5th Anniversary of Acoustics and Vibrations Section-Recent Advances in Micromachined Ultrasonic Transducers

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Acoustics and Vibrations".

Deadline for manuscript submissions: closed (20 August 2022) | Viewed by 606

Special Issue Editor

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Guest Editor
Department of Engineering, University Roma Tre, 00154 Roma, Italy
Interests: acoustics; CMUT; silicon technologies; sensors; transducer array; ultrasonics; medical imaging

Special Issue Information

Dear Colleagues,

It was 1994 when the first scientific article on a microfabricated ultrasonic transducer (MUT) on silicon was published, after being presented at an important international symposium. Twenty-seven years have passed since that first four-page article was published, and today there are thousands of scientific articles on the subject in scientific journals. Many research groups around the world and various companies (small and large) have worked on the research and manufacturing of micromachined ultrasonic devices on silicon. After a quarter of a century, we want to take stock of both scientific and technological research in this promising sector. The MUTs represent the natural evolution of ceramic probes dedicated to non-invasive evaluations, both in the medical sector and for materials testing: on one hand, they greatly reduce production costs and, on the other hand, increase the performance beyond today's limits. The integration with electronics is then their natural evolution, already widely proven in the past. As a consequence, particular attention must be paid to the design of the MUTs, with a large compatibility with integrated electronics, and we must also consider the advantages related to technology scaling and different technology integrations. The aim of this Special Issue is to find new possible solutions for the models, technologies, characterizations, electronics and packaging of MUTs, at different frequencies, to cover the majority of possible applications. Contributors are invited to present and highlight the advances and the latest novel and emergent results on these topics, revealing best practices, implementations, and applications.

The Guest Editor invites you to submit an original research contribution demonstrating the advances in capacitive and piezoelectric micromachined ultrasonic transducers on silicon. Additionally, application-oriented and review papers are encouraged.

Prof. Dr. Giosue Caliano
Guest Editor

Manuscript Submission Information

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • CMUT
  • PMUT
  • silicon micromaching
  • ultrasonics
  • sensors
  • medical imaging
  • ultrasound imaging
  • air-coupled ultrasound
  • transducer array

Published Papers

There is no accepted submissions to this special issue at this moment.
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