Artificial Intelligence in Software Engineering

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Computing and Artificial Intelligence".

Deadline for manuscript submissions: 30 September 2024 | Viewed by 81

Special Issue Editors


E-Mail Website
Guest Editor
Faculty of Electrical Engineering, Mechanical Engineering and Naval Architecture, University of Split, 21000 Split, Croatia
Interests: software engineering; complex data storage systems

E-Mail Website
Guest Editor
Faculty of Electrical Engineering, Mechanical Engineering and Naval Architecture, University of Split, 21000 Split, Croatia
Interests: artificial intelligence; computer vision; machine learning; natural language processing; computational linguistics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

We are inviting submissions to this Special Issue on Artificial Intelligence in Software Engineering.

In recent years, artificial intelligence (AI) has emerged as a disruptive technology with the potential to revolutionize various industries, and software engineering (SE) is no exception. The significant impact of AI paradigms (such as neural networks, machine learning, knowledge-based systems, and natural language processing) on SE phases (requirements, design, development, testing, release, and maintenance) could be used to improve the process and eliminate many of the major challenges that the SE field has been facing. Some of the areas where AI can assist SE processes are AI-powered requirement analysis and planning, enhanced code generation and automation, AI-driven bug detection and debugging, smart testing and quality assurance, personalization and user experience optimization, Natural Language Processing (NLP) and voice interfaces, predictive analytics and decision making, AI for Continuous Integration and Continuous Deployment (CI/CD), and autonomous software maintenance.

In this Special Issue, we invite submissions that explore cutting-edge research and recent advances in the fields of artificial intelligence in software engineering. Both theoretical and experimental studies are welcome, as well as comprehensive review and survey papers.

Prof. Dr. Linda Vickovic
Dr. Maja Braović
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • software engineering
  • artificial intelligence
  • AI in requirement analysis
  • smart testing and quality assurance
  • predictive analytics and decision making
  • AI for continuous integration and continuous deployment (CI/CD)
  • autonomous software maintenance

Published Papers

This special issue is now open for submission.
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