Gorewoda, T.; Eschen, M.; Charasińska, J.; Knapik, M.; Kozłowicz, S.; Anyszkiewicz, J.; Jadwiński, M.; Potempa, M.; Gawliczek, M.; Chmielarz, A.;
et al. Determination of Metals’ Content in Components Mounted on Printed Circuit Boards from End-of-Life Mobile Phones. Recycling 2020, 5, 20.
https://doi.org/10.3390/recycling5030020
AMA Style
Gorewoda T, Eschen M, Charasińska J, Knapik M, Kozłowicz S, Anyszkiewicz J, Jadwiński M, Potempa M, Gawliczek M, Chmielarz A,
et al. Determination of Metals’ Content in Components Mounted on Printed Circuit Boards from End-of-Life Mobile Phones. Recycling. 2020; 5(3):20.
https://doi.org/10.3390/recycling5030020
Chicago/Turabian Style
Gorewoda, Tadeusz, Marcus Eschen, Jadwiga Charasińska, Magdalena Knapik, Sylwia Kozłowicz, Jacek Anyszkiewicz, Michał Jadwiński, Martyna Potempa, Marta Gawliczek, Andrzej Chmielarz,
and et al. 2020. "Determination of Metals’ Content in Components Mounted on Printed Circuit Boards from End-of-Life Mobile Phones" Recycling 5, no. 3: 20.
https://doi.org/10.3390/recycling5030020
APA Style
Gorewoda, T., Eschen, M., Charasińska, J., Knapik, M., Kozłowicz, S., Anyszkiewicz, J., Jadwiński, M., Potempa, M., Gawliczek, M., Chmielarz, A., & Kurylak, W.
(2020). Determination of Metals’ Content in Components Mounted on Printed Circuit Boards from End-of-Life Mobile Phones. Recycling, 5(3), 20.
https://doi.org/10.3390/recycling5030020
