Avraham, M.; Golan, G.; Vaiana, M.; Bruno, G.; Castagna, M.E.; Stolyarova, S.; Blank, T.; Nemirovsky, Y.
Wafer-Level Packaged CMOS-SOI-MEMS Thermal Sensor at Wide Pressure Range for IoT Applications. Eng. Proc. 2020, 2, 30.
https://doi.org/10.3390/ecsa-7-08191
AMA Style
Avraham M, Golan G, Vaiana M, Bruno G, Castagna ME, Stolyarova S, Blank T, Nemirovsky Y.
Wafer-Level Packaged CMOS-SOI-MEMS Thermal Sensor at Wide Pressure Range for IoT Applications. Engineering Proceedings. 2020; 2(1):30.
https://doi.org/10.3390/ecsa-7-08191
Chicago/Turabian Style
Avraham, Moshe, Gady Golan, Michele Vaiana, Giuseppe Bruno, Maria Eloisa Castagna, Sara Stolyarova, Tanya Blank, and Yael Nemirovsky.
2020. "Wafer-Level Packaged CMOS-SOI-MEMS Thermal Sensor at Wide Pressure Range for IoT Applications" Engineering Proceedings 2, no. 1: 30.
https://doi.org/10.3390/ecsa-7-08191
APA Style
Avraham, M., Golan, G., Vaiana, M., Bruno, G., Castagna, M. E., Stolyarova, S., Blank, T., & Nemirovsky, Y.
(2020). Wafer-Level Packaged CMOS-SOI-MEMS Thermal Sensor at Wide Pressure Range for IoT Applications. Engineering Proceedings, 2(1), 30.
https://doi.org/10.3390/ecsa-7-08191
