Thermal Interface Materials: Current Status and Applications
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Materials Science and Engineering".
Deadline for manuscript submissions: closed (20 May 2025) | Viewed by 180
Special Issue Editors
Interests: micro/nanoscale heat transfer; thermal management; soft matter physics
Special Issues, Collections and Topics in MDPI journals
Interests: machine learning; laser processing; metamaterials
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
We are inviting submissions to this Special Issue on thermal interface materials (TIMs).
Thermal interface materials play a critical role in enhancing heat dissipation in various applications, including electronics, aerospace, and automotive industries. With the increasing demand for higher performance and the miniaturization of devices, the development of advanced TIMs with improved thermal conductivity, reliability, and durability is essential. Research in this area aims to address challenges related to thermal management and optimize the thermal performance of systems.
In this Special Issue, we welcome contributions that explore recent advancements in the design, characterization, and application of thermal interface materials. Topics of interest include, but are not limited to, novel TIM formulations, interface engineering, experimental and computational studies on thermal conductivity, and characterization techniques for TIM properties and performance evaluation. Both theoretical analyses and experimental investigations are encouraged, along with comprehensive review articles that summarize current trends and future directions in the field.
Dr. Ruoyu Dong
Dr. Chi Zhang
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Keywords
- thermal conductivity
- heat dissipation
- interfacial thermal resistance
- mechanical compliance
- alignment engineering
- surface modification
- 2D materials
- polymer composites.
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