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Applied Sciences
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The Technology and Application of Thermal Management and Heat Transfer
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The Technology and Application of Thermal Management and Heat Transfer

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Applied Thermal Engineering".

Deadline for manuscript submissions: closed (20 March 2026) | Viewed by 1455

Special Issue Editor

Dr. Koji Enoki

E-Mail Website
Guest Editor
Department of Mechanical and Intelligent Systems Engineering, The University of Electro-Communications, Chofu, Japan
Interests: energy science; thermal engineering; manufacturing technology; fluid engineering
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Thermal management and heat transfer technologies are crucial in addressing global energy challenges and advancing various industries. As energy demands rise and environmental concerns grow, innovative solutions in this field are increasingly vital for enhancing energy efficiency and ensuring optimal system performance.

We are pleased to invite you to contribute to our Special Issue, which aims to serve as a comprehensive platform for researchers, engineers, and academics to share their latest research findings, advancements, and practical applications in the field of thermal management and heat transfer.

In this Special Issue, original research articles and reviews are welcome. Its main focus includes, but not strictly limited to, the following areas:

  1. Heat pump and refrigeration systems;
  2. Phase-change heat transfer and multiphase flow;
  3. Heat exchanger design and optimization;
  4. Heat transfer enhancement and utilization of waste heat;
  5. Integration of deep learning in thermal management and heat transfer.

We look forward to receiving your contributions.

Dr. Koji Enoki
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thermal management
  • heat transfer
  • heat pump and refrigeration
  • phase-change heat transfer
  • waste heat utilization
  • thermal engineering innovations
  • advanced thermal systems

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Further information on MDPI's Special Issue policies can be found here.

Published Papers (1 paper)

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Research

17 pages, 6193 KB  
Article
Thermal Conductivity and Convection Heat Transfer Coefficient of Aluminum Cellular Structures Filled with Water and Air
by Alessandra Ceci, Paolo Coppa, Sandra Corasaniti, Girolamo Costanza and Maria Elisa Tata
Appl. Sci. 2026, 16(3), 1541; https://doi.org/10.3390/app16031541 - 3 Feb 2026
Viewed by 1104
Abstract
The present study investigates the thermal conductivity (λ) and convective heat transfer coefficient (h) of AA 6082 aluminum cellular structures immersed in water and air using a thermal conductivity probe (TCP) manufactured by the authors. The probe is a cylindrical needle 0.6 mm [...] Read more.
The present study investigates the thermal conductivity (λ) and convective heat transfer coefficient (h) of AA 6082 aluminum cellular structures immersed in water and air using a thermal conductivity probe (TCP) manufactured by the authors. The probe is a cylindrical needle 0.6 mm in diameter (D) and 60 mm in length (L), obtaining an L/D ratio = 100 ratio, which satisfies the infinite line-source assumption and enables discrimination between pure-fluid and composite (fluid + solid) thermal behavior. Cellular samples are manufactured with the Lost-PLA process and tested at temperatures of 5, 20, and 40 °C, feeding the TCP with different currents, under controlled heating conditions. The results show that the presence of the aluminum cellular structure enhances heat transfer compared with that of pure fluids. In air, the effective thermal conductivity is higher by approximately 37–45% than that in pure air, reaching about 0.038 W m−1 K−1 at higher temperatures. In water, λ increases from approximately 0.8 to 1.2 W m−1 K−1 over the investigated temperature range, corresponding to an enhancement of about 45–80% compared with that of pure water. Similarly, the convective heat transfer coefficient is higher by about 22–32% in air (h ≈ 38–41 W m−2 K−1) and 19–54% in water (up to ~440 W m−2 K−1), depending on temperature. These results indicate that the high thermal conductivity of the aluminum skeleton mainly improves conduction (“thermal bridging”), while convection may be locally affected within the pores. This study confirms the capability of the TCP method to discriminate between fluid and composite heat transfer contributions and highlights the potential of additively manufactured aluminum cellular structures for lightweight thermal management applications. Full article
(This article belongs to the Special Issue The Technology and Application of Thermal Management and Heat Transfer)
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