Metal–Organic Frameworks (MOFs) toward Electrochemical Applications
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Chemical and Molecular Sciences".
Deadline for manuscript submissions: closed (31 August 2019) | Viewed by 7289
Special Issue Editor
Interests: electrochemistry; metal–organic frameworks; nanomaterials; energy storage and conversion
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Metal–organic frameworks (MOFs) have attracted great attention in a range of applications including gas storage, separation, chemical sensing and catalysis during the past two decades due to their structural tunability, regular porosity, and ultrahigh specific surface area. The interconnected pore structure and periodic intra-framework chemical functionality of MOFs render such materials attractive candidates for electrochemical applications. As the chemical stability of MOFs has been progressively improved in recent years, the charge transport in MOFs under electrochemical conditions and the feasibility of utilizing MOFs for various electrochemical applications have been widely studied, and the design of electrically conductive MOFs is of rapidly growing interest to scientists pursuing electrochemical applications of highly porous materials. These exciting developments have motivated this Special Issue.
The Special Issue on “Metal–Organic Frameworks (MOFs) toward Electrochemical Applications” welcomes manuscripts revealing novel designs of MOFs or MOF-based composite materials for any electrochemical application. Both Articles and Reviews are welcome. Topics may cover, but are not limited to, the following areas:
- MOFs for electrocatalysis
- MOFs for electrochemical sensors
- MOFs toward energy storage devices
- MOF-based composite materials for electrochemical applications
- The design of MOFs that enables facile charge transport toward electrochemical applications
- The design of MOF-derived electrochemically active materials
Prof. Dr. Chung-Wei Kung
Guest Editor
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