ICEBA2024: Engineering, Physics, MEMS-Biosensors and Applications
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".
Deadline for manuscript submissions: closed (20 February 2025) | Viewed by 901
Special Issue Editors
Interests: microfabrication and applications
Interests: nanotechnology-MEMS/NEMS
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
We are pleased to announce the Special Issue for the 5th International Conference on Engineering, Physics, MEMS-Biosensors, and Applications (ICEBA2024), which will be held in Ho Chi Minh City and Vinh Long Province, Vietnam. This event is organized by the University of Science (VNUHCM, Vietnam), Tohoku University (Japan), and Mien Tay Construction University (Vinh Long Province, Vietnam).
The conference aims to connect researchers and scientists from Vietnam and worldwide, particularly from Asian countries, in engineering, physics, microelectronics, semiconductors, and electronic engineering. We focus on their applications in biomedical engineering, health sciences, hi-tech agriculture, and smart cities. Additionally, we aim to foster international cooperation through collaborative research projects and joint publications while proposing innovative solutions and applied technologies for the development of the Mekong Delta region.
We warmly invite you to contribute to Special Issues in the following subject areas:
- Engineering, Engineering Physics, and Electrical & Electronic Engineering;
- Medical Physics and Nuclear Engineering;
- MEMS (MicroElectronMechanical System), Sensors and semiconducting devices, Biomedical Engineering, Digital Microfluidics and their applications;
- Microelectronics, IC design, low consumption devices, Renewable Energy;
- Computing Science, Simulations, and Modeling;
- Embedded systems, Internet of Things, Machine Learning, Artificial Intelligence, etc.;
- Civil and Geology Engineering;
- Constructions, Machines, and Mechanical Engineering.
Dr. Nguyen Van Toan
Prof. Dr. Takahito Ono
Guest Editors
Manuscript Submission Information
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- engineering
- physics
- MEMS-biosensors
- semiconductors
- civil engineering
- mechanical engineering
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