Designs 2026 Travel Award—Open for Applications
We are pleased to announce that the application period for the Designs Travel Award is now open. The applications will be assessed by an Evaluation Committee consisting of senior scholars from the Designs Editorial Board.
This prize offers financial support for the winner to attend an international conference covering all areas of engineering designs of disciplines and industrial applications, which will be held in 2026, in order to hold a presentation, present a poster, or both.
Candidate Requirements:
- Postdoctoral fellows or Ph.D. students;
- Plans to attend an international conference in 2026 (oral presentation or poster).
Required Application Documents:
- Information about the conference the applicant is planning to attend and the abstract that will be submitted;
- Curriculum Vitae and list of publications;
- Justification letter describing the focus of the research (max. 800 words);
- Letter of recommendation from the supervisor, research director, or department head, which also confirms the applicant’s status.
The winner (one awardee) will be awarded CHF 800 and an electronic certificate. Please submit your application for the Designs Travel Award through the following link: https://www.mdpi.com/journal/designs/awards/3341 (by clicking on “Apply”).
The application deadline: 31 December 2025.
The winner will be announced on the Designs (ISSN: 2411-9660) website at the end of February 2026, and the prize will be awarded at the same time. If you have any questions about this award and the application, please feel free to write to the Editorial Office.
Designs Editorial Office