance the efficiency, accuracy, and adaptability of intelligent systems. Topics include deep learning advancements, natural language processing, computer vision, edge intelligence, and explainable AI, among others.

By bridging theoretical breakthroughs with practical solutions, this collection aims to inspire further research and collaboration, driving the next wave of intelligent technologies. We invite researchers and practitioners to delve into these insights and join the conversation shaping the future of information processing.

I look forward to receiving your contributions.

Dr. Li Xiao
Prof. Dr. Hongxie Bie
Dr. Fang Su
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • audio and speech processing
  • natural language processing
  • computer vision
  • edge computing
  • foundation models
  • explainable AI

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Published Papers

This special issue is now open for submission.
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