applsci-logo

Journal Browser

Journal Browser

Advanced Internet of Things Ecosystems: Architectures, Intelligence, and Communication Innovations

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Computing and Artificial Intelligence".

Deadline for manuscript submissions: 20 October 2025 | Viewed by 69

Special Issue Editors


E-Mail Website
Guest Editor
i2CAT Internet Research Center, 08034 Barcelona, Spain
Interests: IoT; artificial intelligence; edge computing; future networks
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Communications Department, Universitat Politècnica de València, 46022 Valencia, Spain
Interests: IoT; EdgeAI; interoperability; edge computing; 5G/6G; SDN; networking
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The Internet of Things (IoT) is rapidly evolving into an advanced ecosystem that integrates cutting-edge intelligence, next-generation network architectures, and novel communication paradigms. These advancements enable smarter, more adaptive, and highly connected environments, driving transformative changes across multiple domains, including healthcare, smart cities, industrial automation, and intelligent transportation. As IoT ecosystems grow more sophisticated, the seamless convergence of artificial intelligence (AI), cloud/edge architectures, and novel networking approaches is unlocking new possibilities. Embedding AI into IoT devices enhances efficiency, enabling real-time, energy-conscious operations while supporting multi-agent collaboration and intelligent cooperation between distributed IoT nodes for improved adaptability and performance. Cloud/edge–IoT (CEI) continuum architecture is a key enabler in this evolution, providing a dynamic and scalable framework that bridges computational resources across cloud and edge environments, ensuring efficient data management and processing, reduced latency, and enhanced intelligence at multiple levels of the IoT stack. While, innovations in networking technologies—including 5G and 6G, ultra-reliable low-latency communication (URLLC), and AI-enhanced network optimization for IoT applications—are accelerating IoT adoption and enabling groundbreaking applications and services. The advances are fostering intelligent environments that leverage IoT, AI, and contextual awareness to enhance human–computer interactions and automation. Additionally, the integration of communication and sensing functionalities is optimizing IoT system performance, further propelling the next generation of smart, connected ecosystems.

This Special Issue aims to bring together academia and industrial researchers to propose new IoT architectures, intelligence integration, and novel communication strategies that will shape the future of IoT ecosystems. This Special Issue will publish high-quality, original research papers. The potential topics of interest include, but are not limited to, the following:

  • Cloud/edge–IoT continuum architectures;
  • IoT data management and advanced IoT analytics;
  • IoT applications and services;
  • Industry 4.0 and the industrial IoT (IIoT);
  • Advances in IoT protocols;
  • Next-generation infrastructure for the IoT;
  • IoT 5G/6G slice management;
  • IoT orchestration;
  • Future network architectures and protocols for the IoT;
  • Edge AI, embedded AI, and cooperative intelligence for the IoT;
  • Generative AI (GenAI) use cases for the IoT;
  • Dataspaces in IoT applications;
  • Green communication and the IoT;
  • Visible light communications for the IoT;
  • Ambient intelligence;
  • Case studies of implementation in IoT Ecosystems.

Dr. David Sarabia-Jácome
Prof. Dr. Carlos Enrique Palau Salvador
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • next-generation IoT
  • edge computing
  • GenIA
  • network
  • architecture
  • IoT applications
  • future networks
  • ambient intelligence

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue policies can be found here.

Published Papers

This special issue is now open for submission.
Back to TopTop