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Smart Design and Advanced Manufacturing with Emphasis on Integrating Emerging Technologies and Production Process Sustainability: Second Edition

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Applied Industrial Technologies".

Deadline for manuscript submissions: 31 December 2025 | Viewed by 117

Special Issue Editor


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Guest Editor
Department of Engineering Sciences, Morehead State University, 150 University Blvd, Morehead, KY 40351, USA
Interests: intelligent fault detection and recovery; condition based monitoring; reliability; manufacturing systems; robotics; VR/RL based failure analysis
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Smart design, emphasizing connectivity, virtualization, and data utilization, is a strategic approach that enables optimal utilization and efficiency for users while minimizing environmental impacts. On the other hand, advanced manufacturing focuses on manufacturing process technologies, including automation, robotics, and additive manufacturing. Using smart design and advanced manufacturing concepts, organizations continue to redesign products, processes, and customer support to achieve optimal growth and cost efficiency while challenging the market by leveraging technology as a game changer. Industry 4.0 would prepare the organization for these challenges by integrating advanced control systems with Internet technology, enabling communication.

As a result, further development in smart design (connectivity, virtualization, and data utilization), advanced manufacturing (automation, robotics, process sustainability, integration of technologies, computational methods, artificial intelligence, 3D printing), and Industry 4.0 (development of cyber-physical systems, integration of the Internet of Things, implementation for safety, security, privacy, and knowledge protection) becomes important.

Therefore, this Special Issue will bring together papers that particularly describe recent advances in these three areas. Papers that include practical experimental results are particularly encouraged.

Dr. Kouroush Jenab
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • smart design
  • smart manufacturing
  • Industry 4.0
  • automation
  • robotics
  • process sustainability
  • integration of technologies
  • computational methods
  • artificial intelligence
  • 3D printing

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Published Papers (1 paper)

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Research

15 pages, 1373 KB  
Article
Virtual Classrooms, Real Impact: A Framework for Introducing Virtual Reality to K–12 STEM Learning Based on Best Practices
by Tyler Ward, Kouroush Jenab, Jorge Ortega-Moody, Ghazal Barari and Lizeth Del Carmen Molina Acosta
Appl. Sci. 2025, 15(21), 11356; https://doi.org/10.3390/app152111356 - 23 Oct 2025
Viewed by 27
Abstract
Virtual reality (VR) has emerged as a promising tool for transforming science, technology, engineering, and mathematics (STEM) education, yet its adoption in K–12 classrooms remains uneven and often limited to short-term pilots. While prior studies highlight VR’s potential to increase engagement and support [...] Read more.
Virtual reality (VR) has emerged as a promising tool for transforming science, technology, engineering, and mathematics (STEM) education, yet its adoption in K–12 classrooms remains uneven and often limited to short-term pilots. While prior studies highlight VR’s potential to increase engagement and support conceptual understanding, questions persist about scalability, sustainability, and equity in implementation. This paper addresses these gaps by synthesizing recent scholarship and proposing a structured framework of best practices for integrating VR into K–12 STEM education. Drawing on academic literature, U.S. policy reports, and case studies, we identify persistent challenges that include high costs, lack of teacher preparation, infrastructure disparities, and overlooked accessibility concerns. We use these findings to inform a phased implementation roadmap. Our framework emphasizes assessment and planning, technical integration, teacher preparation, student implementation, and iterative evaluation, providing actionable strategies for schools and districts. Results of this synthesis indicate that successful VR adoption requires coordinated attention to pedagogy, funding, professional development, and equity. We conclude that moving VR from isolated novelty projects to sustainable and equitable tools in STEM classrooms depends on aligning technology with curricular goals, investing in teacher pipelines, and embedding VR within long-term evaluation and improvement cycles. Full article
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