Irfan, H.M.; Lee, C.-Y.; Mazumdar, D.; Aryanfar, Y.; Wu, W.
Improvement of Material Removal Rate and Within Wafer Non-Uniformity in Chemical Mechanical Polishing Using Computational Fluid Dynamic Modeling. J. Manuf. Mater. Process. 2025, 9, 95.
https://doi.org/10.3390/jmmp9030095
AMA Style
Irfan HM, Lee C-Y, Mazumdar D, Aryanfar Y, Wu W.
Improvement of Material Removal Rate and Within Wafer Non-Uniformity in Chemical Mechanical Polishing Using Computational Fluid Dynamic Modeling. Journal of Manufacturing and Materials Processing. 2025; 9(3):95.
https://doi.org/10.3390/jmmp9030095
Chicago/Turabian Style
Irfan, Hafiz M., Cheng-Yu Lee, Debayan Mazumdar, Yashar Aryanfar, and Wei Wu.
2025. "Improvement of Material Removal Rate and Within Wafer Non-Uniformity in Chemical Mechanical Polishing Using Computational Fluid Dynamic Modeling" Journal of Manufacturing and Materials Processing 9, no. 3: 95.
https://doi.org/10.3390/jmmp9030095
APA Style
Irfan, H. M., Lee, C.-Y., Mazumdar, D., Aryanfar, Y., & Wu, W.
(2025). Improvement of Material Removal Rate and Within Wafer Non-Uniformity in Chemical Mechanical Polishing Using Computational Fluid Dynamic Modeling. Journal of Manufacturing and Materials Processing, 9(3), 95.
https://doi.org/10.3390/jmmp9030095