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Journal: J. Compos. Sci., 2021
Volume: 5
Number: 272

Article: Effects of Resin/Filler Adhesion on the Thermal and Electrical Conductivity of Polyimide Nanocomposites
Authors: by Yoshimichi Ohki and Naoshi Hirai
Link: https://www.mdpi.com/2504-477X/5/10/272

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